TSSOP16 Search Results

Contextual Info: M74HC4094 8-bit SIPO shift latch register 3-state Datasheet - production data Applications • Automotive • Industrial • Computer SO16 TSSOP16 • Consumer Description Features • High speed: fMAX = 80 MHz (typ.) at VCC = 6 V • Low power dissipation:

TSSOP16 datasheet

Abstract: TSSOP16
Contextual Info: PACKAGE OUTLINE DRAWING TSSOP16 MF-PO-D-0026 revision 0.0 TM Monolithic Power Systems TM 0.004 0.090 0.0256(0.650) TYP 0.010(0.250) GATE PLANE 0.004(0.090) 0o-8o 0.169(4.300) 0.177(4.500) Pin 1 IDENT. 0.244(6.200) 0.260(6.600) 0.018(0.450) 0.030(0.750) DETAIL "A"

tssop16

Abstract: TSSOP-16
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP16, 4.4x5 CASE 948AN−01 ISSUE O DATE 19 DEC 2008 b SYMBOL MIN NOM A E1 E MAX 1.10 A1 0.05 0.15 A2 0.85 0.95 b 0.19 0.30 c 0.13 0.20 D 4.90 5.10 E 6.30 6.50 E1 4.30 4.50 0.65 BSC e L 1.00 REF L1 0.45 0.75 θ

TSSOP16

Abstract: TSSOP16 datasheet sot223 transistor SOT23 sot89 To92 transistor TSSOP-16 SOP8 Package SSOT24
Contextual Info: Package Power Dissipation Power Dissipation: Pd（mW） Package Power Dissipation vs. Ambient Temperature Ambient Temperature: Ta（℃） USP6B/C SOT23/25/26/26W, SSOT24, MSOP8A/10 SOP8, TO92, SOT223 TSSOP16 SOT89/89-5 SOT23/25/26 When mounted on PCB TSSOP16 (When mounted on PCB)

Contextual Info: Reliability Tests Report Product Name: TC74VHC139FT Package Name: TSSOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: M74HC365 Hex bus buffer with 3-state outputs non-inverting Datasheet - production data • Pin and function compatible with 74 series 365 SO16 TSSOP16 • ESD performance – HBM: 2 kV – MM: 200 V – CDM: 1 kV Description The M74HC365 is an advanced high-speed

Contextual Info: Reliability Tests Report Product Name: TC74VHC257FT Package Name: TSSOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC138FT Package Name: TSSOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC175FT Package Name: TSSOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC221AFT Package Name: TSSOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC4052AFT Package Name: TSSOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74LCX138FT Package Name: TSSOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

pin diagram of ic 8088

Abstract: fujitsu rf power amplifier 49 Fujitsu SAW FUJITSU saw filter
Contextual Info: Preliminary Information PCS CDMA Upconverter / Driver 1710-1910 MHz MD59-0022 V1.00 Features passivation for increased performance and reliability. • • • • TSSOP16 Highly Integrated Upconverter / Driver IC Operates Over 2.7 V to 5 V Supply Voltage

TSSOP16

Contextual Info: Philips Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm 1.25 ±0.15 1.15 0.32 0.17 0.25 0.10 5.3 4.9 4.6 4.2 0.7 0.3 0.12 0.475 max 10° 0°

Contextual Info: PTC04-TestBench-90316 Socket utility to connect to PTC-programmer Features and Benefits Utility to make first magnetic evaluations 90316 SO8, TSSOP16 90324 SO8, TSSOP16 90333 SO8, TSSOP16 90360 SO8 Easy to modify or make own socket board Applications Additional utility for PTC04 in order to easy connect devices

HWS412

Abstract: TSSOP16 TSSOP-16 0930g
Contextual Info: HWS412 February 2004 Features V2 TSSOP-16 • Four Inputs, Two Outputs Switch Matrix • High Isolation • Low DC Power Consumption • Small TSSOP16 Plastic Package • PHEMT process Description The HWS412 is a GaAs PHEMT 4x2 switch matrix operating at 0.9-3.0GHz in a low cost TSSOP16

land pattern for TSSOP16

Abstract: TSSOP16 TSSOP16 datasheet TSSOP16 Package TSSOP16 LAND PATTERN
Contextual Info: 16-Pin Thin Shrink Small Outline Package TSSOP16 Package Outline Dimensions Outline Dimensions Unit: mm 16 0.25 +0.03 0.15 -0.01 6.4 ±0.2 4.4 ±0.1 9 0 ～10゜ 1 8 0.22 +0.09 –0.06 0.225 typ. 0.5 0.45 ～ 0.75 0.13 M 0.65 5.4 max 0.1 S Land Pattern Example

TSSOP16

Abstract: 4465a TSSOP16 datasheet
Contextual Info: Thin Shrink Small Outline Package 16pin TSSOP16 パッケージ 外形図 パッケージ形状および寸法 単位 : mm 16 0.25 +0.03 0.15 -0.01 6.4 ±0.2 4.4 ±0.1 9 0 ～10゜ 1 8 0.22 +0.09 –0.06 0.225 typ. 0.5 0.45 ～ 0.75 0.13 M 0.65 5.4 max

TVSOP-56

Abstract: TVSOP-48
Contextual Info: là PER ¡COM Package Cross Reference Guide Package Type TSSOP-48 TSSOP-56 BQSOP-40 BQSOP-48 BQSOP- O SSOP-14 SSOP-16 SSOP-20 SSOP-24 8 SSOP-28 TVSOP-48 TVSOP-56 TSSOP-8 TSSOP-14 TSSOP16 TSSOP 20 TSSOP 24 TSSOP 28 PDIP-8 PDIP-14 PDIP-16 PDIP-20 PDIP-24 PDIP-28

TSSOP16

Contextual Info: Millimeters Inches OUTLINE AND MECHANICAL DATA Dim. A Max. Min. Typ. 1.20 0.15 0.01 A2 0.80 1.05 0.031 b 0.15 0.30 0.005 0.15 c 0.1 0.20 0.003 0.012 D 4.90 5.10 0.192 E 5.00 0.039 0.196 6.40 4.30 0.252 4.50 0.169 0.173 0.65 0.60 8o 0.75 0.09 TSSOP16 0.0236 0.030

74HCXXX

Abstract: 74HCxx TSSOP48 CMOS4000 STMicroelectronics package outline dip 74LX1G M013TR M74HCXXXM1R TC74HCTXXXAP SN74ACTXXXPW
Contextual Info: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Cross reference guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm)

Contextual Info: TS SO P1 6 SOT403-1 TSSOP16; Reel pack; SMD, 13", Turned Q2/T3 Standard product orientation Orderable part number ending ,128 or HP Ordering code 12NC ending 128 Rev. 1 — 25 April 2013 Packing information 1. Packing method Printed plano box Barcode label

Contextual Info: M74HC4094 8-bit SIPO shift latch register 3-state Datasheet - production data Applications • Automotive • Industrial • Computer SO16 DIP16 TSSOP16 • Consumer Description Features • High speed: fMAX = 80 MHz (typ.) at VCC = 6 V • Low power dissipation:

836BH-0268

Abstract: SSOP12 TK14584M TK14588V TSSOP16 EF12k
Contextual Info: TK14584M/TK14588V APPLICATION MANUAL TK14584M/TK14588V Features Very Small Package TK14584M : SSOP12 (TK14588V : TSSOP16) Input Frequency ~22M H z Low Voltage Operation. 2.3~ 5 .5 V Battery Save Function. Wide Band Demodulator —1MHz High Speed Data Comparator (TK14588V : ~2M bps)