SOT594-1 |
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NXP Semiconductors
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Ceramic window quad chip carrier; no leads; 32 terminals;body 10.67 x 10.67 x 2.23 mm |
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Original |
PDF
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SOT595-1 |
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NXP Semiconductors
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Plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm |
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Original |
PDF
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SOT595-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT595-1 |
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Original |
PDF
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SOT597-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT597-1 |
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Original |
PDF
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SOT597-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm |
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Original |
PDF
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SOT598-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm |
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Original |
PDF
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SOT598-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT598-1 |
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Original |
PDF
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SOT599-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm |
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Original |
PDF
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SOT599-2 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm |
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Original |
PDF
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