PACKAGE SPECIFICATION Search Results

reel

Abstract: KCPSX04 300PCS Package 200PCS
Contextual Info: SMD DISPLAY TAPE SPECIFICATIONS KCSX02 PACKAGE: 650PCS / REEL KCDX02 PACKAGE: 300PCS / REEL KCSX03 PACKAGE: 550PCS / REEL KCDX03 PACKAGE: 300PCS / REEL KCDX04 PACKAGE: 250PCS / REEL KCPDX04 PACKAGE: 250PCS / REEL KCSX04 KCPSX04 NOTE: 1. All dimensions are in millimeters

LG ai 0068

Abstract: sot162ag jedec Package TO-39
Contextual Info: Philips Semiconductors Objective specification Package information Package outlines PACKAGES Packages in ascending order of packages outline version PACKAGE OUTLINE VERSION CODE RENAMED PACKAGE VERSION CODE (NON­ STANDARD) PACKAGE NAME DESCRIPTION PAGE

10C2

Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension

324pc

Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension

psop 1

Abstract: psop 44 221D PSOP
Contextual Info: PSOP: 44 LEAD PLASTIC SMALL OUTLINE PACKAGE DRAWING 23 44 A2 C φ E D L DETAIL A 22 1 D A A1 e b Y SEE DETAIL A 44 Lead PSOP Specifications Package Height Standoff Package Body Thickness Lead Width Lead Thickness Package Body Length Package Body Width Pitch

56-Lead

Abstract: ssop-56 945 524
Contextual Info: SSOP: 56 LEAD SHRINK SMALL OUTLINE PACKAGE E He A2 A3 Q L Detail A D A B e1 Y C A1 See Detail A 56 Lead SSOP Specifications Rev. C, 1/5/95 Package Height Standoff Package Body Thickness Lead Width Lead Thickness Package Body Length Package Body Width Pitch

FX315P2

Abstract: mX 1524 pin diagram FX315LG FX315 CML marking
Contextual Info: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed below. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number

SO8C

Abstract: TNY264G PI-275 TO220-7 smd transistor 8c P08A 0403 20 PIN SMD IC TNY264 eDIP-12 p08c
Contextual Info: Package Information Package Design Specifications, Tape & Reel and Assembly Information Package Design Specifications TO-220-7C Y Package .165 (4.19) .185 (4.70) .390 (9.91) .420 (10.67) .146 (3.71) .156 (3.96) .108 (2.74) REF + .045 (1.14) .055 (1.40) .234 (5.94)

221D

Abstract: PSOP44
Contextual Info: Version 1.0 PSOP: 44 LEAD PLASTIC SMALL OUTLINE PACKAGE DRAWING 23 44 A2 C φ E D L DETAIL A 22 1 D 1 A A1 e Y b SEE DETAIL A 44 Lead PSOP Specifications Package Height Standoff Package Body Thickness Lead Width Lead Thickness Package Body Length Package Body Width

PACKAGE DIMENSIONS

Abstract: G3 Package
Contextual Info: D3 PACKAGE DIP Package Dimensions inches mm G3 PACKAGE Gullwing SMD Package Dimensions inches (mm) Specifications subject to change without notice. Rhombus Industries Inc. For other values & Custom Designs, contact factory. D3G3 15801 Chemical Lane, Huntington Beach, CA 92649-1595

FX315P2

Abstract: FX315 FX315LG
Contextual Info: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed below. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number

eSOP-12

Abstract: TNY264G P08A TNY264 kose eSIP-7C PI-52 forced draft cooling tower eDIP-12 TL183
Contextual Info: Package Information Package Design Specifications, Tape & Reel and Assembly Information Package Design Specifications TO-220-7C Y Package .165 (4.19) .185 (4.70) .390 (9.91) .420 (10.67) .146 (3.71) .156 (3.96) .108 (2.74) REF + .045 (1.14) .055 (1.40) .234 (5.94)

transistor equivalent book

Abstract: free transistor equivalent book free download transistor data sheet free transistor equivalent book download transistor data book data sheet ltm240m1-l01 Transistors Diodes Data Book GWX-15 GWX-26
Contextual Info: Watch Crystals GWX Specifications GWX-38: 3.1 x 8.2mm cylindrical package GWX-26: 2.1 x 6.2mm cylindrical package GWX-15: 1.5 x 5.1mm cylindrical package Variant Parameters Package: 32.768kHz ࡯ ࡯ ࡯ 5.10 max ±20ppm ±15ppm ±10ppm ±5ppm ࡯ ˿ ˿

GWX-15

Abstract: GWX-26 GWX-38
Contextual Info: Watch Crystals GWX Specifications GWX-38: 3.1 x 8.2mm cylindrical package GWX-26: 2.1 x 6.2mm cylindrical package GWX-15: 1.5 x 5.1mm cylindrical package Variant Parameters Package: 32.768kHz ࡯ ࡯ ࡯ 5.10 max ±20ppm ±15ppm ±10ppm ±5ppm ࡯ ˿ ˿

LTC1164-6

Contextual Info: SPECIFICATION NOTICE LTC1164-6 December 1996 The package on the LTC 1164-6 Rev A, 10/96 data sheet is incorrect.The correct package for the LTC1164-6 is shown below. U PACKAGE DESCRIPTION Dimensions in inches millimeters unless otherwise noted. SW Package

footprint jedec MS-026 TQFP AEB

Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5

FX709J

Abstract: FX709 FX709LH
Contextual Info: Package Outlines Handling Precautions The FX709 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed in Section 10 of this document. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number

0555B

Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
Contextual Info: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7

EE 1605 8PIN

Abstract: atari st MS-011 Plastic DIP .600" Row Spacing
Contextual Info: Philips Components-Signetics R F Communications Package outlines 8-PIN PLASTIC DUAL IN-LINE N PACKAGE NOTES: 1 Controlling dimension: inches. Metric are shown in parentheses. 2. Package dimensions conform to JEOEC specification MS-001 -AB lo r standard dual in-line (DIP) package 300

FX315J

Abstract: FX315 FX315LG SECTION10
Contextual Info: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed in Section 10 of this document. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number

FX809LG

Abstract: FX809LS FX809 FX809J
Contextual Info: Package Outlines Handling Precautions The FX809 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed in Section 10 of this document. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number

Contextual Info: Package Specification 107-79010 21,Mar, 2012 Rev. A5 OJ / OJE PACKAGE SPEC （OJ / OJE PACKING CONDITION） 1.Inner Package 100 pcs／1Tray 100 pcs／1Trayx10Trays Material：PVC） Total : 1,000 pcs 2.External Package 240 180 390 Total : 1,000 pcs ／ Shipping Box

ci 740

Abstract: DIL 330 ic package styles ceramic QFP Package 100 lead CLCC 44
Contextual Info: Integrated Circuits Package Information Latest changes to this document - 11th February 2002 Delvery packaging specification added Publication No: D/Packs/8 February 2002 1 CML Microcircuit Package Information Package Suffixes CML package styles are currently identified with the following suffixes: J, LG, LH, LS and P.

atmel 518

Abstract: CERAMIC LEADLESS CHIP CARRIER quad flat j-leaded package 0502a J-Lead, plcc MS-011-AC PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20P3 40D6 MS-001
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package 1 types available. This section provides size specifications and outlines for all package types. Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP) .7-4