DS56 Search Results

PH2401

Abstract: Bluetooth Module adc DS5630 MT1020A 16 bit linear PCM bluetooth transmitter circuit diagram
Contextual Info: MT1020A Bluetooth Baseband Controller Preliminary Information DS5630 Issue 1.8 November 2000 Features Ordering Information ● ● ● ● ● ● ● ● ● ● Bluetooth™ v1.0 Compliant Link Controller Full Bluetooth Protocol Stack up to HCI USB and UART Host Interfaces

DIM400GCM33-A000

Contextual Info: DIM400GCM33-A000 DIM400GCM33-A000 IGBT Chopper Module DS5613-1.1 June 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability KEY PARAMETERS VCES VCE sat *

DIM200WLS17-A000

Abstract: 12v AC to DC CIRCUIT DIAGRAM transistor 9009
Contextual Info: DIM200WLS17-A000 Chopper Module - Lower Arm Control DS5698-1.2 July 2007 LN25358 FEATURES Non Punch Through Silicon Isolated Copper Baseplate 10 s Short Circuit Withstand Lead Free construction KEY PARAMETERS VCES VCE (sat)* (typ) IC (max) IC(PK) (max) 1700V

Contextual Info: Low Cost Six-way SMT Power Divider, 824 - 960 MHz DS56-0001 V4 Features • • • • • • • SOW-16 Small Size, Low Profile Superior Repeatability Lot-to-lot Variation Industry Standard SOW-16 SMT Plastic Package Typical Isolation: 25 dB Typical Insertion Loss: 0.3 dB

Contextual Info: 2-1 TEL: 852-26909605 FAX: 852-26909606 E-mail: grandhalo@hutchcity.com b SMD TYPE LED DIGITAL DISPLAY 表面黏著型發光二極體數字顯示器 Rev: B Date: 2005-4-10 GH-DS56” Series Electro-Optical Characteristics: VF V Code for parts Lighting Material

Contextual Info: CLD-DS56 Rev 5 Product family data sheet ® Cree XLamp XP-E2 LEDs Product Description FEATURES Table of Contents The XLamp® XP-E2 LED builds on the • Available in white, outdoor Characteristics. 2 unprecedented performance of the

DS56-0004

Contextual Info: jtà i Preliminary Specifications M a n A M P <c o m p a n y Low Cost Six-Way Power Splitter/Combiner 2200 - 2500 MHz DS56-0004 V1.A Features SOW-16 Pin 16 • Small Size and Low Profile • Industry Standard SOW -16 SMT Plastic Package • Superior Repeatability

DIM400WHS12-A000

Contextual Info: DIM400WHS12-A000 Half Bridge IGBT Module DS5689-3.1 July 2007 LN25350 FEATURES Non Punch Through Silicon Isolated Copper Baseplate 10 s Short Circuit Withstand KEY PARAMETERS VCES VCE (sat) (typ) IC (max) IC(PK) (max) 1200V 2.2 V 400A 800A Lead Free construction

DIM200WKS17-A000

Abstract: transistor 9009
Contextual Info: DIM200WKS17-A000 Chopper Module - Upper Arm Control DS5699-1.2 July 2007 LN25361 FEATURES Non Punch Through Silicon Isolated Copper Baseplate 10 s Short Circuit Withstand Lead Free construction KEY PARAMETERS VCES VCE (sat)* (typ) IC (max) IC(PK) (max) 1700V

DIM400BSS12-A000

Contextual Info: DIM400BSS12-A000 Single Switch IGBT Module DS5672-4.1 June 2007 LN25349 FEATURES 10 s Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY PARAMETERS VCES VCE (sat) * (typ) IC (max) IC(PK) (max) 1200V 2.2 V 400A 800A *(Measured at the power bus-bars and not the auxiliary

DIM200PHM33-F000

Abstract: DIM200PHM33-F
Contextual Info: DIM200PHM33-F000 Half Bridge IGBT Module Replaces DS5606-4 DS5606-5 October 2011 LN28814 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)

the circuit diagram of pacemaker

Abstract: pacemaker ZL70010 DIODE T5 cardiac pacemaker
Contextual Info: ZL70002/08/09/10 Medical Surge Protection Devices Data Sheet Features • • • • • DS5666 Extremely fast turn-on Very small size and very low leakage 5, 6 and 7 terminals available Standard delivery form: solder bumped die Facilitates compliance with EN-45502 and EN50061

