SOT597 Search Results

Contextual Info: Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A A2 E A1 detail X C e1 e y1 C ∅v M C A B b 1/2 e y ∅w M C P N M L K J H G F E D C B A e e2 1/2 e ball A1 index area

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA96 package SOT597-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

TFBGA96

Abstract: MO-195
Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A A2 E A1 detail X C e1 e ∅v M C A B b 1/2 e y1 C y ∅w M C P N M L K J H G

TFBGA96

Abstract: sot597
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M P N M L K J H G F E D C B A y y1 C v M A

TFBGA96

Abstract: MO-195
Contextual Info: PDF: 2000 Nov 21 Philips Semiconductors Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M P N M L K J H G F E D C B A y y1 C v M A