PHILIPPINES Search Results

QMI 509 epoxy

Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 023401 VERSION 2.0 GI July, 2004 32-lead SOIC package using Sumitomo EME 6600HR Mold Compound, MSL1 Cypress Philippines CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Principal Reliability Engineer

Contextual Info: R E V IS IO N S E C NO C Y 1A -515A DATE 2 0 1 3 /0 8 /3 C REV J D E S C R IP T IO N CHANGE THE LABELING CONTENT FOR PRODUCTS T R A N S F E R TO PHILIPPINES C Y 1 2 -5 3 0 1 2 0 1 3 /0 9 /1 2 K CHANGE THE LABELING CONTENT FOR PRODUCTS T R A N S F E R TO PHILIPPINES

DALLAS SEMICONDUCTOR D52401

Abstract: D52401 DALLAS SEMICONDUCTOR Ds12887 ds1232 DS1285 DS12885 DS12887 DS12887A DALLAS SOIC PRODUCT CHANGE Dallas Semiconductor Ds12887A
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: May 23, 1995 Subject: PRODUCT CHANGE NOTICE – D52401 Description: Final Electrical Test Being Qualified in Anam, Philippines Description of Change: Anam, Philippines is being qualified as an alternate site for final electrical testing. All of the test hardware and software will be identical to that used in the Dallas Semiconductor test operations and will

cel 9200

Abstract: hitachi mold cel CY7C199-VC cda 199 Hitachi CEL 9200 9200 hitachi 8361H JESD22
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 000405 VERSION 1.1 July, 2000 SOJ 28 Leads Hitachi Cel 9200 Molding Compound Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069

premier

Abstract: Premier 5 programs
Contextual Info: Intel e-Business Network Program Benefit Table Notes 1. Applicable only to complete built-up systems 2. Applicable only in Australia & New Zealand 3. Applicable only for Celeron processors PROGRAM BENEFITS 4. Not applicable in Philippines, Vietnam and PRC

BAI 59

Abstract: plaskon FBGA PACKAGE thermal resistance
Contextual Info: Cypress Semiconductor Package Qualification Report 000201 VERSION 1.0 October, 2000 48 Fine Pitch Ball Grid Array FBGA Level 3 7mm x 7 mm Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069

WM-034M

Abstract: WM034B WM-034B WM-034
Contextual Info: Microphone Cartridges Omnidirectional Electret Condenser Microphone Cartridge Series: WM-034M/034N • Features ● Available only outside of Japan ● Available only from the Philippines ● Useful for tape recorders, toys, telephones, and almost any other applications

PCN0801

Abstract: hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4
Contextual Info: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0801 ALTERNATIVE MANUFACTURING SITE FOR EPCS FAMILY Change Description This is an update to PCN0801; please see the revision history table for information specific to this update. Altera introduced Amkor Philippines as an alternative assembly manufacturing site for the Altera

Texas Instruments Philippines

Abstract: SN74AHC1G04
Contextual Info: TEXAS INSTRUMENTS Initial Notification for 5 Pin DCK Package to be Built at PSI Technologies, Inc. in Manila, Philippines February 17, 1999 Abstract Texas Instruments Inc, Standard Linear and Logic Products SLL is qualifying PSI Technologies, Inc. subcontractor site in Manila, Philippines to build the 5 pin SC-70 package (DCK). This package is

Texas Instruments Philippines

Abstract: UA78M05C UA78M05CKTP
Contextual Info: TEXAS INSTRUMENTS Errata to Final Notification for 2 Pin KTP Package to be Built at PSI Technologies, Inc. in Manila, Philippines October 23, 1998 Abstract Texas Instruments Inc, Standard Linear and Logic Products SLL has completed qualification of PSI Technologies, Inc. subcontractor site in Manila, Philippines to build the 2 pin

STM, mold compound

Abstract: Texas Instruments 7410 Precon Texas Instruments Philippines UA7805CKTE TEXAS INSTRUMENTS, Mold Compound
Contextual Info: TEXAS INSTRUMENTS Final Notification for 3 KTE and 5 KTG PowerFLEX Package to be Built at PSI Technologies, Inc. in Manila, Philippines December 17, 1998 Abstract Texas Instruments, Inc. Standard Linear and Logic Products SLL has qualified PSI Technologies,

philips 433-2

Abstract: el 817 PHILIPS 966 india cities philips ks
Contextual Info: MAIN MAIN MENU MENU SALES OFFICES Philips Components - a worldwide company Australia: Philips Components Pty Ltd, NORTH RYDE, Tel. 02 9805 4455, Fax. (02) 9805 4466. Philippines: Philips Semiconductors Philippines Inc., METRO MANILA, Tel. (02) 816 6345, Fax. (02) 817 3474.

SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

Contextual Info: Press Release CYPRESS NAMES MANAGING DIRECTOR OF PHILIPPINES PLANT SAN JOSE, California . April 22, 1999 - Cypress Semiconductor Corporation today announced the appointment of Daniel T. Javelosa as managing director of its assembly and test plant in the Philippines.

MP-8000

Abstract: MP8000 mosfet 1500v 1000H 15KHZ MIC4128YME TM2016 soic 8l ep fortune date Code mic4127
Contextual Info: RELIABILITY REPORT DATE: 2/15/05 QUALITY ENG : PURPOSE: Micrel 408 435-3476 Dual Low Side MosFet Driver Family QUAL VEHICLE : PACKAGE TYPE : MIC4126BME 1.5A Epad Soic 8L .150 MIC4127BME 1.5A MIC4128YME 1.5A ASSEMBLY LOC M/C D/C # FAB LOC LOT # PROCESS Amkor Philippines

140C

Abstract: 8361H CEL9200 JESD22 copper bond wire
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97173 VERSION 2.0 February, 1998 28 Ld TSOP Package 150 x 150 Pad Size Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP QTP# 97173, V. 2.0 Page 2 of 4 February, 1998

EME-7351

Abstract: 140C 8361H JESD22 sumitomo silver epoxy
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97514 VERSION 1.0 July, 1998 28 Ld TSOP Package Sumitomo EME-7351 Molding Compound Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 28 Ld TSOP QTP# 97514, V. 1.0 Page 2 of 4

MIL-STD-883-5005

Abstract: phil QMI2419 CY27H010-WMB EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES CY7C199-DMB Cypress Semiconductor Qualification Report
Contextual Info: Cypress Semiconductor Qualification Report QTP# 98366 VERSION 1.0 September, 1999 16 Lead to 40 Lead Cerdip - Commercial and Military Amertron Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Manager 408 432-7068 Cypress Semiconductor

128H

Abstract: 140C 8361H CEL9200 JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97227 VERSION 1.0 June, 1997 100 Pins TQFP Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: TQFP QTP# 97227, V. 1.0 Page 2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION

Contextual Info: June 2013 Passive components sales offices ● Head office Philippines Plant Philippines Block No.5, Calamba Premiere International Park, Batino, Calamba, Laguna, Manila, Philippines 4027 Te l:+63 - 49- 545- 0422 E-mail:donna@samsung.com 206, Cheomdansaneop Road,

DONG YANG power supply

Abstract: dong yang TAIYO YUDEN taiyo
Contextual Info: GLOBAL NETWORK I S 0 9 0 0 0 '> U - X • IS O 1 4 O O 1 0 R B E £ flk ^ P - A ; U Ä a Ä « l i E i t 9 J “C 1 t 7 R - h U S * -, CHICAGO TRDA Main Products TAIYO YUDEN SINGAPORE TAIYO YUDEN (PHILIPPINES) TA IY O YU D E N DE M E X IC O TA IYO YU D EN (SA RA W A K )

ADV9912

Abstract: MO-151 Assembly Locations
Contextual Info: CUSTOMER ADVISORY FineLine BGA Packages Altera is adding ASAT and ASE as additional sources of supply for the FineLine BGA packages currently assembled by ANAM in the Philippines and Korea. This change will affect the FineLine BGA package outline thickness*, which will result in a

6016

Abstract: ON SEMICONDUCTOR TRACEABILITY On semiconductor SOIC Traceability DALLAS SOIC PRODUCT CHANGE
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: 11/6/97 Subject: PRODUCT CHANGE NOTICE - J71601 Description: Alternate Assembly Site for 8 Lead SOIC (150mil), AAPI – Amkor Philippines

ADV0601

Abstract: altera top marking EP1K100 altera marking Code epf10k30a altera EPM7032B PCL 27 EP1C12 EP1K10 EP20K30E EP20K60E
Contextual Info: CUSTOMER ADVISORY ADV0601 Rev01 ADDITION OF ASSEMBLY PLANT FOR FBGA PACKAGES Change Description: Amkor, Philippines, will be added as an additional assembly source for Altera FineLine BGA® FBGA and Ultra FineLine BGA (UBGA) packages using BT-based substrates. This will not affect the current moisture rating for these packages. The current

On semiconductor SOIC Traceability

Abstract: DALLAS SOIC PRODUCT CHANGE K7030 PHILIPPINES ALTERNATE SOURCE FOR
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: 11/11/97 Subject: PRODUCT CHANGE NOTICE - K70301 Description: Alternate Assembly Site for 16 Lead SOIC (300mil), AAPI – Amkor Philippines Description of Change: