PACKAGE Search Results
PACKAGE Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 54ACT825/QKA | Rochester Electronics LLC | 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP |
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| TPH1R306PL | Toshiba Electronic Devices & Storage Corporation | N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPH9R00CQH | Toshiba Electronic Devices & Storage Corporation | MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPHR8504PL | Toshiba Electronic Devices & Storage Corporation | N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPH9R00CQ5 | Toshiba Electronic Devices & Storage Corporation | N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) | Datasheet |
PACKAGE Datasheets (232)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| Package | Infineon Technologies | TSLP-2 outline | Original | 32.81KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Marking Layout | Original | 33.08KB | 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | TSLP package description | Original | 199.39KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Package and Thermal Information P-DSO-36-10 | Original | 95.63KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Package and Thermal Information P-DSO-28-6 | Original | 231.45KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Taping of Radial LEDs | Original | 45.15KB | 6 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Package and Thermal Information P-DSO-20-10 | Original | 111.61KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Package and Thermal Information P-TO252-3-1 | Original | 107.6KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Package and Thermal Information P-DSO-20-6 | Original | 65.25KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Package and Thermal Information P-TO263-5-1 | Original | 114.12KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Package Information 1 | Original | 1.3MB | 13 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Package Outlines 1 | Original | 208.01KB | 6 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Package and Thermal Information P-DSO-8-1 | Original | 101.57KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Taping of SMT LEDs | Original | 122.62KB | 7 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Package and Thermal Information P-DSO-14-4 | Original | 103.64KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Tape and Reel | Original | 324.79KB | 12 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Package and Thermal Information SCT595-5-1 | Original | 99.61KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Dry Pack | Original | 72.98KB | 7 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | TSFP-4 | Original | 17.64KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Package | Infineon Technologies | Package and Thermal Information P-DSO-16-1 | Original | 45.72KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PACKAGE Price and Stock
Phoenix Contact REPACKAGED-KGG-PC-4/5REPACKAGED KGG-PC 4/5 |
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REPACKAGED-KGG-PC-4/5 |
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Teledyne FLIR ITC-E6XT-PACKAGE |
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ITC-E6XT-PACKAGE |
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ITC-E6XT-PACKAGE |
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TE Connectivity 830M1-1000-TRAY-PACKAGED830M1-1000 Triaxial 1Kg Tray 25pcs MOQ Reduction |
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830M1-1000-TRAY-PACKAGED |
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830M1-1000-TRAY-PACKAGED |
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TE Connectivity 830M1-2000-TRAY-PACKAGED830M1-2000 Triaxial 2Kg Tray 25pcs MOQ Reduction |
