SOJ 44 Search Results

Molded SOJ V34

Contextual Info: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 24-Lead (300-Mil) Molded SOJ V13 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 28-Lead (400-Mil) Molded SOJ V28 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 32-Lead (400-Mil) Molded SOJ V33

soj 36

Abstract: V28 Package SOJ 24 diode in 400 Molded SOJ V34 V32 Package
Contextual Info: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 24-Lead (300-Mil) Molded SOJ V13 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 28-Lead (400-Mil) Molded SOJ V28 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 32-Lead (400-Mil) Molded SOJ V33

Contextual Info: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 51-85029-A 24-Lead (300-Mil) Molded SOJ V13 51-85030-A 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 51-85031-B 28-Lead (400-Mil) Molded SOJ V28 51-85032-A 2 Package Diagram

SOJ-400

Contextual Info: 5.7 UNIT : mm 13.2 MJ400-01A, LB-044 length : 493±2.0 thickness : 0.6 +0.3 − 0.2 tolerance : ±0.4 material : plastic with antistatic finish Applied package Quantity (pcs) 28-pin plastic SOJ (400 mil) MAX. 25 32-pin plastic SOJ (400 mil) MAX. 22 36-pin plastic SOJ (400 mil)

5117400

Abstract: sem 2500 7212 tube
Contextual Info: Packing Information SIEM ENS DRAMS in Tape & Reel Package Type Device Type Devices Per Reel Tape Width P-SOJ-26/20-1 ' HYB 5 1 1000BJ HYB 514256BJ 1500 24 mm P-SO J-26/20-5?l HYB 514100BJ HYB 514400BJ 1500 24 mm P-SOJ-28-2 HYB 514800BJ 1000 24 mm P-SOJ-40-1

ASTM-B16-85

Contextual Info: Series 45000X & 65000X SOIC & SOJ to DIP Adapters FEATURES: • A cost effective means of upgrading to SOJ or SOIC.without changing your PCB layout. • Available on .400 [10.16] and .600 [15.24] centers. Consult Data Sheet No. 18010 for adapters on .300

64Kx8 CMOS RAM

Abstract: KM428C257 zip 40pin 52PLCC
Contextual Info: FUNCTION GUIDE MEMORY ICs Synchronous SRAM Power Dissipation Den. 1M 288K 512K Part Name KM741006 KM791001 256K 128K KM 79C86 KM 79C40 32K 32K KM 718B513 KM718BV513 KM 718B514 1M Speed ns 36 SOJ 32 SOJ Now NoW X 9 CMOS CMOS 190 190 44 PLCC 9 14/19/24 14/19/24

L538

Abstract: A 916 x538 s538 40-L538-00
Contextual Info: Series X538 SOJ J-lead Surface Mount Sockets FEATURES: •Allows SOJ packaged devices to be socketed for easy removal. •Open body for easy surface mount solder joint inspection. SPECIFICATIONS: •Body is brown UL 94V-0 glass-filled Thermoplastic PPS . •Contacts are Phosphor Bronze.

Contextual Info: 1C 100 SERIES soj •O u tlin e Dimensions FEATURES • Sockets for inserting SOJ packages in dead-bug orientation. • The larger contact area and two-point contact design ensure high contact reliability. • Outstanding durability with low insertion-extraction forces.

ASTM-B16-85

Abstract: MIL-T-10727
Contextual Info: Series 35000X SOIC & SOJ to DIP Adapters FEATURES: • A cost effective means of upgrading to SOJ or SOIC.without changing your PCB layout. • Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers.

PLCCB020PST

Contextual Info: FINE PITCH SOCKETS Specifications for PLCC-SMT, SOJ and PLCCB/PLCCE Sockets MATERIALS Housing: High temperature thermoplastic Contacts: Copper Alloy Flammability: UL 94V-0 Plating: PLCC-SMT & SOJ TT =150 pinch 3.81 pm minimum Tin/Lead on contact area. 200 pinch (5.08 pm) minimum

OZ 9966

Contextual Info: Series 35000X SOIC & SOJ to DIP Adapters FEATURES: • A cost effective means of upgrading to SOJ or SOIC.without changing your PCB layout. • Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers.

