QFP-128 20 X 14 PAD Search Results

LQFP-48 thermal pad

Abstract: exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144
Contextual Info: Thermal Characteristics of IC Assembly method for using this board is specified by the SEMI standard G38-87. These standards are available in the SEMI International Standards book, Volume 4, for packaging. INTRODUCTION The purpose of this document is to provide a centralized

MICROPROCESSOR Z80

Abstract: uPD72020 uPC5102 transistor 2p4m UPD6487 2SD1557 2SJ 3305 UPD77529 TRANSISTOR SOD MARKING CODE 352A micro servo 9g tower pro
Contextual Info: The export of these products from Japan is regulated by the Japanese government. The export of some or all of these products may be prohibited without governmental license. To export or re-export some or all of these products from a country other than Japan may also be prohibited without a license from that country. Please call

OBD II Protocol ISO 9141

Abstract: SC510727 Common rail injector service manuals MC9S12XDP384 electric assisted power steering system motor LED DRIVER 16pin QFP circuit diagram obd diagnostic Common rail injector driver SG187 switch circuit diagram af remote control door lock
Contextual Info: Automotive Quarter 3, 2005 SG187 Rev 21 About This Revision–Q3/2005 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.

OBD II Protocol ISO 9141

Abstract: SC510727 advantages of microcontroller mc9s08aw16 sg2023 relay K-line interface mc9s12dg256 code example assembly electric assisted power steering system motor circuit diagram obd diagnostic SG187 Common rail injector service manuals
Contextual Info: Automotive Quarter 4, 2005 SG187 Rev 22 About This Revision–Q4/2005 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.

V850E/IA1

Abstract: tower pro sg 90 micro servo testing motherboards using multi meter uPD63761 DVD CD 5888 CB nec 70F3210 DVD CD 5888 F3015BY V850E2 core RX-OSEK850
Contextual Info: The V850 Series of high-performance microcontrollers answers many different application system needs. It realizes superlatively low power consumption and low noise while offering high performance and a wide array of functions. The broad V850 product lineup provides optimum solutions for the nextgeneration systems of customers.

micro servo 9g

Abstract: uPa2003 micro servo 9g tower pro 2SK1060 uPD3599 201 Zener diode 2SK2396 upc1237 infrared sensor TSOP - 1836 2SK518
Contextual Info: The export of these products from Japan is regulated by the Japanese government. The export of some or all of these products may be prohibited without governmental license. To export or re-export some or all of these products from a country other than Japan may also be prohibited without a license from that country. Please call

S1L50552

Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
Contextual Info: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells

MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR

Abstract: uPD65837 uPD65869 X17512 upd65839 RF Transistors Ceramic MARKING F25 marking code F302 535 D65841 uPD65851 X46358
Contextual Info: Design Manual CMOS-8L Family CMOS Gate Array Ver. 5.0 Document No. A12158EJ5V0DM00 5th edition Date Published June 1999 N CP(K) 1997, 1998 Printed in Japan 1 [MEMO] 2 Design Manual A12158EJ5V0DM00 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS

9s08dz32

Abstract: 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882
Contextual Info: Automotive Quarter 4, 2007 SG187Q42007 Rev 29 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad

EPM7128

Abstract: EPM7128 PLCC EPM7128-15 100-Pin Package Pin-Out Diagram
Contextual Info: EPM7128 EPLD □ □ □ □ □ □ H ig h -d en sity C M O S EPLD based on seco n d -g en eratio n M A X architecture 2,500 usable gates Combinatorial speeds with t PD = 10 ns Counter frequencies up to 100 MHz Advanced 0.8-m icron CM OS EEPROM technology

Contextual Info: M AX 7000 IVI M A Î U U U Includes MAX 7000E Programmable Logic Device Family M arch 1995, ver. 3 Features. D a ta s h e e t • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance CMOS EEPROM devices based on secondgeneration Multiple Array M atrix MAX architecture

r12n10

Abstract: EMP7032 max7000
Contextual Info: Includes MAX7000E M A Y IVI M A 7 0 0 0 / UUU Programmable Logic Device Family March 1995, ver. 3 Features. Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance CMOS EEPROM devices based on secondgeneration Multiple Array MatriX MAX architecture

AN 7823

Abstract: 100L JESD51-2 JESD51-7 Techpoint
Contextual Info: MQFP-d Heat Spreader Metric Quad Flat Pack • 14 x 14mm to 32 x 32mm • 64 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 14mm to 32 x 32mm STATS ChipPAC’s Heat Spreader Metric Quad Flat Pack MQFP-d is a thermally enhanced version of the QFP

EPM7160-3

Abstract: EPM7160-1
Contextual Info: EPM7160 EPLD □ Figure 25. EPM7160 Package Pin-Out Diagrams o .; ü n j - Ï û Package outlines not drawn to scale. See Tables 9 and 10 in this data sheet for pin-out information. ; o in n n n n n n n n n n n n n n n n n I/OC □ i/o □ I/O VCC C I/O c

EPM5130

Abstract: EPM5130A-15 74N10
Contextual Info: EPM5130 EPLD Features • ■ ■ ■ ■ ■ ■ ■ ■ High-density, 128-macrocell, general-purpose MAX 5000 EPLD 128 macrocells optimized for pin-intensive applications, easily integrating over 60 TTL MSI and SSI components High-speed multi-LAB architecture

mp 9141 es

Abstract: MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L
Contextual Info: Automotive Quarter 4, 2010 SG187Q42010 Rev 40 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad range of

S1D15719

Abstract: S1D15722D01B S1D15719D22B S1D15714D01E s1d13517 S1D15722 Matrix CCD "line sensor" Epson epd driving S1D15712 S1D15721D01B
Contextual Info: CMOS LSIs Product Catalog 2009 SEIKO EPSON CORPORATION CMOS LSIs Contents Configuration of product number . 2 1 ASICs Application Specific IC 1-1 Gate Arrays . 4

EPM5130

Abstract: D1398
Contextual Info: EPM 5130 EPLD High-density, 128-macrocell, general-purpose MAX 5000 EPLD 128 macrocells optimized for pin-intensive applications, easily integrating over 60 TTL MSI and SSI components High-speed multi-LAB architecture tPD as fast as 15 ns Counter frequencies up to 83.3 MHz

100L

Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Contextual Info: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP

EPM7160

Abstract: EPM7160 PLCC CN-TC01 H6062
Contextual Info: ALTERA CORP bfiE D • 05^5375 G003253 013 H A L T EPM7160 EPLD Features ^ □ □ □ □ □ High-density, erasable CMOS EPLD based on second-generation MAX architecture 3,200 usable gates Combinatorial speeds with tPD = 12 ns Counter frequencies up to 90.9 MHz

QFP11

Contextual Info: EPM7160 EPLD □ □ □ □ □ □ H igh-density, erasable C M O S EP LD b a se d on second-generation M A X architecture 3,200 u sab le gates C om bin atorial sp e e d s w ith t PD = 12 ns C oun ter frequen cies u p to 90.9 M H z A d v an ced 0.8-m icron C M O S EEPR O M technology

GPL12A

Abstract: ax 2008 lqfp 48 lcd 8X32 32768HZ R32K SPL12A GPL11 EG23
Contextual Info: GPL12A 8K BYTES MICRO-CONTROLLER WITH LCD DRIVER Aug. 7, 2008 Version 1.2 GENERALPLUS TECHNOLOGY INC. reserves the right to change this documentation without prior notice. TECHNOLOGY INC. is believed to be accurate and reliable. Information provided by GENERALPLUS

k1377

Abstract: MPA1064DH B1582 M20214 MPA1064KE MPA1016DD MPA1016FN MPA1000 MPA1036DH MPA1036FN
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPA1000 Product Description future design migration efforts. The combination of automatic tools and gate level architecture is ideal for traditional schematic driven or high level language based design methodologies. In fact, logic synthesis tools were originally

mb87020

Abstract: tag 9335 MB87086 MB87086A FPF21C8060UA-92 2M X 32 Bits 72-Pin Flash SO-DIMM prescaler fujitsu mb506 MB3776A mb501l MB506 ULTRA HIGH FREQUENCY PRESCALER
Contextual Info: F U J I T S U Master Product Selector Guide FUJITSU MICROELECTRONICS, INC. Visit our web site for the latest information: http://www.fujitsumicro.com Customer Response Center: For semiconductor products, flat panel displays, and PC cards in the U.S., Canada and Mexico,