PAL22VP10 Search Results

Contextual Info: PAL22V10C _ PAL22VP10C Universal PAL Device SEMICONDUCTOR Features • • Ultra high speed supports today’s and tomorrow’s fastest microprocessors 10 user>programmable output macrocells — Output polarity control — Registered or combinatorial

P10CF-10PC

Contextual Info: PAL22V10CF _ PAL22VP10CF ^ SEMICONDUCTOR Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpo = 7.5 ns — t§u = 3 ns — fM AX — 2 new feedback paths PAL22VP10CF • Synchronous PRESET, asynchronous

Contextual Info: PAL22V10G PAL22VP10G PRELIMINARY ” I CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tgu = 2.5 ns — fMAX = 153.8 MHz • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­

L22V10C-10PC

Contextual Info: PAL22V10C PAL22VP10C y CYPRESS Universal PAL Device B iC M O S process and Ti-W fuses, the PAL22V10C and PAL22VP10C use the fam iliarsum -of-products A N D -O R logic structure and a new concept, the program ­ m able m acrocell. • 10 user-programmable output

Contextual Info: bSE D • ESÔTbbS G D l P M n 221 ■ CYP PAL22V10G PAL22VP10G PRELIMINARY r CYPRESS SEMICONDUCTOR Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — t|ij > = S ns Universal PAL Device ■—-Registered or combinatorial

sumitomo 131 datasheet

Abstract: HTSSL sumitomo epoxy EME-6300H
Contextual Info: Qualification Report Augusst, 1994 QTP# 94073 & 94232 Version 1.0 BiCMOS PLD Marketing Part # Description PAL22V10G Universal PAL Device PAL22VP10G Universal PAL® Device PLD20G10G Generic 24-Pin PAL® PAL is registered trademark of Monolithic Memories Inc.

PAL22V10C-7JC

Abstract: 22V10C 22V10C-10 CERAMIC LEADLESS CHIP CARRIER PAL22V10C-10JC K73 Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC PAL22V10C10DC PAL22V10C7JC PAL22VP10C-10JC
Contextual Info: PAL22V10C PAL22VP10C CYPRESS • 10 user-programmable output macrocells — Output polarity control — Registered or combinatorial operation — 2 new feedback paths PAL22VP10C • Synchronous PRESET, asynchronous RESET, and PRELOAD capability for flexible design and testability

10DC IR 3 PINS

Contextual Info: PAL22V10C PAL22VP10C CYPRESS SEMICONDUCTOR • Ultra high speed supports today's and tomorrow's fastest microprocessors — tp j * user-programmable output macrocells — Output polarity control BiCMOS process and Ti-W fuses, the PAL22V10C and PAL22VP10C use the

10DC IR 3 PINS

Contextual Info: PAL22V10C PAL22VP10C PRELIMINARY CYPRESS SEMICONDUCTOR Features • • — 10-ns tpu, 90-M H z, Tmax BiCMOS technology • lip to 22 inputs and 10 outputs for more logic power • • Variable product terms High reliability — Proven Ti-W fuse technology

ersa 111

Contextual Info: CYPRESS SEMI CONDUCTOR bSE D • HSf l TbbS QQI QMOI *CYP PAL22V10CF PAL22VP10CF CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 7.5 ns — tsu = 3 n s — fltfAX = 100 MHz — Drives SO-pF load C l

22V10C

Abstract: PAL22V10C-7DC
Contextual Info: — . _ PAL22V10C _ PAL22VP10C SEMICONDUCTOR Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 6 ns — tsu = 3 ns — fMAX = 117 MHz • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­

PAL22

Contextual Info: PAL22V10C PAL22VP10C CYPRESS SEMICONDUCTOR Universal PAL Device BiCMOS process and Ti-W fuses, the PAL22V10C and PAL22VP10C use the familiar sum-of-products AND-OR log­ ic structure and a new concept, the pro­ grammable macrocell. • 10 user-programmable output

Contextual Info: PAL22V10CF PAL22VP10CF CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 7.5 ns — tsu = 3 ns — f\lA X = 100 MHz — Drives 50-pF load C l — 2 new feedback paths (PAL22VP10CF) • Synchronous PRESET, asynchronous