Contextual Info: DS56 P R E L IM IN A R Y DALLAS DS56 s e m ic o n d u c to r Dual Temperature Comparator FEATURES PIN ASSIGNMENT • Factory calibrated for sensitivity of + 6 .2 0 m V /°C and therm om eter accuracy of ± 2 .0 °C over the O 'C to 85 °C range and ±3 °C over th e 4 0 °C to 0 °C and + 8 5 °C to

transistor a 949

Contextual Info: DIM400BSS12-H000 DIM400BSS12-H000 Fast Single Switch IGBT Module Target Infomation DS5628-1.3 August 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ fsw for Applications > 20kHz ■ Isolated Copper Baseplate KEY PARAMETERS

transistor 600v 500a

Abstract: DIM500BSS06-S000
Contextual Info: DIM500BSS06-S000 DIM500BSS06-S000 Single Switch IGBT Module DS5677-1.4 April 2006 LN24534 FEATURES KEY PARAMETERS • n - Channel VCES ■ High Switching Speed VCE(sat)* (typ) ■ Low Forward Voltage Drop Isolated Base IC (max) 500A ■ IC(PK) (max) 1000A

Contextual Info: DIM200PHM33-F000 Half Bridge IGBT Module Replaces DS5606-4 DS5606-5 October 2011 LN28814 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)

Contextual Info: DS56 Linear ICs dc-to-dc/Charge Pump Voltage Converter status Military/High-RelN Output Voltage Nominal V 6.0 Load Current Max. (A)500m Drop-Out Volt Max. P(D) Max. (W)3.0 Nom. Supp (V)5 Minimum Operating Temp (øC)-55 Maximum Operating Temp (øC)100 Package StyleModule

Technical DS56

Abstract: DS56 JESD22 PH01 PM01 PR01
Contextual Info: Technical Datasheet DS56 power light source LUXEON Rebel Introduction LUXEON® Rebel is an ultra compact, surface mount, high power LED that delivers elevated standards for light output, flux density and manufacturability. Offering industry leading flux density, lumens per

so8 150 MIL

Contextual Info: DS56 Dual Temperature Comparator www.maxim-ic.com FEATURES § § § § § § § § Factory calibrated for sensitivity of +6.20 mV/°C and thermometer accuracy of ±2.0°C over the 0°C to 85°C range and ±3°C over the 40°C to 0°C and +85°C to +125°C range

Contextual Info: Low Cost Six-way Power Splitter/Combiner, 1700 - 2000 MHz Features • • • • • • DS56-0002 V1 SOW-16 Small Size, Low Profile Industry Standard SOW-16 SMT Plastic Package Superior Repeatability Insertion Loss: 1.1 dB Typical Isolation: 22 dB Typical

DFM1200FXS12-A000

Contextual Info: DFM1200FXS12-A000 Fast Recovery Diode Module DS5645-1.1 June 2007 LN25322 FEATURES • Low Reverse Recovery Charge • High Switching Speed • Low Forward Voltage Drop • Isolated Copper Base plate • Dual Diodes Can be paralleled for 2400A Rating •

DIM400WHS12-A000

Contextual Info: DIM400WHS12-A000 DIM400WHS12-A000 Half Bridge IGBT Module Replaces February 2004 version, issue DS5689-2.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5689-3.0 May 2004 KEY PARAMETERS VCES typ

DIM375WHS06-S000

Contextual Info: DIM375WHS06-S000 DIM375WHS06-S000 Half Bridge IGBT Module Replaces version December 2003, issue DS5675-2.2 FEATURES DS5675-3.3 February 2004 KEY PARAMETERS • Low Forward Voltage Drop VCES 600V ■ Isolated Copper Baseplate VCE sat * (typ) 2.1V IC (max) 375A

Contextual Info: Preliminary Specifications m an A M P com pany Low Cost Six-Way SMT Power Splitter/Combiner Features DS56 Series SOW-16 Small Size, Low Profile Industry Standard SOW-16 SMT Plastic Package Superior Repeatability Lot-to-lot Variation Typical Isolation: 22 dB