PC523 Search Results

Contextual Info: PC523 Linear ICs Adjustable Negative Voltage Regulator status Military/High-RelN Load Current Max. A 200m Min. Adjustable Output Voltage Max. Adjustable Output Voltage Output Voltage Nominal (V)6.0 Drop-Out Volt Max. P(D) Max. (W)500m Nom. Supp (V)28 Supply Voltage Maximum (V)28

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Contextual Info: SERVICE MANUAL & TROUBLESHOOTING GUIDE FOR 7170 BY： Richard Wang TESTING TECHNOLOGY DEPARTMENT / TSSC JUL. 2001 7170 N/B MAINTENANCE CONTENTS 1. Hardware Engineering Specification- 3

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Contextual Info: SERVICE MANUAL FOR 8575A 8 5 7 5 A BY: Sissel Diao TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Aug . 2002 8575A N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………

CP2211

Abstract: VT1634 ac14g mitac 8 W83L950 LM358 K8N800 h55 MOTHERBOARD CIRCUIT diagram ICS952007 cb-1410
Contextual Info: SERVICE MANUAL FOR 8889 BY: Star Meng Repair Technology Research Department /EDVD Nov.2004 8889 N/B Maintenance Contents 1. Hardware Engineering Specification ……………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………………. 4

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Contextual Info: PRESTIGIO NOBILE 150 TECHNICAL SERVICE MANUAL Contents 1. Hardware Engineering Specification ………………………………………………………………………. 4 1.1 Introduction ………………………………………………………………………………………………………………… 4

VT8372

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Contextual Info: SERVICE MANUAL FOR 8381 BY: Valley.Hu Repair Technology Research Department /EDVD Jul.2003 8381 N/B Maintenance Contents 1. Hardware Engineering Specification - 3 1.1 Introduction - 3

AC82PM45

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Contextual Info: A B C D E 1 1 KIWA7/A8 2 2 Schematics Document Mobile Penryn uFCPGA with Intel Cantiga_GM/PM+ICH9-M core logic 3 3 REV:0.4 4 4 Issued Date Compal Electronics, Inc. Compal Secret Data Security Classification 2008/03/25 Deciphered Date 2008/04/ Title THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

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Contextual Info: SERVICE MANUAL FOR 8089P BY: Ally.Yuan Repair Technology Research Department /EDVD Mar.2004 8089P N/B Maintenance Contents 1. Hardware Engineering Specification ………………………………………………………………………. 4 1.1 Introduction ………………………………………………………………………………………………………………… 4

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Contextual Info: SERVICE MANUAL FOR 8666 BY: Star Meng Repair Technology Research Department /EDVD Apr.2005 / R01 8666 N/B Maintenance Contents 1. Hardware Engineering Specification ……………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………………. 4

G1410

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Contextual Info: 1 2 3 4 6 7 8 BL3 VCC_CORE CPU CORE SENTECH SC451 5 Page:25 CLOCK GEN RTM865-300 Yonah Celeron-M +3VPCU A +3VPCU +3V_S5/+3VSUS +3V +5VSUS/+5V 10V/15V A +3V_S5 INTEL Mobile_479 CPU SOCKET_M +3VSUS Page:2, 3 +3V +5VSUS +5V HOST BUS 533MHZ 10V/15V +1.8V_S5 MAXIM

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Contextual Info: A B C D E 1 1 Compal confidential Schematics Document Mobile Penryn uFCPGA with Intel Cantiga_PM+ICH9-M core logic 2 2 2008-02-25 3 3 www.kythuatvitinh.com 4 4 Compal Secret Data Security Classification 2008/02/25 Issued Date 2008/02/25 Deciphered Date Title

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Contextual Info: SERVICE MANUAL FOR 8081 BY: Sissel Diao Repair Technology Research Department /EDVD Jul. 2003 8081 N/B Maintenance Contents 1. Hardware Engineering Specification ………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………… 4