22V10C

Contextual Info: PAL22V10C PAL22VP10C Universal PAL Device CYPRESS Features • Ultra high speed supports today's and tomorrow’s fastest microprocessors — tpi = 6 ns — txir = 3 ns -fM AX = H 7 M H z • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­

22V10G-7

Contextual Info: m f CYPRESS Features — f[HAX = 1 6 6 MHz External • Reduced ground bounce and under­ shoot • PLCC and LCC packages w ith addi­ tional Vc c and V ss pins for lowest ground bounce • Up to 22 inputs and 10 outputs for more logic power Synchronous PRESET, asynchronous

Device-List

Abstract: cf745 04 p 24LC211 lattice im4a3-32 CF775 MICROCHIP 29F008 im4a3-64 ks24c01 ep320ipc ALL-11P2
Contextual Info: Device List Adapter List Converter List for ALL-11 JUL. 2000 Introduction T he Device List lets you know exactly which devices the Universal Programmer currently supports. The Device List also lets you know which devices are supported directly by the standard DIP socket and which

22V10G

Contextual Info: PRELIMINARY r0 CYPRESS • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpo = 4 ns — ts = 2.5 ns — fMAX = 166 M Hz External • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­ tional V cc and Vs s pins for lowest

PAL22V10-20

Abstract: fuse smd marking L7 PAL22V10-12 PAL22Y10 5962-86053
Contextual Info: REVISIONS LTR DATE YR-MO-DA DESCRIPTION Add device type 05 to the drawing for vendor CAGE 34335. Add vendor CAGE 01295 for device type 04LX, 043X, and 04KX. Add footnote 9 to table I, subgroups 9, 10, and 11 testing. Changes to vendor similar part number for vendor CAGE 01295.

cy7c9101

Abstract: CY2901 CY7C190 PLD20RA10 CY2149 CY7C122 CY7C148 CY7C149 CY7C150 22V10-Macrocell
Contextual Info: Military Product Selector Guide Static RAMs Size Organization 64 64 1K 1K 4K 4K 4K 4K 4K 8K 8K 16K 16K 16K 16K 16K 16K 16K 16K 16K 32K 32K 32K 32K 32K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 256K 256K 256K 256K 256K 256K 256K 1M 1M

Contextual Info: This is an abbreviated datasheet. C ontact a Cypress representative for complete specifications. For new designs, please refer to the PALC22V10D or PAL22V10G. CYPRESS Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors

Device-List

Abstract: NEC D2716D novatek nt68f63 nt68f63 NEC D2732D D2716D 16V8H-25 ATMEL 220 24C16 D2732D 16V8H-15
Contextual Info: LabTool-48 Version 4.67 <ALL> Device List Page 1 of 20 ACTRANS AC29LV400B *44PS AC29LV400B *48TS AC29LV400T *44PS AC29LV400T *48TS ALi M6759 M6759 *44 M6759 *44Q M8720 Alliance AS29F040 AS29LV800T *48TS AS29LV800B *44PS AS29LV800B *48TS AS29LV800T *44PS Altera

CY27S03A

Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Contextual Info: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability

NEC D2732D

Abstract: nt68f63 novatek nt68f63 d2716d NEC D2716D atc 93lc46 D2732D CIRCUIT NEC D2716D TMS87C510 16V8H-25
Contextual Info: Dataman-48 Version 4.30 <ALL> Device List ALi M6759 www.dataman.com M6759 *44 M6759 *44Q M8720 AS29LV800B *44PS AS29LV800B *48TS AS29LV800T *44PS Altera EP1210 EP220 EP312 EP330 EP900 EP910-T EPC1064 EPC1213 EPC1441 as 1213 EPM3064A *44 EPM5192 @84 EPM7032AEas7032 *44

EP600PC

Abstract: gal22v8 GAL22CV10 EP600PC-3 DPLD610-25 EP600DC-3 PPLD610-25 ep600pc-45 EP910PC-40 EP900PC
Contextual Info: PinPin-Compatible PEEL Array Cross Reference Package, speed and power options Altera EP312 EP600PC EP600PC-45 EP600PC-3 EP600DC* EP600DC-3* EP610PC-35 EP610PC-30 EP610PC-25T EP610PC-25 EP610PC-20T EP610PC-20 EP610PC-15T EP610PC-15 EP610PI-30 EP610DC-35*