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830M1-2000-TRAY-PACKAGED |
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TE Connectivity 830M1-0025-TRAY-PACKAGED830M1-0025 Triaxial 25g Tray 25pcs MOQ Reduction |
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830M1-0025-TRAY-PACKAGED |
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830M1-0025-TRAY-PACKAGED | Tray | 27 Weeks, 5 Days | 200 |
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830M1-0025-TRAY-PACKAGED | 30 | 1 |
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PACKAGE Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
54HC573Contextual Info: SN54HC573, SN74HC573 OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS D26B4. DECEMBER 1982-REVISED SEPTEMBER 1987 • High-Current 3-State Output Drive Bus-Lines Directly or Up to 15 LSTTL Loads • Bus-Structured Pinout Package Options Include Plastic "Small |
OCR Scan |
sn54hc573sn74hc573d26b41982-revised+3 | |
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Contextual Info: SN54ALS259, SN74ALS259 8 BIT AD D R E S S A B LE LA TC HES D2661, DECEMBER 1982-REVISED MAY 1986 S N 5 4 A L S 2 5 9 . J PACKAGE S N 7 4 A L S 2 5 9 . . . D OR N PACKAGE 8-Bit Parallel-Out Storage Register Performs Serial-to-Parallel Conversion with Storage |
OCR Scan |
sn54als259sn74als259d26611982-revised+1 | |
C 34 F
Abstract: 1SV274 D234
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OCR Scan |
1sv274c25v/c28v470mhzc 34 f+1 | |
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Contextual Info: 54AC11109, 74AC11109 DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH CLEAR AND PRESET TI0066— D2957, M ARCH 1987— REVISED M ARCH 1990 Flow-Through Architecture to Optimize PCB Layout 54AC11109 . . . J PACKAGE 74AC11109 . . . D OR N PACKAGE TOP VIEW |
OCR Scan |
54ac1110974ac11109ti0066--d2957+3 | |
SN74HC74Contextual Info: SN54HC74, SN74HC74 DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH CLEAR AND PRESET _ SCLS094A - DECEMBER 1982 - REVISED JANUARY 1996 Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and |
OCR Scan |
sn54hc74sn74hc74scls094a300-mil | |
MP4007Contextual Info: SILICON NPN EPITAXIAL TYPE POWER TRANSISTOR 4 IN 1 MP4007 HIGH POWER SWITCHING APPLICATIONS. INDUSTRIAL APPLICATIONS Unit in mm HAMMER DRIVE, PULSE MOTOR DRIVE AND INDUCTIVE 25.2 ± 0.2 LOAD SWITCHING. . Small Package by Full Molding. (SIP 10 Pin) . High Collector Power Dissipation. |
OCR Scan |
mp4007ta-25 | |
75ALS126
Abstract: mw137 n75a LS126 SN75129
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OCR Scan |
sn55als126n75als126d2299a22-6974-3+8 | |
tlc3741
Abstract: resistor network 104g 9 pin
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OCR Scan |
tlc374tlc374qtlc374yslcs118a-november+4 | |
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Contextual Info: SN5409, SN54LS09, SN54S09, SN7409, SN74LS09, SN74S09 QUADRUPLE 2-INPUT POSITIVE-AND GATES WITH OPEN-COLLECTOR OUTPUTS DECEMBER 1 9 8 3 -R E V IS E D M A R C H 1 9 8 8 Package Options Include Plastic "Sm all Outline" P ackages, Ceram ic Chip Carriers and Flat P ackages, and Plastic and Ceram ic |
OCR Scan |
sn5409sn54ls09sn54s09sn7409+2 | |
IC-524
Abstract: 74as
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OCR Scan |
54as881a300-milas881aic-524+1 | |
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Contextual Info: SN74BCT29854 8-BIT TO 9-BIT PARITY BUS TRANSCEIVER S C B S 257- SEPTEMBER 1987 - REVISED NOVEMBER 1993 DW OR NT PACKAGE • BICMOS Process With TTL Inputs and Outputs T O P V IE W • State-of-the-Art BICMOS Design Significantly Reduces Standby Current |
OCR Scan |
sn74bct29854am29854300-milbi723+1 | |
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Contextual Info: 54AC11032, 74AC11032 QUADRUPLE 2-INPUT POSITIVE-OR GATES TI0060— D2957, JULY 1987— REVISED MARCH 1990 54A C 11032 . . . J PACKAGE 74A C 11032 . . . D OR N PACKAGE • Flow-Through Architecture to Optimize PCB Layout TOP VIEW • Center-Pin V c c and GND Configurations to |
