SOCKET-7 321 Search Results

Socket-7 321

Abstract: NP210 SOCKET7 PentiumTM
Contextual Info: NP210 Series - Socket 7 SPGA / ZIF Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: 100,000MΩ min. at 500 V DC 250 V AC for 1 minute 30mΩ max. at 10 mA / 20mV max. measured from device pin to Socket terminal Operating Temperature Range: -55°C ~ +105°C

Contextual Info: Catalog 1 3 0 7 5 1 5 Issued 9-99 Pin Grid Array PGA Sockets Socket 7 — 1 9 x 1 9 Grid 321 Positions, Lo w Profile Part Num ber 9 16 716 -2 M aterial and Finish H o u sin g — High temperature thermoplastic, natural Contact — Copper alloy with 0.00038

RISC86

Abstract: ak02 AMD-K6-2E/300AFR MARKING AG03 "marking code" Z04 d54 marking AMD-K6-2E SUPER-7 AMD-K62-E AK-02
Contextual Info: PRELIMINARY AMD-K6 -2E Embedded Processor Standard- and Low-Power Processor Featuring Super7™ and Socket 7 Platform Compatibility, Superscalar MMX™ Unit, and 3DNow!™ Technology DISTINCTIVE CHARACTERISTICS • Advanced 6-Issue RISC86 Superscalar Microarchitecture

114-10004 Application Specification

Abstract: BASE TOOL AMP crimper 69710-1 TH501 TOOL 66101-3 66101-2 amp 2322M M81969/1-02 B 58290 601967-1 66566-4
Contextual Info: Catalog 1307612 Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: 650 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com Precision Pin and Socket Contacts Revised 7-01 Introduction

W22C

Abstract: S12301DS 5133S stp520 t12m256 T12M256A-12J UPC507 MITAC PC515 GP014
Contextual Info: MODEL : 5133S Revision 02A Table of Contents page 1 Cover Sheet Block Diagram 2 Central Processor Unit 3 North Bridge Part A & PBSRAM/TAG RAM 4 North Bridge Part B 5 System Memory 6 South Bridge 7 PCMCIA Controller & Socket 8 Audio Codec & Amplifier 9 Enhance IDE & FDD Connector

bellmouth adjustment for applicators

Abstract: crimp quality monitor 408-9476 Instruction Sheet 408-2095 90869-1 90247-1 PG57M 90123-2 90124-2 90546-1
Contextual Info: Soft Shell Pin and Socket Connectors C a ta lo g 8 2 1 8 1 Revised 7-97 Application Tooling Machines Automatic and Semi-Automatic AMP-O-LECTRIC Model “ G” Terminating Machines, 354500-1 , - 9 , - 1 1 AMPOMATOR CLS IV+ Lead-Making Machines, 356500-1 , - 2

Contextual Info: 3205 SERIES P.C.B SOCKET 1.27mmX2.54mm 0.050"X0.100" □upi in M aterial: Housing: 30% Glass filled PBT U L 9 4 V - 0 . Contacts: P hosphor Bronze. Plating: Gold plated: 5 fi over 5 0 /7 nickel. Tin plated: 1 5 0 / / over 70 fi' nickel. Selective gold plated: S tandard gold

Contextual Info: series 28 HiPer-D Combo Connectors Combo HiPer-D power, signal and RF contact arrangements Mating face of pin connector. Socket connector numbers are reversed. A1 A2 1 A1 3 1-2W2 Arrangement Shell Size Contacts A2 5 4 3 2 1 2-3W3 A1 A1 1 2 3 4 5 6 8 9 8 7 6

Contextual Info: 7 TH IS 0 DRAWING COPYRIGHT IS UNPUBLISHED. 19 RELEASED BY AMP INCORPORATED. ALL FOR P U B L I C A T I O N R IC 6 5 4 3 2 , 19 REVISIONS DI ST LOC AG HTS R E S E R V E D . 24 D ESCRIPTION -30.12[1 .1 86] B SOCKET £ PIN PIN PINS . » ® » ® „ ® „ ® „ ® ^ „ © „ © „ © „ © ,

PE136627-4371-01F

Abstract: Intel socket 1366 PIN LAYOUT E29477-002 PT44L12-4101 foxconn LGA1366 FOXCONN fan PE136627 Z1ML005001 AVC fans pcie Design guide
Contextual Info: Intel Xeon® Processor 3500 Series Thermal / Mechanical Design Guide March 2009 Document Number: 321461-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

DP-64S

Abstract: HCU04
Contextual Info: H8/3217 Series DP-64S User System Interface Cable HS3217ECS61H for E6000 Emulator User’s Manual Rev. 3.0 4/1/03 Renesas Technology Corp. HS3217ECS61HE(C) Cautions 1. Renesas neither warrants nor grants licenses of any rights of Renesas’s or any third party’s

Contextual Info: m o l e x 1.27mm .050" Pitch ZIF PGA Socket Sockets and Edge Connectors FEATURES AND SPECIFICATIONS Features and Benefits Electrical • Size 321 circuits ■ Accepts Intel Pentium P55CT 3V microprocessors ■ ZIF actuator enables easy replaCement/upgrade of

