PGA PACKAGE WEIGHT Search Results

JEDEC Package Code MS-026-AED

Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Contextual Info: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

Contextual Info: White Electronic Designs WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Access Times of 15, 17, 20ns Low Power CMOS Low Voltage Operation TTL Compatible Inputs and Outputs Packaging Fully Static Operation: • 66-pin, PGA Type, 1.075 inch square, Hermetic

WS512K32V-XXX

Abstract: WS512K32V-XG2UX
Contextual Info: White Electronic Designs WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Access Times of 15, 17, 20ns Low Power CMOS Low Voltage Operation TTL Compatible Inputs and Outputs Packaging Fully Static Operation: • 66-pin, PGA Type, 1.075 inch square, Hermetic

WF1M32B-XXX3

Abstract: WF1M32B-XG2TX3 1m 0880
Contextual Info: White Electronic Designs WF1M32B-XXX3 1Mx32 3.3V Flash Module FEATURES • Access Times of 100, 120, 150ns ■ Boot Code Sector Architecture Bottom Packaging ■ Low Power CMOS, 1.0mA Standby • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401)

Contextual Info: White Electronic Designs WF128K32-XXX5 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES Commercial, Industrial and Military Temperature Ranges Access Times of 50*, 60, 70, 90, 120, 150ns Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400

WF128K32-XXX5

Abstract: 5962-9471604HAX
Contextual Info: White Electronic Designs WF128K32-XXX5 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES Commercial, Industrial and Military Temperature Ranges Access Times of 50*, 60, 70, 90, 120, 150ns Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400

WSF41632-22XX

Contextual Info: WSF41632-22XX 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE PRELIMINARY* FEATURES FLASH MEMORY FEATURES • Access Times of 25ns SRAM and 120ns (FLASH) ■ 10,000 Erase/Program Cycles ■ Packaging • 66-pin, PGA Type, 1.385 inch square HIP, Hermetic Ceramic HIP (Package 402)

WS128K32V-XG1UX

Abstract: WS128K32V-XG2TX WS128K32V-XH1X
Contextual Info: WS128K32V-XXX 128Kx32 3.3V SRAM MULTICHIP PACKAGE PRELIMINARY* FEATURES • Access Times of 15*, 17, 20, 25, 35ns ■ 3.3 Volt Power Supply ■ Low Voltage Operation ■ Low Power CMOS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic

Contextual Info: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES • Access Times of 70, 85, 100, 120ns ■ 5V Power Supply ■ Packaging ■ Low Power CMOS • 66 pin, PGA H 1 Type, 1.185 inch square, Hermetic Ceramic HIP (Package 401).

Contextual Info: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES Access Times of 15*, 17, 20, 25, 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging 5 Volt Power Supply • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400 .

Contextual Info: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES Access Times of 15, 17, 20, 25, 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging 5 Volt Power Supply • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400 .

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Contextual Info: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

WEDF1M32B-XG2TX5

Abstract: WEDF1M32B-XHX5 WEDF1M32B-XXX5 1m 0880
Contextual Info: WEDF1M32B-XXX5 HI-RELIABILITY PRODUCT 1Mx32 5V FLASH MODULE ADVANCED* FEATURES • ■ ■ ■ ■ ■ ■ Access Times of 70, 90, 120ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 • 68 lead, 22mm Low Profile CQFP, 4.6mm (0.180"),

WEDF1M32B-XXX5

Abstract: WEDF1M32B-XG2TX5 WEDF1M32B-XHX5 1m 0880
Contextual Info: White Electronic Designs WEDF1M32B-XXX5 ADVANCED* 1Mx32 5V Flash Module FEATURES Access Times of 70, 90, 120ns Packaging: Organized as 1Mx32, user configurable as 2Mx16 or 4Mx8. • 66 pin, PGA Type, 1.185” square, Hermetic Ceramic HIP Package 401 Commercial, Industrial and Military Temperature

WS1M32-XG3X

Abstract: S1M32
Contextual Info: WS1M32-XXX White Electronic Designs 1Mx32 SRAM MODULE FEATURES • Access Times of 17, 20, 25ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging • 84 lead, 28mm CQFP, Package 511 ■ TTL Compatible Inputs and Outputs • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP

Contextual Info: WF128K32-XXX5 128KX 32 5V FL ASH MODULE, SMD 5962-94716 FEATURES n Access Times of 50*, 60, 70, 90, 120, 150ns n 5 Volt Programming. 5V ± 10% Supply n Packaging: n Low Power CMOS, 1mA Standby Typical •66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400

transistors BC 458

Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

EP20K100E

Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

ep600i

Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

Contextual Info: Audio Switching Amplifier AD1990 FEATURES GENERAL DESCRIPTION Integrated stereo modulator and power stage <0.002% THD + N 101 dB dynamic range A-weighted 2 x 5 W output power (4 Ω, <0.01% THD + N) RDS-ON < 0.3 Ω (per transistor) PSRR > 65 dB On-off-mute pop noise suppression

Contextual Info: Audio Switching Amplifier AD1992 FEATURES GENERAL DESCRIPTION Integrated stereo modulator and power stage <0.002% THD + N 102 dB dynamic range A-weighted 2 x 10 W output power (4 Ω, <0.01% THD + N) RDS-ON < 0.3 Ω (per transistor) PSRR > 65 dB On-off-mute pop noise suppression

Contextual Info: w WM8758B Stereo CODEC with Headphone Driver and Line Out DESCRIPTION FEATURES The WM8758B is a low power, high quality stereo CODEC designed for portable applications such as MP3 audio player. Stereo CODEC: • DAC SNR 100dB, THD -86dB ‘A’ weighted @ 48kHz

FM stereo headset

Abstract: J-STD-020B WM8978 circuit diagram 2.1 speaker amplifier
Contextual Info: w WM8978 Stereo CODEC With Speaker Driver DESCRIPTION FEATURES The WM8978 is a low power, high quality stereo CODEC designed for portable applications such as multimedia phone, digital still camera or digital camcorder. Stereo CODEC: • DAC SNR 98dB, THD -84dB ‘A’ weighted @ 48kHz