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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XSON10U package SOT1081-1 Hx C Hy Ay By 0.05 D P 0.05 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Contextual Info: Package outline XSON10U: plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm SOT1059-1 B D A E A A1 terminal 1 index area detail X e1 e L1 v w b 1 5 M M C C A B C y1 C y L2 e2 L 10 6 X 0.5 1 mm scale DIMENSIONS mm are the original dimensions
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Contextual Info: Package outline XSON10U: plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 1.7 x 0.5 mm A B D SOT1081-1 E A A1 terminal 1 index area detail X e1 C e L1 v w b 1 5 C A B C M M y1 C y L2 e2 L 10 6 0.5 1 mm scale DIMENSIONS mm are the original dimensions
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prtr5v0u6s
Abstract: csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY
Contextual Info: Dark Green − NXP‘s transfer to halogen-free products Why Dark Green? We as NXP are deeply committed to developing eco-friendly products and integrating environmental safety aspects in all manufacturing processes. For our packaging technology this meant a shift to lead-free and halogen-free “Dark Green”, years
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2002/95/ecpmbta42pmeg3005elpmeg6010ep+16pmr780snptvs12vs1urpzu13ypmbta42dspmeg3005etpmeg6010erprtr5v0u6scsp1040tssop20 footprintip4065cx11smd transistor gy sot89ip4065cx11/lfbv 9y transistor smdip4058cx8/lfip4280cz10smd transistor gy
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IP4283CZ10
Abstract: TSSOP10 XSON10U IP4220CZ6 SOT1059-1 sot552-1
Contextual Info: IP4283CZ10 series ESD protection for ultra high-speed interfaces Rev. 2 — 27 August 2010 Product data sheet 1. Product profile 1.1 General description The devices are designed to protect high-speed interfaces such as High-Definition Multimedia Interface HDMI , DisplayPort, external Serial Advanced Technology
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land pattern for sot109-1
Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
Contextual Info: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products
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do-35do-41do-34od80c+6od123fhxson12ot983land pattern for sot109-1tssop-8 footprint and soldering sot-23sod87 footprint
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IP4284CZ10-TB
Abstract: SOT1059-1 XSON10 IP4284CZ10 NXP XSON10U SCC21 IP4220CZ6 TSSOP10 XSON10U ip4220
Contextual Info: IP4284CZ10-TB; IP4284CZ10-TT ESD protection for ultra high-speed interfaces Rev. 02 — 1 April 2010 Product data sheet 1. Product profile 1.1 General description The devices are designed to protect high-speed interfaces such as High-Definition Multimedia Interface HDMI , DisplayPort, SuperSpeed USB, external Serial Advanced
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IP4220CZ10
Abstract: IP4220 SOT1059-1 DisplayPort LVDS HDMI lvds TSSOP10 XSON10U IP4283CZ10 NXP XSON10U JESD22-A-J114D
Contextual Info: IP4283CZ10 ESD protection for ultra high-speed interfaces Rev. 01 — 7 May 2009 Product data sheet 1. Product profile 1.1 General description The IP4283CZ10 is designed to protect high-speed interfaces such as HDMI, DisplayPort, eSATA and LVDS against ElectroStatic Discharge ESD . The device includes high-level
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ip4283cz10utlp10tssop10ip4220cz10+7ip4220sot1059-1displayport lvdshdmi lvdsxson10unxp xson10ujesd22-a-j114d
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marking 3y
Abstract: 74AUP1G32 74AUP2G126 JESD22-A114E XSON10U
Contextual Info: 74AUP2T1326 Low-power dual supply buffer/line driver; 3-state Rev. 01 — 1 July 2009 Product data sheet 1. General description The 74AUP2T1326 is a high-performance, dual supply, low-power, low-voltage, dual buffer/line driver with output enable circuitry.
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Solder Paste, Indium 5.8
Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
Contextual Info: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land
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TRANSISTOR S1A 64 smd
Abstract: SSOP14 land pattern ip4065cx11 KYS 30-40 4440 IC 5.1 audio amplifier board nx1117 PHD78NQ 1n4148 sod323 t4 NX1117I33Z PMEG3030
Contextual Info: Discrete Semiconductors Selection Guide 2010 Diodes, transistors, ESD and signal conditioning devices Excellence in portfolio and performance Diodes Introducing new package technology Page 7 Portable and increasingly smaller end products fuel the race towards more sophisticated functionality in smaller form
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ot1061ot1118pssi2021sayptvs10vp1up+10transistor s1a 64 smdssop14 land patternip4065cx11kys 30-404440 ic 5.1 audio amplifier boardnx1117phd78nq1n4148 sod323 t4nx1117i33zpmeg3030
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IP4281CZ10
Abstract: XSON10U SOT1059-1 SOT1059 CYY-1 NXP XSON10U
Contextual Info: IP4281CZ10 ESD protection for high-speed interfaces Rev. 01 — 25 September 2008 Product data sheet 1. Product profile 1.1 General description The IP4281CZ10 is designed for HDMI interface protection. The device includes high-level ElectroStatic Discharge ESD protection diodes for the TMDS signal lines.
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