PACKAGE OUTLINE Search Results

TO111 package

Abstract: TO61 package TO63 package MOSFET F24 S06 rectifier
Contextual Info: PACKAGE OUTLINE DRAWINGS TO-18 PACKAGE TO-5 PACKAGE —seâtaao h i m TO-33 PACKAGE 0Ct9 t?s 1 tf— II i-t 4'fiC> ?y H TO-72 PACKAGE TO-3 PACKAGE MODIFIED TO-3 PACKAGE 60mil pins SE* Ft t -L SEATU 'i "01I6 02' °’6 .225 205 JO -66 PACKAGE F-24 PACKAGE

34-pin

Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Packag O20 1 Package Diagram 28-Lead Shrunk Small Outline Package O28 34-Pin Shrunk Small Outline Package O34 2 Package Diagram 48-Lead Shrunk Small Outline Package O48 56-Lead Shrunk Small Outline Package O56

TSOP 48 Package

Abstract: TSOP 56 Package Application of Z44 Small-outline The Diode Data Book with Package Outlines transistor outline package 3 TSOP 44 Package TSOP-II 44 Z-56
Contextual Info: Package Diagram Thin Small Outline Packages 16-Lead Thin Shrunk Small Outline Package 4.40 MM Body Z16 1 Package Diagram 28-Lead Thin Small Outline Package Z28 Thin Small Outline Packages 2 Package Diagram 32-Lead Thin Small Outline Package Z32 3 Package Diagram

CDIP14

Abstract: cdip28 SSOP20 300 mil MS-012AB MS-012AC SO20 sot73-1 sot94 150AH CDIP-14
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package outlines Package information January 1995 File under Integrated Circuits, IC04 Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm

32TSOP

Contextual Info: PACKAGE INFORMATION 1. OUTLINE DIMENSIONS FOR CDIP PACKAGE 2. OUTLINE DIMENSIONS FOR .600 FAMILY PDIP PACKAGE 3. OUTLINE DIMENSIONS FOR .300 FAMILY SOP PACKAGE 4. OUTLINE DIMENSIONS FOR .330 FAMILY SOP PACKAGE 5. OUTLINE DIMENSIONS FOR .450 FAMILY SOP PACKAGE

Contextual Info: Package Outlines Package Outlines

51-85062-C

Abstract: package
Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Lead 5.3 mm Shrunk Small Outline Package O20 51-85077-*C 1 Package Diagram 24-Lead (5.3 mm) Shrunk Small Outline Package O24 51-85078-* 2 Package Diagram 28-Lead (5.3 mm) Shrunk Small Outline Package O28

1653G

Contextual Info: v00.0909 C-20 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-20 Package Outline Drawing Package Information Package Type C-20 Package Weight [1] 16.53g Spacer Weight 4.6g [1] Does not include connectors, or mounting hardware B - 24 NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR

DIP40

Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
Contextual Info: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)

pmfp

Abstract: SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1
Contextual Info: PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

54-LEAD

Abstract: 173e
Contextual Info: Package Diagram Thin Small Outline Packages 8-Lead Thin Shrunk Small Outline Package 4.40 MM Body Z8 51-85093 1 Package Diagram 14-Lead Thin Shrunk Small Outline Package (4.40-mm Body) Z14 51-85117 2 Package Diagram 16-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z16

ZR28

Contextual Info: Package Diagram Reverse Thin Small Outline Package 28-Lead Reverse Type 1 Thin Small Outline Package 8x13.4 mm ZR28 51-85074-*F 1 Package Diagram 32-Lead Reverse Thin Small Outline Package ZR32 51-85089-*C 2

ZR28

Contextual Info: Package Diagram Reverse Thin Small Outline Package 28-Lead Reverse Thin Small Outline Package ZR28 1

2SC5652

Abstract: NE685 NE685M23 S21E RF TRANSISTOR 10 GHZ low noise
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE685M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

2SC5650

Abstract: NE681 NE681M23 S21E
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE681M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

NEC NPN 2SC5653

Abstract: 2SC5653 NE687 NE687M23 S21E
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE687M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

2SC5649

Abstract: 2SC564 NE856 NE856M23 S21E
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE856M23 OUTLINE DIMENSIONS Units in mm FEATURES PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

JEDEC MO-187

Abstract: MO-187 MA08D
Contextual Info: Revised January 1999 Package MA08D 8-Lead Molded Small Outline Package MSOP , JEDEC MO-187, 3.0mm Wide Package Number MA08D 1999 Fairchild Semiconductor Corporation ma08d.prf www.fairchildsemi.com Package MA08D January 1999

BGA PACKAGE thermal profile

Abstract: 896-Pin TQFP 144 PACKAGE DIMENSION CII51015-2 EP2C20 EP2C35 EP2C50 F256 EP2C5256 CII51015
Contextual Info: 15. Package Information for Cyclone II Devices CII51015-2.3 Introduction This chapter provides package information for Altera Cyclone® II devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Table 15–1 shows Cyclone II device package options.

Contextual Info: Revised January 1999 Package MSC14 14-Lead Shrink Small Outline Package SSOP , EIAJ TYPE I, 4.4mm Wide Package Number MSC14 1999 Fairchild Semiconductor Corporation msc14.prf www.fairchildsemi.com Package MSC14 January 1999

jedec mo-118

Abstract: MS48A MO-118
Contextual Info: Revised January 1999 Package MS48A 48-Lead Small Shrink Outline Package SSOP , JEDEC MO-118, 0.300” Wide Package Number MS48A 1999 Fairchild Semiconductor Corporation ms48a.prf www.fairchildsemi.com Package MS48A January 1999

LCC-40P-M02

Contextual Info: SMALL OUTLINE NON-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 40 PIN PLASTIC To Top / Package Lineup / Package Index LCC-40P-M02 40-pin plastic SON Lead pitch 0.50 mm Package width x package length 10.10 × 10.75 mm Sealing method Plastic mold LCC-40P-M02

MSC16

Contextual Info: Revised January 1999 Package MSC16 16-Lead Shrink Small Outline Package SSOP , EIAJ TYPE I, 4.4mm Wide Package Number MSC16 1999 Fairchild Semiconductor Corporation msc16.prf www.fairchildsemi.com Package MSC16 January 1999

jedec mo-118

Abstract: MO-118 mo118
Contextual Info: Revised January 1999 Package MS56A 56-Lead Shrink Small Outline Package SSOP , JEDEC MO-118, 0.300” Wide Package Number MS56A 1999 Fairchild Semiconductor Corporation ms56a.prf www.fairchildsemi.com Package MS56A January 1999