HB56D436

Abstract: HM514100
Contextual Info: HB56D436 Series 4,194,304-word x 36-bit High Density Dynamic RAM Module Description The HB56D436 is a 4 M × 36 dynamic RAM module, mounted 8 pieces of 16-Mbit DRAM HM5117400BS sealed in SOJ package and 4 pieces of 4-Mbit DRAM (HM514100CS) sealed in SOJ

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 50 PIN PLASTIC LCC-50P-M02 50-pin plastic SOJ Lead pitch 0.80mm Package width 400mil Lead shape J bend Sealing method Plastic mold LCC-50P-M02 50-pin plastic SOJ (LCC-50P-M02) * : Resin protrusion. (Each side : 0.15 (.006) max)

5962-956001

Abstract: 5962-9561310HUA 5962-9560009QM 5962-9561329HN soj 36 10 35L A8 AS5C512 AS5C
Contextual Info: SRAM AS5C512K8 512K x 8 SRAM PIN ASSIGNMENT Top View HIGH SPEED SRAM with REVOLUTIONARY PINOUT 36-Pin SOJ (DJ, ECJ & SOJ) 36-Pin CLCC (EC) AVAILABLE AS MILITARY SPECIFICATIONS •SMD 5962-95600 •SMD 5962-95613 •MIL-STD-883 FEATURES • Ultra High Speed Asynchronous Operation

HB56D836

Contextual Info: HB56D836 Series 8,388,608-word x 36-bit High Density Dynamic RAM Module Description The HB56D836 is a 8 M × 36 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM HM5117400BS sealed in SOJ package and 8 pieces of 4-Mbit DRAM (HM514100CS) sealed in SOJ

LCC28

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index LCC-28C-A04 28-pin ceramic SOJ Lead pitch 50 mil Package width 432 mil Sealing method Metal seal Lead shape J bend LCC-28C-A04 28-pin ceramic SOJ

Contextual Info: »HYUNDAI HYM572A224A R-Series Unbuffered 2M x 72-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION The HYM572A224A is a 2M x 72-bit EDO mode CMOS DRAM module consisting of two HY514404B in 20/26 pin SOJ or TSOP-II, four HY5118164B 42/42 pin SOJ or 44/50 pin TSOR-II and one 2048bit EEPROM on a 168 pin

Contextual Info: Packing Instruction Page:1/1 Tube and Tray Unit Quantity Update: June 3,2015 Description SRAM Product / Package 28 SOJ 25 ea / Tube 2,500 ea / 100 Tube / Box 10,000 ea / 4 Box / CTN 32 SOJ 22 ea / Tube 2,200 ea / 100 Tube / Box 8,800 ea / 4 Box / CTN 28 SOP

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC To Top / Package Lineup / Package Index LCC-50P-M02 50-pin plastic SOJ Lead pitch 0.80 mm Package width 400 mil Lead shape J bend Sealing method Plastic mold LCC-50P-M02 50-pin plastic SOJ

max3808

Contextual Info: HB56G136 Series 1,048,576-word x 36-bit High Density Dynamic RAM Module HITACHI Description The HB56G136 is a 1M x 36 dynamic RAM module, mounted 2 pieces of 16-Mbit DRAM HM5118160 AJ sealed in SOJ package and 2 pieces of 2-Mbit DRAM (HM512200BS) sealed in SOJ package.

Contextual Info: HB56G236 Series 2,097,152-word x 36-bit High Density Dynamic RAM Module HITACHI Description The HB56G236 is a 2M x 36 dynamic RAM module, mounted 4 pieces of 16-Mbit DRAM HM5118160AJ sealed in SOJ package and 4 pieces of 2-Mbit DRAM (HM512200BS) sealed in SOJ package.

Contextual Info: 'HYUNDAI HYM572A124A R-Series Unbuffered 1M x 72-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION The HYM572A124A is a 1M x 72-bit EDO mode CMOS DRAM module consisting of two HY514404B in 20/26 pin SOJ or TSOP-II, four HY5118164B 42/42 pin SOJ or 44/50 pin TSOP-II and one 2048bit EEPROM on a 168 pin

Contextual Info: GS74108ATP/J SOJ, TSOP Commercial Temp Industrial Temp 512K x 8 4Mb Asynchronous SRAM Features 8, 10, 12 ns 3.3 V VDD Center VDD and VSS SOJ 512K x 8-Pin Configuration • Fast access time: 8, 10, 12 ns • CMOS low power operation: 130/105/95 mA at minimum