TFBGA96 Search Results

07d7

Contextual Info: P-TFBGA96-0707-0.65A4

74HCXXX

Abstract: 74HCxx TSSOP48 CMOS4000 STMicroelectronics package outline dip 74LX1G M013TR M74HCXXXM1R TC74HCTXXXAP SN74ACTXXXPW
Contextual Info: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Cross reference guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm)

Contextual Info: Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A A2 E A1 detail X C e1 e y1 C ∅v M C A B b 1/2 e y ∅w M C P N M L K J H G F E D C B A e e2 1/2 e ball A1 index area

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA96 package SOT597-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

TFBGA96

Abstract: MO-195
Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A A2 E A1 detail X C e1 e ∅v M C A B b 1/2 e y1 C y ∅w M C P N M L K J H G

TFBGA96

Abstract: sot597
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M P N M L K J H G F E D C B A y y1 C v M A

TFBGA96

Abstract: MO-195
Contextual Info: PDF: 2000 Nov 21 Philips Semiconductors Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M P N M L K J H G F E D C B A y y1 C v M A

4001 4011 cmos

Abstract: 4049 DIP14 4013 datasheet hct lcx 574 CMOS 4541 str 4512 C3245 4017 14 pin package CMOS4000 hcf 4541 be
Contextual Info: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Selection guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm) SO-8, TFBGA42

Contextual Info: Uniti nn P—TFBGA96—0707—0.65A4 p /n r n z i W im !►— m § § o 10. 651 0. 575±0. 03 •4- oo oo oo oo oo pb ooooooooooooopoooo oo oo oo oo o_i_b oo oo oo oo oOOOO o o o 'T OiO'oo oooooo o o o o o lo o o o o OOOOOpOOOO oooooooooo

lcx 574

Abstract: STR 4512 HC 4093 4001 4011 cmos HC 40106 4017 14 pin package 4011 cmos logic gate HC 4011 logic gate hcf 4541 equivalent hct 4049
Contextual Info: Standard Logic ICs Selection guide August 2007 www.st.com/logic Family selector HCT 0 to VCC 4 12 4.5 to 5.5 0 to VCC 4 12 AC 2 to 6 0 to VCC 24 4 ACT 4.5 to 5.5 0 to VCC 24 4 VHC 2 to 5.5 0 to 5.5 8 4 VHCT 4.5 to 5.5 0 to 5.5 8 4 V1G 2 to 5.5 0 to 5.5 8 4