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    SOT59 Search Results

    SOT59 Datasheets (9)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT594-1 NXP Semiconductors Ceramic window quad chip carrier; no leads; 32 terminals;body 10.67 x 10.67 x 2.23 mm Original PDF
    SOT595-1 NXP Semiconductors Plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm Original PDF
    SOT595-1 NXP Semiconductors Footprint for reflow soldering SOT595-1 Original PDF
    SOT597-1 NXP Semiconductors Footprint for reflow soldering SOT597-1 Original PDF
    SOT597-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm Original PDF
    SOT598-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm Original PDF
    SOT598-1 NXP Semiconductors Footprint for reflow soldering SOT598-1 Original PDF
    SOT599-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm Original PDF
    SOT599-2 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm Original PDF