STANDARD WAFER EVAL Search Results

Standard Wafer Eval

Abstract: Mil-Std-105D MIL-STD-105-D MIL-STD105D GaAs wafer
Contextual Info: PERFORMANCE GRADING AND SCREENING OPTIONS FOR MwT GaAs FETS LEGEND Wafer Evaluation Die Optional Standard Wafer Evaluation Evaluation Sample RF & DC Audit 40 Dice Min. MwT-2M0903 Process Wafer Stabilization Bake 300°C for 5 hours 100% DC Probe Scribe and Break

Ablebond 84-1*SR4

Abstract: z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4
Contextual Info: Reliability Summary Report PI6CV857A August 28, 2002 Reliability by Design Page 1 of 20 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:

TSMC 0.35um

Abstract: ED-4701-3-B122A tsmc 0.35 um CMOS gate area PBGA 256 reflow profile Volt, SPDM, CMOS ED-4701-1-C111A ISO-9000 PI7C7300 PI7C8150-33 PI7C8152
Contextual Info: Reliability Summary Report PCI Bridge Products March 20, 2003 Updated Total Life Test Hours Reliability by Design Page 1 of 16 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:

MULTIGIG RT2 CONNECTOR

Abstract: 1410189-1 1410187-3 1-1469491-X 1-1469492-x 1410140-1 1410190-3 3U VPX 114-13056 vita
Contextual Info: MULTIGIG RT Connector Products for VITA 46 VPX Standard DESCRIPTION • Customizable impedance matched printed circuit wafer interface Tyco Electronics’ MULTIGIG RT product is a backplane interconnect family that offers levels of flexibility and customization. This

hf2c

Abstract: TS934 m1 sot23 TS931 TS932 TS93X TSSOP14 transistor st 932
Contextual Info: Q093XC1 ST Microelectronics GRENOBLE PLANT Standard Linear ICs, DSG SHORT QUALIFICATION REPORT LINE : 093X PRODUCT NAME : TS93X LINE DESCRIPTION : MICROPOWER OPERATIONAL AMPLIFIER WAFER CODE : 093XAAH PACKAGES : TS931 : SO8 / SOT23-5 TS932 : SO8 / DIP8 TS934 : SO14 / DIP14 / TSSOP14

PVAPOX

Abstract: C0942 HFMS510 P100 TS944 TS94X DSA008446 OUTPUT RAIL TO RAIL OPERATIONAL AMPLIFIER SOT23 wafer code ST MICROELECTRONICS SO14
Contextual Info: Q094XS1 ST Microelectronics GRENOBLE PLANT Standard Linear ICs, DSG SHORT QUALIFICATION REPORT LINE : 094X PRODUCT NAME : TS94X LINE DESCRIPTION : OUTPUT RAIL TO RAIL BiCMOS µPOWER OPAMP WAFER CODE : C0941AAH/C0942AAZ/C0944AAH PACKAGES : SOT23/SO8/SO14/TSSOP14/DIP8/DIP14

C1871A

Abstract: PVAPOX TS1872 hf2c 1871A m1 sot23 TS1874 TS1871 DSA008447
Contextual Info: Q187XS1 GRENOBLE PLANT Standard Linear ICs, DSG SHORT QUALIFICATION REPORT LINE : 187X PRODUCT NAME : TS1871/ TS1872/ TS1874 LINE DESCRIPTION : LOW POWER RAIL TO RAIL OPERATIONAL AMPLIFIER WAFER CODE : C1871AAH/ C1872AAH/ C1874AAH PACKAGE : SOT23-5 / SO8 & 14 / TSSOP8 & 14 / DIP8 & 14

hf2c

Abstract: m1 sot23 TS1851 TS1852 TS1854 Amplifier sot23-5 14 c1852a ST microelectronic EPI WAFER
Contextual Info: Q185XS1 ST Microelectronics GRENOBLE PLANT Standard Linear ICs, DSG SHORT QUALIFICATION REPORT LINE : 185X PRODUCT NAME : TS1851/ TS1852/ TS1854 LINE DESCRIPTION : LOW POWER RAIL TO RAIL OPERATIONAL AMPLIFIER WAFER CODE : C1851AAH / C1852AAH / C1854AAH PACKAGE : SOT23-5 / SO8 & 14 / TSSOP8 & 14 / DIP8 & 14

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • Three levels of early mate, late break EMLB sequencing or selective loading options • Footprint compatible with standard Futurebus+ • Solder tail with true-position wafer

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • Three levels of early mate, late break EMLB sequencing or selective loading options • Footprint compatible with standard Futurebus+ • Solder tail with true-position wafer

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • • • • • • • • Three levels of early mate, late break EMLB sequencing or selective loading options Footprint compatible with standard Futurebus+ Solder tail with true-position wafer

TG30

Abstract: TR30 TS-1122
Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • • • • • • • • Three levels of early mate, late break EMLB sequencing or selective loading options Footprint compatible with standard Futurebus+ Solder tail with true-position wafer

