SOT59 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA100 package SOT598-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C T e R P N M L K J e2 H G 1/2 e F E D C B A 1 shape optional 4x

TFBGA100

Abstract: MO-216
Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm D SOT598-1 A B ball A1 index area A2 A E A1 detail X C e1 e 1/2 e ∅v M C A B b y1 C y ∅w M C K J e H G F e2

Contextual Info: Package outline CWQCCN32: ceramic window quad chip carrier; no leads; 32 terminals; body 10.67 x 10.67 x 2.23 mm D SOT594-1 B D1 A A E1 E A2 A1 detail X C e1 y1 C ∅v M C A B b e y ∅w M C 5 12 b1 4 13 e 1 e1 32 29 20 28 21 X 5 10 mm scale DIMENSIONS mm are the original dimensions

D213

Abstract: HSOP24
Contextual Info: PDF: 2003 Jul 23 Philips Semiconductors Package outline HSOP24: plastic, heatsink small outline package; 24 leads SOT592-1 E D A E2 X HE v M A c y D1 D2 13 24 Q A2 E1 A A3 A1 A4 pin 1 index θ Lp detail X 1 12 Z w M bp e 5 10 mm scale DIMENSIONS (mm are the original dimensions)

MS009

Abstract: MS-009
Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline CWQCCN32: ceramic window quad chip carrier; no leads; 32 terminals; body 10.67 x 10.67 x 2.23 mm D SOT594-1 B D1 A A A2 E1 E A1 detail X C e1 ∅v M C A B b e y1 C y ∅w M C 5 12 b1 4 13 e 1 e1 32 29

b0239c

Abstract: diode GG 66 diode 2U 66 MEAB to-53 2U 39 diode
Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 2N5000 2N5150 2N5602 2N5154 2N6717 92GU06 92PU06 B0379-16 ~~~~~ 30 SOT5513 SOT5513 SOT5913 B0379-25 2SC3474 2S01914 2S01981 SK3512 - :g~~:~ - 25 35 -40 45 -50 RCA1A03 S2N4863-2 S2N4863-3 SMl5509 SMl5514

TFBGA132

Abstract: sot599
Contextual Info: PDF: 2000 Mar 08 Philips Semiconductors Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A P N M e L

Contextual Info: Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A A2 E A1 detail X C e1 e y1 C ∅v M C A B b 1/2 e y ∅w M C P N M L K J H G F E D C B A e e2 1/2 e ball A1 index area

Contextual Info: Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls body; 12 x 12 x 0.8 mm A B D SOT599-2 ball A1 index area E A A2 A1 detail X C e1 e 1/2 e ∅v ∅w b M M y y1 C C A B C P N M L K J H G F E D C B A ball A1 index area e e2

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA208 package SOT595-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

TFBGA132

Contextual Info: PDF: 2003 Jul 17 Philips Semiconductors Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 e 1/2 e ball A1 index area P N M L K J H G F

b0349

Abstract: B0817 1/transistor b0349 to-53 2N3577 blx10 diode 300U 2S078 B0379 b0371
Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 SOT5512 SOT5512 SOT5912 B0377-25 2S01083 2S0975 B0321 B0321 ~g~~~ 25 30 2S01779 2N3138 2N3140 2N3142 2N3144 BOY11 BOY11 2S012A ~~~1~8U 35 40 BSS15 2N5320 NS06178 2N6179 S2N4150 S2N4150-1 BOB29-10 BOB29-6

sot590

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA656: plastic ball grid array package; 656 balls; body 40 x 40 x 2.15 mm SOT590-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X e1 AJ AG AE AC AA W U R N L J G E C A v M B b e y ∅w M v M A AK

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA96 package SOT597-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm D SOT598-1 A B ball A1 index area A E A2 A1 detail X C e1 e 1/2 e y1 C ∅v M C A B b y ∅w M C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2

Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 e 1/2 e P N M L K J H G F E D C B A shape optional 4x

TFBGA96

Abstract: MO-195
Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A A2 E A1 detail X C e1 e ∅v M C A B b 1/2 e y1 C y ∅w M C P N M L K J H G

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm D SOT598-1 A B ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M y y1 C v M A K J e H G F e1 E D C B

TFBGA96

Abstract: sot597
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M P N M L K J H G F E D C B A y y1 C v M A

bga208

Abstract: sot595 package outline bga208
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.20 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X k k e1 b e C v M B ∅w M y y1 C v M A T R e P N M L K J e1 H G F

HSOP24

Abstract: sot592
Contextual Info: PDF: 2000 Mar 24 Philips Semiconductors Package outline HSOP24: plastic, heatsink small outline package; 24 leads SOT592-1 E D A E2 X HE v M A c y D1 D2 13 24 Q A2 E1 A A3 A1 A4 pin 1 index θ Lp detail X 1 12 Z w M bp e 5 10 mm scale DIMENSIONS (mm are the original dimensions)

TFBGA96

Abstract: MO-195
Contextual Info: PDF: 2000 Nov 21 Philips Semiconductors Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M P N M L K J H G F E D C B A y y1 C v M A

Contextual Info: Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 e 1/2 e P N M L K J H G F E D C B A ball A1 index area shape optional 4x y1 C ∅v M C A B