SOT557 Search Results

SOT557

Abstract: TFBGA80
Contextual Info: PDF: 2000 Oct 30 Philips Semiconductors Package outline TFBGA80: plastic thin fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.8 mm D SOT557-1 A B ball A1 index area A E A2 A1 detail X C e1 v M B b e y y1 C ∅w M v M A M L K e J H G e1 F E D C

TFBGA80

Abstract: sot557 TFBGA-80
Contextual Info: PDF: 2000 Feb 02 Philips Semiconductors Package outline TFBGA80: plastic thin fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.8 mm SOT557-1 D ball A1 index area A2 A E A1 detail X A b e ∅w M ZD y v A ZE M L K J H e G F E D C B A 1 2 3 4 5 6

Contextual Info: PDF: 1999 Jun 08 Philips Semiconductors Package outline TFBGA80: plastic thin fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.8 mm SOT557-1 D ball A1 index area A2 A E A1 detail X A b e ∅w M ZD y v A ZE M L K J H e G F E D C B A 1 2 3 4 5 6

handbook philips ic26 packaging

Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors