CQFP Search Results

Contextual Info: EEPROM AS8ER128K32 Austin Semiconductor, Inc. 128K x 32 EEPROM PIN ASSIGNMENT Radiation Tolerant EEPROM Memory Array Top View 68 Lead CQFP • • RES\ A0 A1 A2 A3 A4 A5 CS3\ GND CS4\ WE1\ A6 A7 A8 A9 A10 Vcc AVAILABLE AS MILITARY SPECIFICATIONS I/O0 I/O1

Contextual Info: Com m ercial/Industrial D ev ice s PLCC 44 68 84 PQFP 100 144 160 208 240 RQFP 208 240 VQFP 80 TQFP 100 144 BGA 225 176 272 313 CPGA 329 84 100 132/133 175/176 207 257 CQFP 84 132 172 196 208 256 HiRel/Space D evice RadTolerant < o o 12 x CM CO X 5 A </

Contextual Info: MECHANICAL DATA MCQF002 – NOVEMBER – 1995 HBB S-CQFP-G128 CERAMIC QUAD FLATPACK 0,40 0,23 0,13 96 65 0,07 M 64 97 128 33 1 0,13 NOM 32 12,40 TYP Gage Plane 14,20 SQ 13,80 16,20 SQ 15,80 0,05 MIN 1,45 1,35 0,25 0°– 7° 0,75 0,45 Seating Plane 0,08

Contextual Info: MECHANICAL DATA MCFP033 – OCTOBER 1994 HGA S-CQFP-F128 CERAMIC QUAD FLATPACK 96 65 64 97 0,35 TYP 0,80 128 33 0,15 TYP 1 32 24,80 TYP 3,46 3,12 28,10 SQ 27,90 32,30 SQ 31,70 0,20 MIN 0°– 5° 1,20 0,80 Seating Plane 0,10 3,68 MAX 4040118 / B 03/95 NOTES: A. All linear dimensions are in millimeters.

Contextual Info: MECHANICAL DATA MCQF003B – DECEMBER 1996 HBY R-CQFP-G64 CERAMIC QUAD FLATPACK 0,40 0,20 1,00 51 33 32 52 18,00 17,20 14,20 13,80 12,00 TYP 64 20 1 19 0,15 NOM 18,00 TYP 20,20 19,80 24,40 23,60 0,25 MIN 0°– 7° 1,18 0,78 Seating Plane 0,10 4,26 MAX 4081543/D 08/96

WS1M32V-XG3X

Contextual Info: White Electronic Designs WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Built-in Decoupling Caps and Multiple Ground Pins

Contextual Info: WE512K16-XG4X 512Kx16 CMOS EEPROM MODULE FEATURES  Access Time of 140, 150, 200ns  Page Write Cycle Time: 10ms Max  Packaging:  Data Polling for End of Write Detection  Hardware and Software Data Protection • 68 lead, 40mm Hermetic CQFP Package 501

Contextual Info: WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES  Access Times of 17, 20, 25ns  3.3V Power Supply  84 lead, 28mm CQFP, Package 511  Low Power CMOS  Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8

WS1M32-XG3X

Contextual Info: WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as

WS256K64-XG4WX

Contextual Info: WS256K64-XG4WX 256Kx64 SRAM MODULE ADVANCED* FEATURES • Access Times 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: ■ Commercial, Industrial and Military Temperature Range ■ 5 Volt Power Supply ■ Low Power CMOS • 116 lead, 40mm, Hermetic CQFP Package 504

Contextual Info: WS128K48V-XG4WX 128Kx48 3.3V SRAM MODULE ADVANCED* FEATURES • 2V Data Retention Devices Available Low Power Version ■ Access Times 15, 17, 20, 25ns ■ Packaging ■ TTL Compatible Inputs and Outputs • 116 Lead, 40.0mm Hermetic CQFP (Package 504) ■ Weight

Contextual Info: WHITE /MICROELECTRONICS WC32P020-XXM 68020 FEATURES • Selection of Processor Speeds: 16.67, 20, 25 MHz ■ M ilita ry Temperature Range: -55 °C to + 1 2 5 °C ■ Packaging • 114 pin Ceramic PGA P2 • 132 lead Ceramic Quad Ratpack, CQFP (Q2) ■ High-Performance Asynchronous Bus Is Nonmultiplexed and

Contextual Info: a WS1M32-XG3X WHITE /MICROELECTRONICS 1Mx32 SRAM MODULE FEATURES • A c c e s s T im e s of 17, 20, 25ns Low Pow er CM OS ■ 84 lead, 28mm CQFP, Packag e 511 Built-in Decoupling Caps and M u ltip le Ground Pins fo r Low Noise Operation ■ Organized as tw o banks of 5 1 2K x3 2 , U ser C o nfig urable as

Contextual Info: a WHITE /MICROELECTRONICS 512Kx48SRAM MODULE WS512K48-XG4WX ADVANCED* FEATURES • ■ ■ ■ A ccess Tim es 17, 20, 25, 35ns ■ 2V D ata R etention Device Packaging: ■ TTL C om p atible Inputs and O utputs • 116 Lead, 40.0m m H e rm e tic CQFP Package 504

CERAMIC QUAD FLATPACK CQFP

Abstract: A103A
Contextual Info: MECHANICAL DATA MCQF010A – FEBRUARY 1996 – REVISED APRIL 1999 HFN S-CQFP-F408 CERAMIC QUAD FLATPACK WITH TIE BAR 3.850 (97,79) TYP 2.674 (67,92) SQ 2.626 (66,70) 0.225 (5,72) 0.175 (4,45) 2.525 (64,13) TYP 1 102 ”A” 103 408 Á Á Á Á Á 2.820 (71,73)

WS1M32V-XG3X

Contextual Info: White Electronic Designs WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Built-in Decoupling Caps and Multiple Ground Pins

Contextual Info: FLASH AS8F512K32 Austin Semiconductor, Inc. 512K x 32 FLASH PIN ASSIGNMENT FLASH MEMORY ARRAY Top View AVAILABLE AS MILITARY SPECIFICATIONS • • 68 Lead CQFP (Q & Q1) SMD 5962-94612 MIL-STD-883 FEATURES • • • • • • • • • • • •

Contextual Info: PRELIMINARY SPECIFICATION EEPROM Austin Semiconductor, Inc. PIN ASSIGNMENT 128K x 32 Radiation Tolerant EEPROM Top View 68 Lead CQFP RES\ A0 A1 A2 A3 A4 A5 CS3\ GND CS4\ WE1\ A6 A7 A8 A9 A10 Vcc AVAILABLE AS MILITARY SPECIFICATIONS • MIL-STD-883, para 1.2.1 compliant

Contextual Info: FLASH AUSTIN SEMICONDUCTOR, INC. AS8F1M32 Austin Semiconductor, Inc. FIGURE 1: PIN ASSIGNMENT Top View 1M x 32 FLASH 68 Lead CQFP OPTION • Timing 90ns 120ns 150ns 62 61 65 63 64 67 66 01 02 68 05 03 06 04 59 12 78 13 57 14 76 I/O5 I/O6 I/O7 GND I/O8 I/O9

Contextual Info: SRAM AS8S128K32 Austin Semiconductor, Inc. 128K x 32 SRAM PIN ASSIGNMENT SRAM MEMORY ARRAY Top View 68 Lead CQFP (Q & QT) AVAILABLE AS MILITARY SPECIFICATIONS • SMD 5962-95595: -Q or -QT • SMD 5962-93187: -P or -PN • MIL-STD-883 FEATURES • Access times of 20, 25, 35, 45 ns

AS8SLC512K32

Contextual Info: SRAM AS8SLC512K32 Austin Semiconductor, Inc. 512K x 32 SRAM PIN ASSIGNMENT Top View SRAM Memory Array MCM 68 Lead CQFP (Q) FEATURES • • • • I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 GND I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.A 64 CERAMIC QUAD FLATPACK PACKAGE CQFP Rev 5, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 64 0.025 (0.635) BSC 49 1 PIN 1 INDEX AREA 48 0.567 (14.40)

PQFP chip size

Abstract: transistor ZR cqfp package outline FLATPACK ceramic package cerdip z PACKAGE J-Lead, plcc package on package chips
Contextual Info: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK CQFP SOJ

WF4M32-XXX5

Contextual Info: White Electronic Designs WF4M32-XXX5 PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package 502), 3.5mm (0.140") height.