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Contextual Info: SERVICE MANUAL FOR 8640 8640 BY: Dragon Jiang TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Nov .2002 8640 N/B Maintenance Contents 1. Hardware Engineering Specification -1.1 Introduction -1.2 System Overview -1.3 System Hardware -1.4 Electrical Characteristic -

CX20561

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Contextual Info: 1 2 3 4 5 6 7 8 VER : E3D Description 31TE1MB0010 TE1M MB PM45/RB/MS WO CPU 31TE1MB0120 TE1M MB(PM45/MAIN/RB/HDMI/CIR)WO CPU 31TE1MB0130 TE1M MB(GM45/EXP/NO CIR/MS)WO CPU 31TE1MB0140 TE1M MB(GM45/GS/EXP/MS)WO CPU 31TE1MB0170 TE1M MB(GM45/GS/EXP/LC)WO CPU PENRYN

PU503B

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VT1611A

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Contextual Info: SERVICE MANUAL FOR 8500 BY: Sissel Diao TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Aug . 2002 8500 N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………

VT1634

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Contextual Info: 8 7 6 Model Name 5 4 3 PCB Name 8889CF 2 Version M/B R01 Project Code Phase PVT G268 D 1 D Schematics Page Index PAGE01 Cover Sheet PAGE02 System Block Diagram PAGE03 Power Block Diagram PAGE04 CPU-K8 1/2 PAGE05 CPU-K8 (2/2) PAGE06 VIA K8N800A (1/2) PAGE 7 VIA K8N800A (2/2)

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Contextual Info: SERVICE MANUAL FOR 8355 BY: Rain Li Repair Technology Research Department /EDVD Nov.2003 8355 N/B MAINTENANCE Contents 1. Hardware Engineering Specification ………………………………………………………………… 4 1.1 Introduction …………………………………………………………………………………………………………. 4

KB926

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Contextual Info: A B C ZZZ ZZZ1 ZZZ2 ZZZ3 PCB LA-5081P LS-5081P LS-5082P D E 1 1 DAZ@ DAZ@ DAZ@ KIWA5/A6 2 2 Schematics Document Mobile Penryn uFCPGA with Intel Cantiga_GM/PM+ICH9-M core logic 3 3 REV:1.0 4 4 Issued Date Compal Electronics, Inc. Compal Secret Data Security Classification

LF-H72P

Abstract: intel 945 motherboard repair diagram str 50113 intel chipset 945 motherboard repair 2310 dhi motherboard hannstar 9172-24 d506 intel chipset 845 motherboard repair circuit Hannstar motherboard HANNSTAR
Contextual Info: SERVICE MANUAL FOR 8175 BY: Jacey Liu TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Mar . 2002 8175 N/B MAINTENANCE CONTENTS 1. Hardware Engineering

RCA SK CROSS-REFERENCE

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Contextual Info: 1969 o < 00 x ic e uo <r\ *—4 rO O CM u J 'r < o o o CO r aJ. rfrr.~> y -< z X— < P“ -J Sem iconductor Annual At .0008" Dia. . . . there is no second source phire orifice insert. Tempress also created and supplied the tungsten carbide ultrasonic bonding tool and pioneered

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Abstract: 8081 motherboard Intel 8081 prestigio prestigio cavaliere 143 TM41PUC2311-2 UJDA750 Mitsumi D353FUE CD224E r5c475 r5c485
Contextual Info: PRESTIGIO CAVALIERE 143 TECHNICAL SERVICE MANUAL TECHNICAL SERVICE MANUAL Prestigio Cavaliere 143 Contents 1. Hardware Engineering Specification ………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………… 4

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Contextual Info: 1 2 3 4 5 6 7 REV 8 D E S C R I P T ION OF CHANGE ECR DATE A P P ROVAL R00 uPGA2 with GEYSERVILLE technology 9/14 '99 R01 1. Modify the CPU CORE voltage switching P.3 circuit. 2. Correcting BX Strapping Option circuit. P.4 10/20 '99 3. Correcting parallel port pull-high