R345 Search Results

Contextual Info: Fuse Block 441-R345A-GR Date Last Revised: 3-2-07 39.6 1.56 25 (.984) 1.30 (.051) 11 (.433) 4.80±.10 (.189±.004) ø6 (ø.236) ø3.3 hole for ø3 screw 23.20 (.913) 4 (.157) .50 (.02) .50 (.02) 13 (.512) 9.80 (.386) 4.50 (.177) 3.50 (.138) Dimensions: mm (in.)

ATL60

Abstract: R345
Contextual Info: PKC ATL60 CMOS Gate Array cell data sheets 3.3 DESCRIPTION: clock driver buffer Truth Table: I | O -0 | 0 1 | 1 at60IO_step80 PKC O I VDD! p N45<0:23> I I370 DATA IODRVKC OP ON O at60IO n at60IO N53<0:23> IIN_LINE_RES_467 O R345 VSS! / $Revision: 1.27 $

CDIP1-T16

Abstract: qml-38535 GDFP2-F16 GDIP1-T16 smd code Yj 33
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED Changes in accordance with NOR 5962-R345-92 - tvn 9 2 -1 0 -0 5 Monica Poelking Changes in accordance with NOR 5962-R137-96 - les 96 - 06 - 05 Michael A. Frye Add a new package outline letter F - tdn 97 - 08 - 07

S5050

Contextual Info: SAW Resonator R34501 Features z 1-port Resonator z Quartz Frequency Stabilization z For transmitters or Local Oscillators 5.00±0.15 1.2±0.15 8 7 7 1 2 6 6 2 3 5 5 3 4 1.27±0.05 1 1.35±0.15 5.00±0.15 8 0.6±0.15 2.08±0.15 Package Dimension – S5050 4

TVL320AIC3106

Abstract: AIC3106 RJ9 connector BLMG1P500SPT TVL320 RPACK8-10 HALO HFJ11-2450E-L21 connector Rj9 HFJ11-2450E-l21 MHC-W21-601
Contextual Info: OMAP-L137 Evaluation Module Technical Reference 2008 DSP Development Systems OMAP-L137 Evaluation Module Technical Reference 511345-0001 Rev. A November 2008 SPECTRUM DIGITAL, INC. 12502 Exchange Drive, Suite 440 Stafford, TX. 77477 Tel: 281.494.4505 Fax: 281.494.5310

1553B

Contextual Info: ProtoBox -1553B Kit A Hammond 1553B soft-side plastic enclosure packaged with a matching ProtoBoard 2-hole per strip PCB. BusBoard Prototype Systems - Built for designers www.BusBoard.net sales@busboard.net BPS-MAR-KIT-1553B-001 Rev 3.00 ProtoBox-1553B - ProtoBoard + Box

DS377

Contextual Info: IDT 89EB-LOGAN-19 Evaluation Board Manual Evaluation Board: 18-692-001 February 2011 6024 Silver Creek Valley Road, San Jose, California 95138 Telephone: (800) 345-7015 • (408) 284-8200 • FAX: (408) 284-2775 Printed in U.S.A. 2011 Integrated Device Technology, Inc.

T2D DIODE 94

Abstract: QE R518 T2D DIODE 46 EPC1PC8 QE r517 crystal j3f SG-8200 resistor r336 r331 r322 r330 r1 QE r525 qe r524
Contextual Info: LXD9781 PQFP Demo Board with FPGAs for RMII-to-MII Conversion Developer Manual January 2001 As of January 15, 2001, this document replaces the Level One document Order Number: 249043-001 LXD9781 PQFP Demo Board with FPGAs for RMII-to-MII Conversion User Guide.

s134 p-mosfet

Abstract: 74hc260 Mitsumi D359T3 D359T3 schematic diagram inverter lcd monitor fujitsu 62256-10 BERG STRIP teac fd 235hf stepping motor mitsumi mitsumi floppy
Contextual Info: frt Page 1 Thursday, August 8, 1996 12:36 PM ÉlanSC300 Microcontroller Evaluation Board User’s Manual evalbd.book : frt Page 2 Thursday, August 8, 1996 12:14 PM ÉlanSC300 Microcontroller Evaluation Board, Revision 1.1 1996 by Advanced Micro Devices, Inc.

Mitsumi D359T3

Abstract: D359T3 Video Card AVED AV540 mitsumi floppy d359* mitsumi SCHEMATIC TRIDENT VGA board EPROM AMD s134 p-mosfet stepping motor mitsumi 62256-10
Contextual Info: evalbd.book : frt Page 1 Thursday, August 8, 1996 2:34 PM ÉlanSC310 Microcontroller Evaluation Board User’s Manual evalbd.book : frt Page 2 Thursday, August 8, 1996 2:34 PM ÉlanSC310 Microcontroller Evaluation Board, Revision 1.0 1996 by Advanced Micro Devices, Inc.

intel g41 crb

Abstract: AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42 schematic intel g41 g31 crb socket am3 pinout g41 crb MOSFET BA7 intel G41 MOTHERBOARD crb LGA1366 ISL6334EVAL1Z
Contextual Info: Technical Brief 486 ISL6334EVAL1Z User Guide Board Specifications 1. Intel VR11.1 compliant. 2. 4-Phase, 130W, 400kHz, Load Line = 0.8mΩ. 3. Socket: LGA1366, die sensing, can be configured for motherboard sensing. 4. 6 Layer Board: Top/Bottom - 0.5oz plated, 1.5oz

h22 8-pin

Abstract: J68 10A PL-20A DC3BE J119 J1266 1J44 PL34A JITo-2-dc3 J127
Contextual Info: ORLI10G ver. 1.5 1 01/29/03 Lattice Semiconductor Corp SECTION PAGE LAYOUT OF ORLI10G BOARD: 3 CONNECTORS AND JUMPERS J1 TO J127: 4 CONNECTORS CON1 TO CON5: 18 ADJUSTABLE RESISTORS: 22 ORLI10G ver. 1.5 2 01/29/03 Lattice Semiconductor Corp Layout of ORLI10G board:

D405 voltage regulator

Abstract: j526 Zener C450 schottkey DIODE c19 J529 panasonic d208 zener st c507 0805X7RHT104K j327 C520 silicon
Contextual Info: CDB5376 Multichannel Seismic Evaluation System Features General Description z The CDB5376 board is used to evaluate the functionality and performance of the Cirrus Logic multichannel seismic chip set. Data sheets for the CS3301, CS3302, CS4373A, CS5371/72, and CS5376A devices should be

ND R433

Abstract: sharc 21xxx architecture block diagram ELEC5M DTM-803 dip4 SWT018 schematic diagram epson r230 CT3-42 D25S24AGX00LF IDC 14 F DTF-803
Contextual Info: SHARC Audio EZ-Extender® Manual Revision 1.0, September 2009 Part Number 82-000223-01 Analog Devices, Inc. One Technology Way Norwood, Mass. 02062-9106 a Copyright Information 2009 Analog Devices, Inc., ALL RIGHTS RESERVED. This document may not be reproduced in any form without prior, express written

LTC1518

Abstract: LTC1685 R345
Contextual Info: RELIABILITY DATA LTC1518 / 19 / 20 / 35 / LTC1685 / 1686 / 1687 / 1694 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE SIDEBRAZE SOIC/SOT/MSOP 65 0040 593 9601 658 • PRESSURE COOKER TEST AT 15 PSIG, +121°C PACKAGE TYPE SAMPLE

DFDH2012T900S

Abstract: LPC 815 LG F11YT1 HAT2180RP G402R P06KE GP03S ara cd 100 39p LPC TPM 0603FT
Contextual Info: 1-fid e n tic i Iw in iie a u Model : F11YT1 R:0 Intel Yonah ULV+Calistoga 945GM+ICH7-M Revision History ORIGINAL RELEASE A B 2006/01/12 Rev:B release. c 2006/03/17 R e v :C release. 2006/03/31 R e v :0 release. PCB STA C K U P LAY1 LAY2 LAY3 LAY4 LAY5

transistor SMD w26

Abstract: t2d 04 panasonic 74HC595 SMD AA7 smd diode smd diode u1j DIODE SMD b14 smd transistor ab2 SMD H24 smd diode af3 smd w20
Contextual Info: BGA Demo Board with FPGAs for SMII-to-MII Conversion Developer Manual January 2001 As of January 15, 2001, this document replaces the Level One document LXD9782 — BGA Demo Board with FPGAs for SMII-to-MII Conversion. Order Number: 249051-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

FUN-JIN

Abstract: FUN-JIN ft40 PHJ8-2ROW FT40-801S ip108 FT1-M4-4023E ip101 BAYCOM FT1-M4-4023E 40ST1041AX P23S
Contextual Info: 5 4 Power Module Page 2 1 EEPROM 24C02/8 D EEDAT EECLK Page 7 IP101 Fiber or Web management Extend Interface Port 25/26 C 2 PCB 1 AC 110V -> DC 3.3V/5A D 3 CPU_DAT CPU_CLK IP1726 MII 1 MII 2 TF320 RS232 3.3V->1.8V 24 SS-SMII + 2 MII 10/100M Switch Controller

C495 transistor

Abstract: r3272 MB2100H SN74LVC244A 14pin mc-156 32,768khz m1535d M1535 ah1 c541 c5470 EG-2121CA-125
Contextual Info: 4 3 2 1 D C B A D PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE

NV18

Abstract: isl6247 transistor SMD w26 Socket AM2 Compal Electronics SMD SOT23 A53 rt8101l p25 BTQ00 RTL8101L compal
Contextual Info: A B C D E 1 2 1 BTQ00 Rev1.0 Schematics Document 2 Intel Prescott uFCPGA-478 / P4 Northwood with Springdale / ICH5 / nVIDIA NV18/34/31M chipset 2003/05/15 3 3 4 4 Compal Electronics, Inc. Title THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

ni usb 6212

Abstract: SS-00259-1 C2060 C2055 C2068 quanta C2096 R2067 915GM SW1010CPT
Contextual Info: 1 2 3 4 5 478 PIN micro FC-PGA 14, 15, 15w , 17w inch XGA, SXGA+ A LVDS LCD P7 P3,4 400/533 MHz A LVDS Alviso DVI M24/M26 UNBUFFERED DDRII SODIMM DDRII 400/533 P10 915GM/PM R/G/B CRT P9 R/G/B UNBUFFERED DDRII SODIMM DDRII 400/533 1257 PIN (micro FCBGA) PCIE 16Lanes

RG82845MP

Abstract: 103KT2125-1P R53 thermistor compal rf switch s195 EPCOS T251 RG82845M LPC47N254 x71 sot23 mm74hct32m
Contextual Info: 5 4 3 2 1 D D Lindbergh Schematic C C uFCPGA Northwood 2003-03-10 Rev:A01 B B A A Compal Electronics, Inc. Title Cover Sheet Size Document Number Rev A01 ADQ00/LA-1351 Date: 5 4 3 2 Monday,March10,2003 1 Sheet 1 of 52 5 4 3 2 Compal confidential 1 Block Diagram

sk 8050 rf

Abstract: smd diode 815b C8050 schottky C475 DIODE 2C101 m15 fah 001 8 24VDc R5C592 LTN154X1-L02 W83L950 BGA144F
Contextual Info: SERVICE MANUAL FOR 8050 BY: Grass.Ren Repair Technology Research Department /EDVD Feb.2004 8050 N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………. 1.1 Introduce ……………………………………………………………………………………………….

sis 962l

Abstract: 301LV 93lc468 SIS 740 sc728 RT8110 sis962l CMI9739A lc949 CMI9739
Contextual Info: 5 4 3 2 1 Power Now Clock Gen. PAGE 5 AMD Mobile Duron CPU RTC,VCC3,VCC5 PAGE 10 Sideband Bus SYSTEM POWER PAGE 22 PAGE 38 Thermal D D PAGE 2,3,4 Clock Buffer CHARGER &SELECTOR PAGE 11 PAGE 34 S2K Bus CRT North Bridge PAGE 15 BAT.LOW&OVER.T Memory Bus SiS 740