HXSON12 Search Results

Contextual Info: Package outline HXSON12: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.2 x 2.5 x 0.5 mm SOT1158-1 X A B D E A A1 A3 terminal 1 index area detail X e1 terminal 1 index area e v w b 1 6 C C A B C y1 C y L k E2

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXSON12 package SOT1156-1 2.8 2.4 2.2 1.9 1.55 0.2 4x 0.4 0.2 (4×) 0.4 1.1 1.65 2.4 2.65 2.4 0.8 0.35(1) 0.0125 0.0125 0.8 0.35(1) 0.18 (12×) B-side solder resist covered via Note

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXSON12 package SOT984-1 Hx Gx D P 0.05 0.05 Ay Gy By SPy SPy tot SLy nSPy Hy nSPx SPx SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: Package outline HXSON12: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.35 x 2.5 x 0.5 mm SOT973-1 X B D A E A A1 c terminal 1 index area detail X e1 e terminal 1 index area v w b 1/2 e 1 6 M M C C A B C y y1 C

Contextual Info: Package outline HXSON12: plastic, thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 2.1 x 2.5 x 0.5 mm SOT1156-1 X B D A E A A1 A3 detail X terminal 1 index area e1 terminal 1 index area e v w b 1 6 C C A B C y1 C y L k Eh

Contextual Info: Package outline HXSON12U: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 x 2.5 x 0.5 mm SOT984-1 X B D A E A A1 terminal 1 index area detail X e1 terminal 1 index area L1 e v w b 1/2 e 1 6 M M C

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXSON12 package SOT973-2 Hx Gx D 0.05 P 0.05 Ay Gy SPy By SPy tot SLy nSPy Hy nSPx SPx SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: HX SO N1 2 SOT973-2 HXSON12U; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering code 12NC ending 115 Rev. 1 — 23 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape

Contextual Info: Package outline Footprint information for reflow soldering of HXSON12 package SOT1158-1 Hx Gx D 0.025 P 0.025 Ay Gy By SPy SPy tot SLy nSPy Hy nSPx SPx SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit

CZ12

Abstract: CZ16 12-pin
Contextual Info: At a glance IP425xCZ8-4/CZ12-6/CZ16-8 Package Ultra Thin Leadless Package UTLP - HXSON12: plastic thermal enhanced extremely thin small outline package; 12 terminals; body 1.35 x 2.5 x 0.5 mm QFN compatible plastic package with 0.4 mm pitch Applications

prtr5v0u6s

Abstract: csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY
Contextual Info: Dark Green − NXP‘s transfer to halogen-free products Why Dark Green? We as NXP are deeply committed to developing eco-friendly products and integrating environmental safety aspects in all manufacturing processes. For our packaging technology this meant a shift to lead-free and halogen-free “Dark Green”, years

nvt2003dp

Abstract: NVT2003DP N2003 3 TSSOP10 169DH DHVQFN16 TSSOP16 msl HVQFN16 JESD22-A114 JESD22-A115 TSSOP10 TSSOP16
Contextual Info: NVT2003/04/06 Bidirectional voltage-level translator for open-drain and push-pull applications Rev. 1 — 4 October 2010 Product data sheet 1. General description The NVT2003/04/06 is a family of bidirectional voltage level translators operational from 1.0 V to 3.6 V Vref(A and 1.8 V to 5.5 V (Vref(B), which allow bidirectional voltage

