pitch 0.4mm BGA
Abstract: SF-BGA400A-B-11 0.4mm pitch BGA
Contextual Info: C Package Code: BGA400A D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 19.00mm [0.748"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 2 5.32mm [0.210"]
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bga400afr4/g1020x20sf-bga400a-b-11+2pitch 0.4mm bga0.4mm pitch bga
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FR4 substrate with 0.762mm thickness
Abstract: BGA400F SF-BGA400F-B-11
Contextual Info: D Package Code: BGA400F C 0.635mm See BGA pattern code to the right for actual pattern layout Y 0.762mm 0.025" dia. pad X 24.13mm Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.635mm 5.33mm 3.74mm [0.147"] [0.210"] .0225" dia. tooling holes (X2)
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bga400f635mm762mmfr4/g10+2sf-bga400f-b-11fr4 substrate with 0.762mm thickness
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SF-BGA400B-B-11
Abstract: BGA-400 BGA400
Contextual Info: D Package Code: BGA400B 25.4mm C 24.13mm [0.950"] Ø 0.40mm [Ø 0.0156"] tooling hole x2 optional See BGA pattern code to the right for actual pattern layout Y 24.13mm [0.950"] 1.27mm typ. [0.050"] X Top View (reference only) 0.64mm [0.025"] typ. 2 0.36mm [0.014"] dia.
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bga400bfr4/g10sf-bga400b-b-11bga-400+1bga400
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SF-BGA400E-B-11
Abstract: BGA-400
Contextual Info: D Package Code: BGA400E C 28.52mm [1.123"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y 28.52mm [1.123"] X Top View reference only 1.5mm [0.059"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 1.5mm [0.059"] Ø 0.64mm pad [Ø 0.025"]
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SF-BGA400D-B-11
Contextual Info: D Package Code: BGA400D C 30.48mm [1.200"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] 30.48mm [1.200"] X 1.27mm typ. [0.050"] Top View reference only 2 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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bga400dfr4/g1025x25sf-bga400d-b-11 |
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BGA400
Contextual Info: Package outline BGA400: plastic ball grid array package; 400 balls; body 27 x 27 x 1.75 mm D SOT901-1 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C Y W e V U T R P N M L e2 K J 1/2 e H G F E D C B A shape optional 4x
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bga400ot901-1ms-034 |
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BGA400
Abstract: MO-034 sot901 BGA-400
Contextual Info: Package outline Philips Semiconductors BGA400: plastic ball grid array package; 400 balls; body 27 x 27 x 1.75 mm D SOT901-1 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 e ∅v ∅w b 1/2 e M M y1 C C A B C y Y W e V U T R P N M L e2 K J 1/2 e H G
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bga400ot901-1mo-034sot901+1bga-400
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Aero4223
Abstract: diagram circuit usb mp3 player with radio fm lcd GNS7560 bluetooth encoder h.264 H.264 VGA encoder NFC I2C TO 48 A IC MP3 PROCESSOR PCF50616 STL4560 nfc antenna
Contextual Info: Cellular system solution 6529 5-Mpixel camera and VGA 30 fps camcorder in a highly integrated EDGE chipset February 2009 www.stericsson.com This new generation, single-core EDGE system solution comes with the power and features typically found in specialized
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arm926ejpnx6529x32-kbytereal16025+14wlcsp-61gns7560wlcsp-54stl456011b/glfbga-240aero4223diagram circuit usb mp3 player with radio fm lcdbluetooth encoder h.264h.264 vga encodernfc i2cto 48 a ic mp3 processorpcf50616nfc antenna
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GEMINAX-L2
Abstract: adsl2
Contextual Info: Product Brief Lantiq GEMINAX™ XXS V3 Ultra-small, low-power, high-density ADSL2+ chipset for broadband linecard applications Applications • Multi-standard ADSL2+ DSLAM, DLC, MSAN linecards for Central Office and MDU applications Features • Supported Standards
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Manchester CODING DECODING FPGA
Abstract: iso7816 sim 8x 8 led dot matrix AC97 ARM926EJ-S ISO7816
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz
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arm926ej-stm6270as10-jan-08manchester coding decoding fpga+5iso7816 sim8x 8 led dot matrixac97arm926ej-siso7816
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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bga16a1atternsbga676bga665bga-1156+7156 qfn 12x12lga240bga-783bga441bga1024bga15217286x
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SMR 40000c
Abstract: MMC760 la 4763 AT91CAP7 AT91CAP9 AT24LC toshiba NAND Flash memory controller ecc 6264B k 2996 4b1 toshiba
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz
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arm926ej-stm6264b26-nov-07smr 40000c+8mmc760la 4763at91cap7at91cap9at24lctoshiba nand flash memory controller ecck 29964b1 toshiba
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atmel part marking c16
Abstract: AC97 ARM926EJ-S AT91CAP9S250A AT91CAP9S500A ISO7816 Manchester CODING DECODING FPGA
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz
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arm926ej-stm6264cs24-mar-09atmel part marking c16+6ac97arm926ej-sat91cap9s250aat91cap9s500aiso7816manchester coding decoding fpga
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TB 1226 BN
