SOT10 Search Results

Contextual Info: N3 PTVSxU1UPA series HU SO 300 W Transient Voltage Suppressor Rev. 1 — 6 March 2014 Product data sheet 1. Product profile 1.1 General description 300 W unidirectional Transient Voltage Suppressor TVS in a DFN2020-3 (SOT1061) leadless medium power Surface-Mounted Device (SMD) plastic package, designed for

SOT539A

Abstract: SOT975B SOT540A SOT538A sot538b sot988 SOT608B
Contextual Info: Air-cavity plastic packages SOT987B SOT895A Bias/temperature sensing SOT981A SOT988B SOT896B Bias/temperature sensing SOT986B Push-pull configuration SOT982A MMIC configuration SOT980A SOT1015BG Bias/temperature sensing Increase the flexibility of application-specific design by using LDMOS RF power

2322-712

Abstract: BFG134 LC 3524 philips resistor 2322 763 2222 372 TAG 453 665 800 2222 379 2322 712 fr 253/30 r h a 431 transistor
Contextual Info: Product specification Philips Semiconductors T ^ 3 3 -a s NPN 7 GHz wideband transistor PHILIPS INTERNATIONAL DESCRIPTION BFG134 VllOBSb □04S20l4 4ôb M P H I N 5bE D PINNING NPN planar epitaxial transistor in a 4-lead double-emitter plastic SOT103 envelope, intended for

BFG34

Abstract: ON4497 TRANSISTOR 185 846 TRANSISTOR 726
Contextual Info: Philips Semiconductors Product specification -P .3 NPN 4 GHz wideband transistor PHILIPS INTERNATIONAL DESCRIPTION 3 - 0 S S ShE BFG34 TllDflEfci DDMSGSb T15 • PHIN PINNING NPN transistor in a four-lead dual-emitter plastic SOT103 envelope. It is designed for wideband

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XSON10U package SOT1081-1 Hx C Hy Ay By 0.05 D P 0.05 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: SOT1049-3 XQFN10 U ; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering code (12NC) ending 115 Rev. 1 — 23 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: SOT1081-1 Product orientation 12NC ending 115 Rev. 02 — 27 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT1081-1 115 180 x 8

Contextual Info: 16 SO SOT109-1 SO16; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 4 — 24 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXQFN16 package SOT1039-2 4.250 3.300 pa + oa 2.000 1.500 0.500 0.500 0.240 0.500 4.250 3.300 2.000 pa + oa 0.0125 0.240 0.0125 0.350 1.500 0.800 1.800 2.300 4.000 0.500 0.800 0.350 1.500

Contextual Info: Reflow soldering footprint 3.250 2.300 pa + oa 2.000 0.500 0.500 0.250 0.0125 0.0125 2.850 1.900 pa + oa 0.800 2.600 1.100 3.000 www.nxp.com 2009 NXP B.V. solder lands placement area solder paste occupied area Dimensions in mm sot1049-1_fr All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA169 package SOT1024-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT1073-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

HVSON14

Contextual Info: PC board footprint NXP Semiconductors Footprint for reflow soldering of HVSON14 package SOT1054-1 4.200 pa + oa 3.500 0.500 oa 0.500 4.150 1.800 1.500 sr 0.800 0.250 2.350 3.200 3.900 pa + oa 0.500 0.800 2.100 3.200 sr 0.0150 3.500 solder land + solder paste

Contextual Info: PBSS4330PA 30 V, 3 A NPN low VCEsat BISS transistor Rev. 01 — 19 April 2010 Product data sheet 1. Product profile 1.1 General description NPN low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with

PMEG2020EPA

Contextual Info: PMEG2020EPA 2 A low VF MEGA Schottky barrier rectifier Rev. 01 — 27 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application MEGA Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOT1061 leadless small

transistor smd marking AJ

Abstract: smd code marking ID smd transistor marking AJ TRANSISTOR SMD MARKING CODE AJ
Contextual Info: PBSS5330PA 30 V, 3 A PNP low VCEsat BISS transistor Rev. 01 — 19 April 2010 Product data sheet 1. Product profile 1.1 General description PNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with

IP4282CZ6

Abstract: "ESD Protection" IP4221CZ6-S IP4283CZ10 IP4280CZ10 IP4281CZ10 SOT1059
Contextual Info: NXP high-speed ESD protection in ultra-thin leadless packages IP4221/42 < 1.0 pF and IP4281/2/3 (< 0.7 pF) Bring ESD protection closer to the data lines These integrated ESD protection devices, housed in leadless SOT886 and SOT1059 packages, simplify circuit design, reduce routing design times, and cut pick-and-place costs. They’re cost

smd code A9 3 pin transistor

Abstract: smd transistor a9 NXP SMD TRANSISTOR MARKING CODE PBSS5612PA
Contextual Info: PBSS5612PA 12 V, 6 A PNP low VCEsat BISS transistor Rev. 01 — 7 May 2010 Product data sheet 1. Product profile 1.1 General description PNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with

Contextual Info: Package outline LFBGA141: plastic low profile fine-pitch ball grid array package; 141 balls A B D SOT1079-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b M M C C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11

Contextual Info: Package outline LFBGA169: plastic low profile fine-pitch ball grid array package; 169 balls B D SOT1024-1 A ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w b N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9 10 11 12 13

Contextual Info: Package outline VFBGA144: plastic very thin fine-pitch ball grid array package; 144 balls A B D SOT1078-1 ball A1 index area E A A2 A1 detail X e1 1/2 e e ∅v ∅w b M M C C A B C y y1 C M L K J e H G e2 F E 1/2 e D C B A ball A1 index area 1 2 3 4 5 7 6

Contextual Info: Package outline HVQFN25: plastic thermal enhanced very thin quad flat package; no leads; 25 terminals; body 5 x 5 x 0.85 mm A B D SOT1003-1 terminal 1 index area E A A1 c detail X e1 C e L1 v w b 8 14 C A B C M M y1 C y L 7 15 e e2 Eh 18 1 terminal 1 index area

HVQFN36

Contextual Info: Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads 36 terminals; body 6 x 6 x 0.85 mm SOT1092-1 B D D1 A terminal 1 index area E1 E A A4 A1 c detail X e1 e 10 18 C C A B C v w b y y1 C L 19 9 e e2 Eh 1 terminal 1 index area

Contextual Info: Package outline HUQFN24U: plastic thermal enhanced ultra thin quad flat package; no leads; 24 terminals; UTLP based; body 3 x 3 x 0.55 mm A B D SOT1080-1 terminal 1 index area E A A1 detail X e1 v w C A B C M M v w b M M C A B C C D2 y y1 C e L1 A6 D3 A10