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ROUNDUP Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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m1 250c fuse
Abstract: at32uc3c em 234 stepper dtx 370 DTH block diagram lta 301 VT 546 Modem basic circuit diagram EIC 4021 shift registers 4050
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32-bit9166d-avrm1 250c fuseat32uc3c+8 | |
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Contextual Info: Preliminary User’s Manual V850ES/JF3-L 32-bit Single-Chip Microcontrollers Hardware PD70F3735 μPD70F3736 Document No. U18952EJ1V0UD00 1st edition Date Published February 2008 N 2008 Printed in Japan [MEMO] 2 Preliminary User’s Manual U18952EJ1V0UD |
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v850es/jf3-l32-bitpd70f3735pd70f3736+3 | |
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Contextual Info: Rev. 1.21. Apr. 2012 M474B5173BH0 M474B1G73BH0 204pin Unbuffered ECC SODIMM based on 4Gb B-die 78FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. |
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m474b5173bh0m474b1g73bh0204pin78fbga+3 | |
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Contextual Info: Preliminary User’s Manual V850ES/SG2 32-Bit Single-Chip Microcontroller Hardware µPD703262HY µPD703263HY µPD70F3263HY µPD703272HY µPD703273HY µPD70F3273HY µPD703282HY µPD703283HY µPD70F3283HY Document No. U17644EJ1V0UD00 1st edition Date Published September 2005 N CP(K) |
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v850es/sg232-bitpd703262hypd703263hy+6 | |
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Contextual Info: M2S1G64CBH4B5P / M2S2G64CB88B5N / M2S4G64CB8HB5N 1GB: 128M x 64 / 2GB: 256M x 64 / 4GB: 512M x 64 PC3-8500 / PC3-10600 / PC3-12800 Unbuffered DDR3 SO-DIMM Based on DDR3-1066/1333/1600 128Mx16 1GB / 256Mx8 (2GB) / 256Mx8 (4GB) SDRAM B-Die Features •Performance: |
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m2s1g64cbh4b5pm2s2g64cb88b5nm2s4g64cb8hb5npc3-8500+5 | |
esd samsung
Abstract: bt.656 parallel to serial conversion for vga camera lcd vga controller 3.5 wVGA bt.656 to RGB888 bt.656 parallel to serial conversion vga b34 diodes on semiconductor BT656 to rgb888 DLPU004 hynix part number
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dlpc300dlps023dlp300024-bit+13 | |
CXD2500Q
Abstract: YM3623B SM5842APT SM5842AP npc SM5842 sm5864 CIRCUITS-20
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sm5842ap/apt24-bit384fs256fs+8 | |
pin configuration of 7486 IC
Abstract: pin DIAGRAM OF IC 7486 Schottky B 1045 TRW PT 3154 D pin DIAGRAM OF IC 7486 datasheet pin configuration OF IC 7486 pin configuration of ic 7448 6232 RAM DIAGRAM OF IC 7106 IC 7486
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s6b33a2page11page24vout45+11 | |
NT1GC72B89A0NF
Abstract: 128MX8 nanya 2gb DDR3 DIMM NT2GC72B8PA0NF-CG ddr3 PCB footprint NT2GC72B8PA0NF Nanya DDR3 DDR3 DIMM footprint DDR3 udimm jedec PC3-10600
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nt1gc72b89a0nfnt2gc72b8pa0nfnt1gc72b89a1nfnt2gc72b8pa1nf+10 | |
14 pin LCD monocrome connector
Abstract: lcd ramdac capacitor bc series 10uf/63V toshiba lcd power board schematic LCD dots toshiba 320X240 LP29 CORE SED1354F hitachi lcd backlight schematic lcd 240 128 ts SED1354
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mf1072-02inte64862355sed1354sed1354f0a+11 | |
PEB2255
Abstract: irs5 PXB4219E PXB4220 PXB4220E PXB4221 PXB4221E PXB4219 TINI microcontroller cards
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d-81541peb2255irs5pxb4219e+6 | |
k4b2g1646q
Abstract: ddr3 2133 K4B2G1646Q-BCK0 K4B2G1646Q-BCMA
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k4b2g1646q96fbgaddr3 2133k4b2g1646q-bck0+1 | |
IS46TR
Abstract: IS43TR82560A DDR3 DRAM 2GB 128Mx16 96BALL FBGA "2Gb DDR3 SDRAM"
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is43/46tr16128a/alis43/46tr82560a/al256mx8128mx16+8 | |
m8087 intelContextual Info: p R iy iM O B y w in te i M80C187 80-BIT NUMERIC PROCESSOR EXTENSION Military High Perform ance 80-Bit Internal Architecture Tw o to Three Tim es M8087 Perform ance at Equivalent Clock Speed Im plements A N S I/IE E E Standard 7541985 fo r Binary Floating-Point |
OCR Scan |
m80c18780-bitm8087m80387+3 | |
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coprocessorContextual Info: in y Intel387 SX MATH COPROCESSOR N e w A u to m a tic P o w e r M a n a g e m e n t — L o w P o w e r C o n su m p tio n — T y p ic a lly 100 m A in D y n a m ic M o de, an d 4 m A in Id le M o d e S o c k e t C o m p a tib le w ith In te l3 8 7 Fam ily |
OCR Scan |
intel387asm286asm86coprocessor | |
energy tapping identifier wireless data acquisition
Abstract: interpolation CIC Filter iso 7811-9 sine wave pwm circuit pec 4179 Isdi cmos sensor edp 2339 ARM926EJ atmel sam4l ram schematic diagram
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256kbytes64-bit42023benergy tapping identifier wireless data acquisition+9 | |
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Contextual Info: intJ 80C187 80-BIT MATH COPROCESSOR • High Performance 80-Bit Internal Architecture ■ Implements ANSI/IEEE Standard 7541985 for Binary Floating-Point Arithmetic ■ Upward Object-Code Compatible from 8087 ■ Fully Compatible with 387DX and 387SX Math Coprocessors. Implements all 387 |
OCR Scan |
80c18780-bit387dx387sx+3 | |
hall marking code A04
Abstract: INTELDX4 write-through YSS 928
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OCR Scan |
intel486100-mhz32-bit16k-byte+3 | |
Cyrix FasMath
Abstract: CX-83S87 cyrix 386SX fcom 7c DATA SHEET FOR OL 107 E SOLDER PEST FasMath 83D87 386SX CIRCUIT diagram 80386 83S87
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OCR Scan |
qqd13tcx-83s87x-/v9-12-0516-bit+14 | |
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Contextual Info: Product Specifications PART NO.: VL41D1G63B-K0/K9/F8S REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM LOW VOLTAGE ECC UNBUFFERED SO-UDIMM 204-PIN Description The VL41D1G63B is a 1Gx72 DDR3 SDRAM high density SO-UDIMM. This dual rank memory module consists of |
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vl41d1g63b-k0/k9/f8s1gx72204-pinvl41d1g63b+1 | |
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Contextual Info: DLPC6401 www.ti.com DLPS031 – DECEMBER 2013 DLP Data Processor • 23 • • • • • • • • • • • • • Provides a 30-bit Input Pixel Interface: – YUV, YCrCb, or RGB Data Format – 8, 9, or 10 Bits per Color – Pixel Clock Support up to 150 MHz |
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dlpc6401dlps03130-bit90-mhz+3 | |
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Contextual Info: Rev. 1.51, Apr. 2013 M471B5173BH0 M471B1G73BH0 204pin Unbuffered SODIMM based on 4Gb B-die 1.35V 78FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. |
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m471b5173bh0m471b1g73bh0204pin78fbga+3 | |
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Contextual Info: Product Specifications PART NO.: VL33B1K68F-K0/K9/F8/E7S REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ULP ECC REGISTERED DIMM 240-PIN Description The VL33B1K68F is a 1Gx72 DDR3 SDRAM high density RDIMM. This memory module is dual rank, consists of eighteen stacked CMOS 1Gx4 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered |
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vl33b1k68f-k0/k9/f8/e7s1gx72240-pinvl33b1k68f+1 | |
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Contextual Info: Spartan-6 FPGA Clocking Resources User Guide UG382 v1.8 June 20, 2013 Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL |
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ug382 | |