OCR Scan |
54ac1103274ac11032ti0060--d2957+2 | |
IR 30 D1Contextual Info: SN74ALS236 64 x 4 ASYNCHRONOUS FIRST-IN, FIRST-OUT MEMORY SDAS107A-OCTOBER 1986 - REVISED SEPTEMBER 1993 Asynchronous Operation Organized as 64 Words by 4 Bits DW OR N PACKAGE TOP VIEW r NC [ 1 Data Rates From 0 to 30 MHz 3-State Outputs 16 J VCC 15 ] S O |
OCR Scan |
sn74als236sdas107a-october300-mll256-bit+1 | |
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Contextual Info: SN54ALS05A, SN74ALS05A HEX INVERTERS WITH OPEN-COLLECTOR OUTPUTS S D A S 1 9 0 A - APRIL 1982 - R EVISED DECEMBER 1994 Package Options Include Plastic Small-Outllne D Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mll DIPs |
OCR Scan |
sn54als05asn74als05a300-mll | |
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Contextual Info: TLC339M, TLC339I, TLC339C QUADRUPLE MICROPOWER LinCMOS COMPARATORS D3135, DECEMBER 1986-R EV ISED FEBRUARY 1989 • Very Low Power. . . 200 jjiW Typ at 5 V T LC 339M . . . J PACKAGE TLC339I. TLC339C . . . D. J, OR N PACKAGE • Fast Response Time . . . 2.5 |xs Typ with |
OCR Scan |
tlc339mtlc339itlc339cd3135+3 | |
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Contextual Info: 54AC11021,74AC11021 DUAL 4-INPUT POSITIVE-AND GATES _ D2957. JULY 1987 - REVISED APRIL 1993 54AC11021 . . . J PACKAGE 74AC11021 . . . D OR N PACKAGE TOP VIEW * Flow-Through Architecture Optimizes PCB Layout * Center-Pin Vcc and GND Configurations |
OCR Scan |
54ac1102174ac11021d2957500-ma+1 | |
74AS374
Abstract: IC CLK 374 74ALS374A
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OCR Scan |
sn74als374asn74as374sn54als374asn54as374+6 | |
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Contextual Info: SILICON MONOLITHIC BIPOLAR LINEAR INTEGRATED CIRCUIT TA4000F VHF-UHF WIDE BAND AMPLIFIER APPLICATIONS FEATURES • Band W id th 700MHz M in. @ 3 dB dow n • Low Noise 4dB (Typ.) @ f = 400MHz • Small Package M A X IM U M RATINGS (Ta = 25°C) CHARACTERISTIC |
OCR Scan |
ta4000f700mhz400mhz1000pf+1 | |
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Contextual Info: 54AC11002, 74AC11002 QUADRUPLE 2-INPUT POSITIVE-NOR GATES D2957, JUNE 1987 - REVISED APRIL 1993 54AC11002 . . . J PACKAGE 74AC11002 . . . D OR N PACKAGE TOP VIEW Flow-Through Architecture Optimizes PCB Layout Center-Pin Vcc and GND Configuration Minimizes High-Speed Switching Noise |
OCR Scan |
54ac1100274ac11002d2957500-ma+1 | |
IC SN74HC
Abstract: SN74HCTOO SN74HC
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OCR Scan |
sn54hct00sn74hct00300-mil74herating+4 | |
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Contextual Info: TOSHIBA PHOTO RELAY TLP595A Unit in mm Telecommunication Data Acquisition Measurement Instrumentation The Toshiba TLP595A consists of an aluminum gallium arsenide infrared emitting diode optically coupled to a photo-MOSFET in a six lead plastic DIP package. The |
OCR Scan |
tlp595a300ma2500vrmsul1577+1 | |
jl 54123
Abstract: SN64121
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OCR Scan |
sn54221sn54ls221sn74221sn74ls221+5 | |
transistor 2SK1603
Abstract: 2SK1603 2SK1723 2SK1118 transistor 2sk1723 MOSFET 2SK1358 Transistor Guide 2sk16 packages TYPES FOR MOSFET toshiba transistor smd code 2sk1358
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OCR Scan |
ot-89t0-2202sk14882sk1865sm+15 | |
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Contextual Info: TMS28C64 65,536-BIT ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY • Organization 8K x 8 • Single 5-V Power Supply ± 10% N AND J PACKAGES (TOP VIEW } Q 1 U A 12C 2 A7C 3 Compatible with Existing 64K M O S EPRO M s. PRO M s. R O M s, and EEPR O M s |
OCR Scan |
tms28c64536-bit | |