5007

Abstract: CLASS s
Contextual Info: Space Level Class S Product Screening Space Level (Class S) MMIC Die Screening & Qualifi cation Hittite Microwave offers Class S element evaluation in accordance with MIL-PRF-38534 on standard & custom product die. We are qualified by major spacecraft OEMs

AD8561

Abstract: Precision Monolithics, Inc Precision Monolithics REF05 DAC-08 ad589ad MAT03 op REF01 AD8041 ADG201
Contextual Info: ANALOG DEVICES, INC. AEROSPACE DICE Page 1 of 4 AEROSPACE PRODUCT LINE 9-Jan-06 a Analog Devices Aerospace Dice With Element Evaluation Per MIL-PRF-38534 January 2006 Factory Contacts: Bob Barfield 336 605-4063, bob.barfield@analog.com Chris Leonard (336) 605-4385, chris.leonard@analog.com

E2205

Abstract: GaAs fet application note E2183-3 e2183 E2342 E2180
Contextual Info: iSifLkLä. M ic r o 4268 Solar Way Fremont, CA 94538 510 651-6700 FAX (510) 651-2208 Wa v e Te c h n o l o g y GaAs FET APPLICATION NOTE Evaluation of The Effects of Hydrogen on MWT's FETs June 10, 1996 REV A BACKGROUND A number of articles M[2] both in the literature and reported at conferences^3]'[4] have

ISO STANDARDS SHEET METAL THINNING

Abstract: TRANSISTOR SUBSTITUTION 1993 MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR SGS-Thomson zener smd eurotherm ST marking code crolles eurotherm 451 ALL TYPE IC DATA AND manual substitution BOOK IEC 68-2-27 spectrometer U.S.A Eurotherm Controls
Contextual Info: SURE 7 Semiconductor Users Reliability Evaluation Quality and Reliability Program Published by SGS-THOMSON Quality and Reliability Management “YOU HAVE MY WORD ON IT” As I noted in SURE 6, service is the number one strategic priority at SGS-THOMSON. We consider service as a

SW-279

Abstract: AT-220 MIL-STD-83 die design M526
Contextual Info: High-Volume Commercial Plastic Packaged GaAs Monolithic Devices Abstract In developing a new product line of high volume commercial plastic packaged GaAs monolithic devices, it has become evident that normal design, fabrication, and evaluation techniques no longer apply. Today’s customer

TI Wafermap format

Abstract: barcode reader circuit laser barcode reader circuit
Contextual Info: Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU047 11-09-21-064 Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU047 (11-09-21-064) October 2007

TI Wafermap format

Abstract: laser barcode reader circuit tiris antenna TI Assembly Factory Code wafer map ISO15693 tiris rfid 15693 FSK RF-HDT-SJLE 0013e0
Contextual Info: Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU047 11-09-21-064 Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU047 (11-09-21-064) October 2007

ESM-2645

Abstract: ESM-2440 ESM-2640 EEV-EX01 Hirose FX8-100S-SV ESM-2643 2.54mm Header 3 Pin lcd tv service manual circuits CONNECTOR 5 PIN pitch 2.54mm rs232 db15 pin male to db9 pin female
Contextual Info: EEV-EX01 SOM-ETX Evaluation Carrier Board Quick Installation Guide 3rd Ed – 27 March 2006 Part No. 2017EX0102R EEV-EX01 FCC Statement THIS DEVICE COMPLIES WITH PART 15 FCC RULES. OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS: 1 THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE.

Contextual Info: ERmet ZD High Speed Differential Hard Metric Connector System Application Tooling, Equipment and Testing Evaluation Kits The two evaluation kits, singleline version and multiline version, are developed to measure the signal integrity behavior of the advanced differential pair connector system ERmet ZD.

c 3421 transistor

Abstract: 010-0041 IC350 power IGBT HTGB MSAGA11F120D
Contextual Info: MSAGA11F120D WAFER LOT EVALUATION INTERNAL PROCESS SPECIFICATION IPS REV. 0, Approval _N/C_ QC LOT#:_ LOT DATE CODE:_ QUANTITY ISSUED:_ QUANTITY REQUIRED:_ SUMMARY MICROSEMI MSAGA11F120D data sheet REVISION:

54ALS374

Abstract: 54HCT374 54AC00 seu boron rods 54AC04 seu 54AC374 p-channel mosfet 9240 54AC00 54ALS374/BRAJC 54AC04
Contextual Info: National Semiconductor Application Note 925 M C Maher January 1994 ABSTRACT Radiation test data is presented for different radiation environment as performed on National Semiconductor’s FACTTM Advanced CMOS microcircuit family Over twenty device types have been evaluated by independent investigators users and by National

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v02.0106 MILITARY & SPACE MILITARY & SPACE PRODUCTS Space Level Class S MMIC Die Screening & Qualification