Lauterbach LA-3500

Abstract: CPU H8/532 Electro Stimulation H8/520 LA-6791 TRACE32- ICD LA-9547 TRACE32 CPU H8 534 DIL64
Contextual Info: Technical Information ICE-H8 H8/3001 H8/3002 H8/3003 H8/3004 H8/3005 H8/3006 H8/3007 H8/3030 H8/3031 H8/3032 H8/3040 H8/3041 H8/3042 H8/3044 H8/3045 H8/3047 H8/3048 H8/3048F H8/3060 H8/3061 H8/3062 H8/3064 H8/3065 H8/3066 H8/3067 H8/3101 H8/3102 H8/3202 H8/3212

Contextual Info: I NDE X .100" BOX HEADERS Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 319 .100" X .100" [2.54 X 2.54] Centerline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 320 .100" X .100" Centerline [2.54 X 2.54] with Latches. . . . . . . . . . . . . . . . . . . 321

72 X050

Contextual Info: A I i* B O m MM—322—051 -2 5 3 - 4 4 0 0 METAL THE CONNECTOR COMPANY M N -321-0 5 1 - 2 5 3 - 4 4 0 0 Cable to Board (Narrow Footprint) (PLASTIC) . 050" 9 thru 100 Contacts Rugged Cable Rugged Board Mount MM, MN MK, ML MK -312 -0 5 1 - 1 3 5 -2 2 0 0

Contextual Info: AirBorn M M -312 -0 5 1 - 1 5 3 -4 4 0 0 METAL THE CONNECTOR COMPANY M N -311 -0 5 1 -1 5 3 -4 4 0 0 (PLASTIC) Cable to Board (Narrow Footprint) . 050" 9 thru 100 Contacts Rugged Cable M K -3 2 2 -0 5 1 - 2 3 5 - 2 2 0 0 (METAL) MM, MN M L -321 -0 5 1 - 2 3 5 - 2 2 0 0

Contextual Info: OBSOLETE ELECTROMECHANICAL PRESS AND APPLICATOR Electromechanical Press ZGP-PEO Left Side Feed Applicator Z30-321 Stripper Crimper ZGP-SC10 optional This Electromechanical Press and Applicator have been designed for use with the following crimp contacts:

Contextual Info: OBSOLETE ELECTROMECHANICAL PRESS AND APPLICATOR Electromechanical Press ZGP-PEO Left Side Feed Applicator Z22-321 Stripper Crimper ZGP-SC10 optional This Electromechanical Press and Applicator have been designed for use with the following crimp contacts:

Contextual Info: D S 1 6 4 6 /D S 1 6 4 6 L P M P R E L IM IN A R Y DALLAS DS1646DS1646LPM s e m ic o n d u c t o r N o n v o la t ile T ir n s k s B p in c j R A M FEATURES PIN ASSIGNMENT • Optional low profile socketable module - NC I t 321 Vcc Fits into a standard 68-pin PLCC surface

LEMO FFA 1S

Abstract: lemo DPE.99 42109 ARALDITE standard epoxy adhesive DPE.99.103.8K huber suhner catalogue ERA.1S.250.CTL CLAD111 ECG 174
Contextual Info: COAXIAL, TRIAXIAL, MULTI & MIXED CONNECTORS SHORT FORM CATALOGUE ® Precision modular connectors to suit your application Since its creation in Switzerland in 1946 the LEMO Group has been recognized as a global leader of circular Push-Pull connectors and connector solutions. Today LEMO and its affiliated companies, REDEL and COELVER, are active in more than

Contextual Info: COAXIAL, TRIAXIAL, MULTI & MIXED CONNECTORS SHORT FORM CATALOGUE ® Precision modular connectors to suit your application Since its creation in Switzerland in 1946 the LEMO Group has been recognized as a global leader of circular Push-Pull connectors and connector solutions. Today LEMO and its affiliated companies, REDEL and COELVER, are active in more than

82092AA

Abstract: LT 5316 29051 82365SL PCMCIA 51FFH
Contextual Info: ÄQWANGB 0[M[F [SöüDÄTD®[ffl in te i 82092AA PCI TO PCMCIA/ENHANCED-IDE CONTROLLER Provides the Ultimate Plug and Play Solution for High Performance PCI Desktop Systems — Supports Combinations of PCMCIA and Enhanced Local Bus IDE Interfaces — Contains a 32-bit PCI Local Bus

F1505-01

Abstract: 33481 high side TORX 33482 32039 32236
Contextual Info: 21 Wiha Insulated Tool Sets SoftFinish Cushion Grip Handles NEW NEW From From Wiha 80 Piece Set! 48 Piece Set! 1000Volt 328 74 48 Piece Insulated Tool Set. Insulation According to VDE 0682/part 201, EN/IEC 60900, ASTM F-1505-01, NFPA70E & CSA, up to 1000 volt. Individually Tested. Pliers drop-forged from special

LGA 1366 Socket PIN diagram

Abstract: jstd 002 W3550 W3580 LGA 1366 Socket diagram LGA 1155 PIN diagram LGA1366 W3520 1155 lga socket DELTA fan
Contextual Info: Intel Xeon® Processor 3500 Series Datasheet, Volume 1 July 2009 Document Number: 321332-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS