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    R1766 Datasheets (2)

    Samsung Electronics
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    R1766
    		Samsung Electronics Original PDF 92.93KB 6
    R1766(T)
    		Samsung Electronics Original PDF 92.93KB 6
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    R1766 Price and Stock

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    Bimba Manufacturing Company NR-176.625-RP

    CYLINDER, O.L., NON-ROT,1-1/2IN BORE; STROKE: 6.625IN; REV ACT REAR PIVOT MT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS NR-176.625-RP Bulk 5 Weeks 1
    • 1 $228.51
    • 10 $210.23
    • 100 $210.23
    • 1000 $210.23
    • 10000 $210.23
    		Get Quote

    Bimba Manufacturing Company NR-176/6-DXPB

    CYLINDER, O.L., 3-POSITION
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS NR-176/6-DXPB Bulk 5 Weeks 1
    • 1 $328.75
    • 10 $305.74
    • 100 $305.74
    • 1000 $305.74
    • 10000 $305.74
    		Get Quote

    Bimba Manufacturing Company HLSR-176.625-DPKWY

    CYLINDER, HYDRAULIC, O.L., LOW PRESSURE HL; NO MAGNET; CHROME PLATED SS ROD (SR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS HLSR-176.625-DPKWY Bulk 5 Weeks 1
    • 1 $175.98
    • 10 $175.98
    • 100 $175.98
    • 1000 $175.98
    • 10000 $175.98
    		Get Quote

    Vishay Intertechnologies TNPW08053K01BEEA

    Thin Film Resistors - SMD 3.01Kohms .1% 25ppm
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI TNPW08053K01BEEA Reel 5,000 5,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.14
    		Buy Now

    SOURIAU-SUNBANK D38999/20FG41SN

    Circular MIL Spec Connector 41P Sz 21 Wall Mount Recpt Socket Cont
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI D38999/20FG41SN Each 142 1
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    Find more R1766 price and stock on Findchips.com

    R1766 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    EMC4000

    Abstract: MEC5004 MEC5004 ECE5018 ECE5018 dell inverter pinout isl6260 pinout dell battery HAL00 nvg72m macallan IV SIO pinout
    Contextual Info: A B C D E COMPAL CONFIDENTIAL 1 MODEL NAME : HAL00 PCB NO : LA-2792 COMPAL P/N : 45135731L01 1 Travis DIS Schematics Document 2 2 uFCPGA Mobile Yonah Intel Calistoga + ICH7M 2006-01-20 REV : 1.0 (DELL: A00) 3 3 4 4 DELL CONFIDENTIAL/PROPRIETARY MB PCB Part Number


    Original     		hal00la-279245135731l01daa0000050l+11daa0000051litem19emc4000mec5004mec5004 ece5018ece5018dell inverter pinoutisl6260pinout dell batterynvg72mmacallan iv sio pinout PDF

    3331p

    Abstract: cpu la 100u 1p0 LA-3331P R1851 NVIDIA G84 mxm-III Socket AM2 Compal Electronics R1651 c1583
    Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Merom uFCPGA with Intel Crestline_PM+ICH8-M core logic 3 3 2006-11-10 REV:0.4 4 4 Compal Secret Data Security Classification 2006/04/13 Issued Date 2006/06/30 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL


    Original     		la-3331p3331pcpu la 100u 1p0r1851+6nvidia g84mxm-iiisocket am2compal electronicsr1651c1583 PDF

    R1766

    Abstract: R-1766 gg 42 R-1661 TM650 fr4 94v0
    Contextual Info: 多層プリント配線板用材料 ガラスエポキシマルチ （FR-4） コア材 （両面銅張） R-1766 プリプレグ R-1661 ガラス布基材エポキシ樹脂多層プリント配線板用材料 •特長 ●二次積層成形性が良く層間接着力に優れています。


    Original     		r-1766r-1661020mm220mm+8012mm018mm035mm070mmr1766gg 42tm650fr4 94v0 PDF

    94v0

    Abstract: m 94v-0 94v-0 GE4F 94-V0 94VTM-0 JIS PP7F R-8700 R1551 94v-0 cem-3
    Contextual Info: 材料分類別品種一覧 分類 商品名 狭ピッチ対応ハロゲンフリー半導体パッケージ基板用材料 狭ピッチ対応ハロゲンフリー半導体パッケージ基板用材料 ― ― ― ― 狭ピッチ対応ハロゲンフリー半導体パッケージ基板用材料


    Original     		r-1515hr-1515br-1515sr-1410s+16r-5715er-5775r-5670r-5725r-5620r-212594v0m 94v-094v-0ge4f94-v094vtm-0jis pp7fr-8700r155194v-0 cem-3 PDF

    JIS-C-6481

    Abstract: JISC6481 R1766 R1766T R-1766 C648 TM650 94v0 080
    Contextual Info: 多層プリント配線板用材料 高耐熱ガラスエポキシマルチ （FR-4） コア材 （両面銅張） R-1766（T） プリプレグ R-1661（T） ガラス布基材エポキシ樹脂多層プリント配線板用材料 •特長 ■用途


    Original     		r-1766r-1661fr-41020mm+11012mm018mm035mm070mmjis-c-6481jisc6481r1766r1766tc648tm65094v0 080 PDF

    AR8112

    Abstract: ICS9LPRS387BKLF SLG8SP556V KB926Qf atheros AR8121 LS-4493P PFAF250E128 4835b kb926 FBMA-L11-322513-201LMA40T
    Contextual Info: A B C D E 1 1 Compal Confidential 2 2 KAL90/KALH0 M/B Schematics Document Intel Penryn Processor with Cantiga + DDRII + ICH9M 2008-12-17 3 3 REV:1.0 4 4 2008/11/10 Issued Date Compal Electronics, Inc. Compal Secret Data Security Classification 2008/11/17 Deciphered Date


    Original     		kal90/kalh0kal90kalh0ar8112ics9lprs387bklf+8slg8sp556vkb926qfatheros ar8121ls-4493ppfaf250e1284835bkb926fbma-l11-322513-201lma40t PDF

    HP Keyboard KB 0316

    Abstract: kbc 1070 nu kbc 1070 HP Keyboard KB 0316 connector la-3261p G548A2 MAX8776 isl6260 820UE FCBGA-1299
    Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Merom uFCPGA with Intel Crestline_PM+ICH8-M core logic 3 3 IBT00 LA-3261P UMA 2007-03-28 REV:1A MV2 4 4 Compal Secret Data Security Classification 2006/02/13 Issued Date 2006/03/10 Deciphered Date


    Original     		ibt00la-3261pla3261php keyboard kb 0316+8kbc 1070 nukbc 1070hp keyboard kb 0316 connectorg548a2max8776isl6260820uefcbga-1299 PDF

    c1583

    Abstract: cpu la 100u 1p0 LA-3331P SST25LF080A_SO8-200mil bq24703 R1851 MTX-A1 isl6260 R5C853 compal la-3331p
    Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Merom uFCPGA with Intel Crestline_PM+ICH8-M core logic 3 3 2007-01-16 REV:0.5 4 4 Compal Secret Data Security Classification 2006/04/13 Issued Date 2006/06/30 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL


    Original     		la-3331pc1583cpu la 100u 1p0sst25lf080a_so8-200mil+6bq24703r1851mtx-a1isl6260r5c853compal la-3331p PDF

    LA-4491P

    Abstract: A4491 AR8112 C2078 C2052 SLG8SP556V kal90 la-4491p C2096 JAL90 AMD dual gpu schematics
    Contextual Info: A B C D E 1 1 Compal Confidential 2 2 KAL90 M/B Schematics Document Intel Penryn Processor with Cantiga + DDRII + ICH9M 2008-10-30 3 3 REV:1.0 4 4 2008/03/28 Issued Date Compal Electronics, Inc. Compal Secret Data Security Classification 2008/09/20 Deciphered Date


    Original     		kal90a4491la-4491par8112+7c2078c2052slg8sp556vkal90 la-4491pc2096jal90amd dual gpu schematics PDF

    R1766

    Contextual Info: Data Sheet NE5550979A R09DS0031EJ0300 Rev.3.00 Mar 12, 2013 Silicon Power LDMOS FET FEATURES • • • • • High Output Power : Pout = 39.5 dBm TYP. VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 25 dBm High power added efficiency : ηadd = 66% TYP. (VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 25 dBm)


    Original     		ne5550979ar09ds0031ej0300iec61000-4-2ne5550979a-a+1r1766 PDF

    r1566

    Abstract: R-1566 R1766 R-1551 R1551 TM650 24C24
    Contextual Info: ハロゲン系難燃剤を 使用していません。 （当社現行商品 R-1766比） ガラス布基材エポキシ樹脂多層プリント配線板用材料 •特長 ■用途 ●ハロゲン化合物アンチモンを使用せず94Ｖ-0達成 しています。