Contextual Info: IP4791CZ12 HDMI ESD protection, level shifter and back drive protection Rev. 01 — 1 April 2010 Objective data sheet 1. General description The IP4791CZ12 is designed for mobile HDMI transmitter interface protection and it includes level shifting for the DDC, CEC, hot plug signal and back drive protection. In

circuit diagram wireless spy camera

Abstract: PDTB123Y IP4303CX4 dual cc BAW62 3267 tsop6 PCMF2DFN1 BST60 PUMD4 PDTB123E PDTA143
Contextual Info: Discrete Semiconductors Selection Guide 2014 Protection and signal conditioning devices, diodes, bipolar transistors, MOSFETs and thyristors. NXP’s next generation of packaging DFN Discrete Flat No-lead packages – high performance on smallest footprint

marking HX 6pin

Abstract: WT marking WM Marking code "MARKING CODE LE" PEMI4QFN marking code LP
Contextual Info: PEMIxQFN; PEMI2STD family Integrated 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Rev. 2 — 3 November 2011 Product data sheet 1. Product profile 1.1 General description The devices are a family of RC low pass filters. They are designed to provide filtering of

IP4056

Abstract: SIMCARD Schematic Hdmi to micro usb wiring diagram ip4065cx11 SD-Card MMC IP4826CX12 IP4056CX8 IP4058CX8 IP5002CX8 back2back diode
Contextual Info: Integrated Discretes Interface conditioning and interface protection in mobile appliances Rev. 8.1 — 9 March 2011 Brochure Document information Info Content Keywords Integrated Discretes, EMI filter, ESD protection, chip scale package CSP , level shifting, memory card, SD memory card, MMC, T-flash,

land pattern for sot109-1

Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
Contextual Info: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products

sot552-1

Contextual Info: NVT2003/04/06 Bidirectional voltage-level translator for open-drain and push-pull applications Rev. 4 — 7 September 2012 Product data sheet 1. General description The NVT2003/04/06 is a family of bidirectional voltage level translators operational from 1.0 V to 3.6 V Vref(A and 1.8 V to 5.5 V (Vref(B), which allow bidirectional voltage

marking HX 6pin

Abstract: WM Marking code NXP Diodes MARKING 11* 3PIN marking code LP qfn PACKAGE OUTLINE Drawing nxp wt marking ht marking sot-665
Contextual Info: PEMIxQFN; PEMI2STD family Integrated 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Rev. 1 — 29 July 2011 Product data sheet 1. Product profile 1.1 General description The devices are a family of RC low pass filters. They are designed to provide filtering of

sot983

Abstract: sot984 sot985 127DH
Contextual Info: IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 Integrated 4-, 6- and 8-channel passive filter network with ESD protection to IEC 61000-4-2, level 4 Rev. 01 — 9 February 2007 Objective data sheet 1. Product profile 1.1 General description The IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 family consists of 4-, 6- and

Contextual Info: AN11127 Bidirectional voltage level translators NVT2001/02/03/04/06/08/10, PCA9306, GTL2000/02/03/10 Rev. 1 — 4 April 2012 Application note Document information Info Content Keywords NVT, voltage translator, level translator, level shift, passive voltage

Contextual Info: NVT2003/04/06 Bidirectional voltage-level translator for open-drain and push-pull applications Rev. 3 — 25 October 2011 Product data sheet 1. General description The NVT2003/04/06 is a family of bidirectional voltage level translators operational from 1.0 V to 3.6 V Vref(A and 1.8 V to 5.5 V (Vref(B), which allow bidirectional voltage

TRANSISTOR S1A 64 smd

Abstract: SSOP14 land pattern ip4065cx11 KYS 30-40 4440 IC 5.1 audio amplifier board nx1117 PHD78NQ 1n4148 sod323 t4 NX1117I33Z PMEG3030
Contextual Info: Discrete Semiconductors Selection Guide 2010 Diodes, transistors, ESD and signal conditioning devices Excellence in portfolio and performance Diodes Introducing new package technology Page 7 Portable and increasingly smaller end products fuel the race towards more sophisticated functionality in smaller form

biss 0001

Abstract: PBLS1504V PEMD4 PEMD15 PEMH15 PEMH24 PBLS1503V PEMD6 PEMB10 PMZ250UN marking
Contextual Info: NXP ultra-small diodes and transistors for portable applications Downsize the footprint, boost the performance At NXP, our comprehensive portfolio of ultra-small diodes and transistors enables high performance in increasingly small portable electronics. We safeguard sensitive ICs with advanced