Abstract: TB GUA 5365 MATERIAL TB GUA 5365 MATERIAL NEOPRENE E-23018 tb 1229 bn sj 2258 emp 5523 ASTM A123 galvanized iron thermal conductivity UL514
Contextual Info: 412031.A01 FIT 3/12 3/20/03 3:02 PM Page 1 A Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A2 Tables and Specifications . . . . . . . . . . . . . . . . . . . . . . A3 Rigid Metal Conduit/Intermediate Metal Conduit Fittings . . . . . . . . . . . . . . . . . . . A4-A38
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a4-a38a39-a40a41-a49a50-a51+13a52-a53a54-a56a57-a65tb 1226 bntb gua 5365 materialtb gua 5365 material neoprenee-23018tb 1229 bnsj 2258emp 5523astm a123galvanized iron thermal conductivityul514
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603al
Abstract: WW-C-581 TB cable lug catalogue bitumastic chase nipple EMT CONDUIT BITUMASTIC TRIB-125 141SL EMT CONDUIT A-A-50553
Contextual Info: T&B Conduit Fittings General Information Thomas & Betts… The Complete Product Line Since the turn of the century, Thomas & Betts has been a recognized leader in electrical fittings. Industry standards such as Chase Nipples and Erickson® Couplings were
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603alww-c-581tb cable lug cataloguebitumastic+6chase nippleemt conduit bitumastictrib-125141slemt conduita-a-50553
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LED DRIVER ana 618
Abstract: AT91CAP9 6264C ET 439 AC97 ARM926EJ-S AT91CAP9S250A AT91CAP9S500A ISO7816 k 3878
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz
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arm926ej-stm6264c24-mar-09led driver ana 618+8at91cap9et 439ac97arm926ej-sat91cap9s250aat91cap9s500aiso7816k 3878
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sp8k10s
Abstract: NT5TU32M16 XTAL 25MHz 20PF 30PPM t-con board GL852 40GAB1500-F100 NT5TU32M c7 vx700 bios MOSFET B20 p03 TCON BOARD
Contextual Info: 5 4 3 2 System Power Rail Management Keyboard Button Docking 25 1 21 3VSTBY 1.5VSTBY 3V 1.8V 1.5V 0.9V 5VS 3VS S3 O O O O O O X X 1.5VS X 1.05VS X VCORE X S4 O O X X X X X X X X X S5 O O X X X X X X X X X D D PCI BUS Rounting Table PCI DEVICE Vcore VIA C7-M
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bga400400mhz318mhz768khz+15480mhz480mb/s100ohmu503cum650uv140gab1500-f100sp8k10snt5tu32m16xtal 25mhz 20pf 30ppmt-con boardgl852nt5tu32mc7 vx700 biosmosfet b20 p03tcon board
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aluminium 7075
Abstract: high current pogo pin FR4 0.8mm thickness BGA400 0.5mm pitch BGA BGA-400 7075-T6 aluminum 180C 7075-T6 SBT-BGA-6505
Contextual Info: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 6 7 Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable
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17x17mm20x20sbt-bga-6505aluminium 7075+8high current pogo pinfr4 0.8mm thicknessbga4000.5mm pitch bgabga-4007075-t6 aluminum180c7075-t6
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AC97
Abstract: ARM926EJ-S AT91CAP9S250A AT91CAP9S500A ISO7816 AT91CAP9S250A-CJ Manchester CODING DECODING FPGA 324BGA
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz
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arm926ej-stm6264bs26-nov-07ac97+7arm926ej-sat91cap9s250aat91cap9s500aiso7816at91cap9s250a-cjmanchester coding decoding fpga324bga
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Manchester CODING DECODING FPGA
Abstract: ARMv5TEJ ARM926T BCWE ATMEL TOP MARK W4 F20 BGA400 Linear Image Sensor TDI ARM926EJ-S AT91CAP9S250A ISO7816
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz
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arm926ej-stm6264as21-may-07manchester coding decoding fpga+9armv5tejarm926tbcweatmel top mark w4f20 bga400linear image sensor tdiarm926ej-sat91cap9s250aiso7816
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AT91CAP9
Abstract: IC BOSCH spi 4254 FM TRANSMITTER db broadcast ke 20 user manual Wireless Bluetooth V2.0 Transceiver Module RS232 AT91CAP9S250A
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz
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arm926ej-stmgates/25021-may-07at91cap9+4ic bosch spi 4254fm transmitter db broadcast ke 20 user manualwireless bluetooth v2.0 transceiver module rs232at91cap9s250a
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usb vcd player circuit diagram
Abstract: connect usb in vcd player circuit diagram FR450 D4206 3W RGB E27 SCL1251 P-FBGA 169 MB93461-40PB-GE1 MB93461-40PB-G 11-365
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS07-08201-1E Family FR450 Series VLIW Embedded Microprocessor MB93461 • DESCRIPTION MB93461 realizes excellent performance in the field by combining advanced general processing and media processing for Digital AV equipments such as Television, Advanced Projector, IP TV Phone, Portable Media Player,
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ds07-08201-1efr450mb93461f0504+9usb vcd player circuit diagramconnect usb in vcd player circuit diagramd42063w rgb e27scl1251p-fbga 169mb93461-40pb-ge1mb93461-40pb-g11-365
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FP-X4KPG223-01
Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Contextual Info: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators
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xc2018xc3020xc3064xc3042+11xc3090fp-x4kpg223-01reflow profile for lga componentsbga96bga165bga292so8aca-so18a-z-j-t-01sf-qfe352sa-l-01bga480bca-plcc44-d-p-t-01
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