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Catalog Datasheet	Type	Document Tags	PDF
DIM200PHM33-F000 Abstract: DIM200PHM33-F Contextual Info: DIM200PHM33-F000 Half Bridge IGBT Module Replaces DS5606-4 DS5606-5 October 2011 LN28814 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)	Original	dim200phm33-f000 ds5606-4 ds5606-5 ln28814 +1dim200phm33-f	PDF
Contextual Info: DIM200PHM33-F000 Half Bridge IGBT Module Replaces DS5606-4 DS5606-5 October 2011 LN28814 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)	Original	dim200phm33-f000 ds5606-4 ds5606-5 ln28814	PDF

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DIM200PHM33-F000

Abstract: DIM200PHM33-F
Contextual Info: DIM200PHM33-F000 Half Bridge IGBT Module Replaces DS5606-4 DS5606-5 October 2011 LN28814 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)

Original

dim200phm33-f000 ds5606-4 ds5606-5 ln28814 +1

PDF

Contextual Info: DIM200PHM33-F000 Half Bridge IGBT Module Replaces DS5606-4 DS5606-5 October 2011 LN28814 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)

Original

dim200phm33-f000 ds5606-4 ds5606-5 ln28814

PDF