    Original     		r-1566r-1551r-1766020mm+10220mm012mm018mm035mm070mmr1566r1766r1551tm65024c24 PDF

    SN0806081

    Abstract: LS-4495P C1900 PCB SN0806081RHBR LS-4493P AR8121-AL1E LS-4921P kb926 SLG8SP556V AR8131-AL1E
    Contextual Info: A B C D E 1 1 Compal Confidential 2 2 KALH0 /KAL90+ /KALG0 M/B Schematics Document Intel Penryn Processor with Cantiga + DDRIII + ICH9M 2009-3-4 3 3 REV:1.0 4 4 2008/11/24 Issued Date 2009/12/31 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL


    Original     		/kal90kal90sn0806081ls-4495p+8c1900 pcbsn0806081rhbrls-4493par8121-al1els-4921pkb926slg8sp556var8131-al1e PDF

    F3J inverter board

    Abstract: D9302 it8511te F3J inverter IT8511 a2051 asus c5121 00 F3J INVERTER CABLE Intel t9300
    Contextual Info: 5 Block Diagram 61 02 System Setting 62 C * 63 * 04_CPU-Merom HOST 64 ISA ROM 05 05_CPU-Merom(PWR) 65 SPI ROM * 66 B A GDDR2 32Mx16 x4 07_CRESTLINE(HOST) 67 * 08 08_CRESTLINE(DMI & CFG) 68 DC & BAT IN 09 09_CRESTLINE(GRAPHIC) 69 * 10 10_CRESTLINE(DDR2) 70


    Original     		m7x/66-mgen-ics9lpr363aglf-t05g001405010gpio12+12c2940r1761f3j inverter boardd9302it8511tef3j inverterit8511a2051asusc5121 00f3j inverter cableintel t9300 PDF

    74n7

    Abstract: R1766T
    Contextual Info: Data Sheet NE5550234 R09DS0039EJ0300 Rev.3.00 Mar 12, 2013 Silicon Power MOS FET FEATURES • • • • • High Output Power : Pout = 33.0 dBm TYP. VDS = 7.5 V, IDset = 40 mA, f = 460 MHz, Pin = 15 dBm High power added efficiency : ηadd = 68% TYP. (VDS = 7.5 V, IDset = 40 mA, f = 460 MHz, Pin = 15 dBm)


    Original     		ne5550234r09ds0039ej0300ne5550234-az74n7+1r1766t PDF

    kbc 1070 nu

    Abstract: SMSC KBC 1021 HP Keyboard KB 0316 la-3261p kbc 1070 compal HP multibay R1782 R1453 isl6260
    Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Merom uFCPGA with Intel Crestline_PM+ICH8-M core logic 3 3 IBT00 LA-3261P UMA 2006-11-16 REV:0.6 SI-2 4 4 Compal Secret Data Security Classification 2006/02/13 Issued Date 2006/03/10 Deciphered Date


    Original     		ibt00la-3261pla3261pkbc 1070 nu+8smsc kbc 1021hp keyboard kb 0316kbc 1070compalhp multibayr1782r1453isl6260 PDF

    RS1046

    Abstract: Inventec Motherboard ls 36 a02 intel g31 motherboard max1987 42a22 DIMM DDR4 connector Inventec schematic L4004 L1029
    Contextual Info: DIAMuunpubis MV B- BUILD FINAL 2008/08/21 Engineer INVENTEC David Du Drawn by David Du R&D CHK Size TITLE A3 DIAMOND DOC CTRL CHK MFG ENGR CHK Changed by EE2 Date Changed Thursday, August 21, 2003 Time Changed 11:19:38 am QA CHK VER A02 Model Number PC8803


    Original     		pc880328ddr-sdram-449multibay29ati-m10-p-1+1650usbv/5v/12v30ati-m10-p-2ati-m10-p-3ati-m10-p-411itchrs1046inventecmotherboard ls 36 a02intel g31 motherboardmax198742a22dimm ddr4 connectorinventec schematicl4004l1029 PDF

    Panasonic R1766

    Contextual Info: A Business Partner of Renesas Electronics Corporation. Data Sheet NE5550234 R09DS0039EJ0300 Rev.3.00 Mar 12, 2013 Silicon Power MOS FET FEATURES • • • • • High Output Power : Pout = 33.0 dBm TYP. VDS = 7.5 V, IDset = 40 mA, f = 460 MHz, Pin = 15 dBm


    Original     		ne5550234r09ds0039ej0300ne5550234-azhs350+1panasonic r1766 PDF

    R-4737

    Abstract: R-1755S JISK7113 R1766 R-1755 R4737 R1755S JISK6911 R1755C R1786
    Contextual Info: 特性一覧表 《参考値》 【板厚：1.6mm】 （R-1515H, R-1515B, R-1515Sは0.8mm。また貫層耐電圧は全て0.2mmです。） 試験項目 比重 比熱 熱伝導率 ポアソン比 試験方法 JISK6911 DSC法 レーザーフラッシュ法


    Original     		6mmr-1515hr-1515br-1515s0jisk6911+13jisk7113r-1515hr-1515sr-5715er-5775r-4737r-1755sr1766r-1755r4737r1755sr1755cr1786 PDF

    LA-3331P

    Abstract: 3331p compal la-3331p la 3331p nvidia mxm g92 cpu la 100u 1p0 C1278 compal U/25/20/TN26/15/850/compal la-3331p R1734
    Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Merom uFCPGA with Intel Crestline_PM+ICH8-M core logic 3 3 2007-05-15 REV:1.0 4 4 Compal Secret Data Security Classification 2006/04/13 Issued Date 2006/06/30 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL


    Original     		la-3331p3331pcompal la-3331pla 3331p+6nvidia mxm g92cpu la 100u 1p0c1278compalu/25/20/tn26/15/850/compal la-3331pr1734 PDF

    UL796

    Abstract: fr4 94v0 UL746E FR4105 UL746A R1561 UL746B r1566 GE4F E81336
    Contextual Info: •UL規格 材料 部品・中間製品 最終製品 UL （Underwriters Laboratories.lnc） は 積層板 プリント配線板 テレビ・ラジオ 米国の火災保険業者によって、1894年に UL746E UL94 UL796 UL94 UL1492 設立された非営利の試験機関で、火災、盗


    Original     		ul746eul796ul1492ul746a+8ul746bul60950fr4 94v0fr4105r1561r1566ge4fe81336 PDF

    r1566

    Abstract: R1766 R-1566 175m 0.3mm
    Contextual Info: 多層プリント配線板用材料 厚銅箔 プレマルチ •材質 プリント配線板加工において銅箔の熱膨張の影響を受けやす いため低熱膨張である材料を推奨しています。 参考値 材料 熱膨張係数（ppm）厚さ方向（α1 ）


    Original     		r-1566r-176618105m105175m+4r1566r1766175m0.3mm PDF

    ne5550

    Contextual Info: A Business Partner of Renesas Electronics Corporation. Data Sheet NE5550779A R09DS0040EJ0300 Rev.3.00 Mar 12, 2013 Silicon Power LDMOS FET FEATURES • • • • • High Output Power : Pout = 38.5 dBm TYP. VDS = 7.5 V, IDset = 140 mA, f = 460 MHz, Pin = 25 dBm


    Original     		ne5550779ar09ds0040ej0300ne555077ne5550 PDF

    Panasonic R1766

    Contextual Info: A Business Partner of Renesas Electronics Corporation. Data Sheet NE5550979A R09DS0031EJ0300 Rev.3.00 Mar 12, 2013 Silicon Power LDMOS FET FEATURES • • • • • High Output Power : Pout = 39.5 dBm TYP. VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 25 dBm


    Original     		ne5550979ar09ds0031ej0300iec61000-4-2panasonic r1766 PDF

    MCL-E-679 hitachi

    Abstract: DS 7408 Doosan MCL-E-679 R1766 doosan 7409 Isola FR406 MCL-E-67 hitachi DS 7408 toshiba TLC LCD toshiba tlc
    Contextual Info: Multi Layer Board Multi Layer Board • INTRODUCTION Multi Layer Board MLB technology evolves at a faster pace every day. Multiprocessor scaling and differential impedance requirements, coupled with the need for faster high-performance materials, is driving circuit density and layer counts upward.


    Original     		135/dsc130/tma150/dsc145/tma+13/100secc-96/20/65c-96/20/6mcl-e-679 hitachids 7408 doosanmcl-e-679r1766doosan 7409isola fr406mcl-e-67 hitachids 7408toshiba tlclcd toshiba tlc PDF