SOT94 Search Results

Contextual Info: Package outline BGA564: plastic ball grid array package; 564 balls; body 40 x 40 x 1.75 mm SOT947-1 B D D1 A ball A1 index area E1 E A A1 A2 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E

Contextual Info: Package outline HUQFN88U: plastic thermal enhanced ultra thin quad flat package; no leads; 88 terminals; UTLP based; body 6 x 6 x 0.55 mm B D SOT942-1 A terminal 1 index area E A A1 detail X e2 v w M eR L e1 C A B C M A11 v w b 1/2 e A12 B11 D2 L1 C e A22

Contextual Info: Package outline HWQFN68: plastic thermal enhanced very very thin quad flat package; no leads; 68 terminals; body 8 x 8 × 0.65 mm B D SOT944-1 A terminal 1 index area E A A 1 c detail X C e1 18 34 L L2 v w b e M M y1 C C A B C y 35 17 e e2 Eh b1 1 51 terminal 1

Contextual Info: Package outline HVQFN40R: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; resin based; body 5 x 5 x 0.8 mm B D SOT945-1 A terminal 1 index area E A detail X e1 e L1 1/2 e v w b 11 20 M M C C A B C y1 C y L 21 10 e e2 Eh 1/2 e

CDIP-24

Abstract: CDIP24 SOT94-1 C-DIP-24 SOT-94 transistor 22X philips 23 sot941
Contextual Info: PDF: 1999 Jul 19 Philips Semiconductors Package outline CDIP24: ceramic dual in-line package; 24 leads; glass seal 15.9 max 33 max seating plane handbook, full pagewidth SOT94-1 5.84 max 3.4 2.9 0.51 min 2.54 max 2.54 22x 0.58 0.38 0.254 M 0.32 0.23 15.24

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 7 x 7 x 0.85 mm D B SOT949-2 A A1 A A3 terminal 1 index area E detail X e1 C v w b L 15 28 C A B A y y1 C 29 14 e e2 Eh 1/2 e 1 terminal 1 index area

Contextual Info: Package outline HBGA1092: plastic thermal enhanced ball grid array package; 1092 balls; body 40 x 40 x 1.75 mm; heatsink SOT948-1 B D D1 A ball A1 index area E1 j E A A2 A1 detail X e1 e AV AT AP AM AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e AU AR

Contextual Info: Package outline LFBGA296: plastic low profile fine-pitch ball grid array package; 296 balls; body 10 x 10 x 1 mm B D SOT946-1 A ball A1 index area E A2 A A1 detail X e1 e V T P ∅v ∅w b 1/2 e M M C C A B C y y1 C U R e N M L K J H G F E D C B A ball A1

Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 7 x 7 x 0.85 mm B D SOT949-1 A terminal 1 index area E A A1 c detail X e1 1/2 e e 15 L ∅v ∅w b 28 14 M M C C A B C y1 C y 29 e e2 Eh 1/2 e 1 terminal 1

Contextual Info: Package outline HUQFN68U: plastic thermal enhanced ultra thin quad flat package; no leads; 68 terminals; UTLP based; body 8 x 8 × 0.55 mm B D SOT943-1 A terminal 1 index area A A1 E detail X C e1 L2 v w b e L L1 18 34 M M y1 C C A B C y 35 17 e e2 Eh b1

HVQFN56

Contextual Info: +9 4 1  SOT949-2 HVQFN56; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or Y Ordering code 12NC) ending 518 Rev. 1 — 6 November 2013 Packing information 1. Packing method %DUFRGHODEHO 'U\DJHQW %DJ (6'SULQW

Signetics OR Mullard

Abstract: SBB2664D SBB2664E SBB2664P TW417
Contextual Info: DEVELOPMENT SAMPLE DATA I t r o m ri :v SBB2664P.D.E n o n . Il d o r i t o r i ? q u I¿1 r p o d u c T«plV t h; i r t he 65 536-BIT STATIC READ ONLY MEMORY T h e S B B 2 6 6 4 is a 6 5 5 3 6 h it M O S N -cha n n el s ta tic R O M orga n ised as 8 1 9 2 e ig h t b it w o rd s . T h is

SC28L198

Abstract: SCC2691AC1A28 LCD 09151 CSOT109 PCA9552 PCK2002 PCF8591 APPLICATION pecl clock so8 PCA9550 PCA9553
Contextual Info: Interface Products Interface Products 67 I2C Logic Family Overview • Analog/Digital Converters It is frequency required to record analog information, such as temperature, pressure, battery level, signal strength, etc. The analog voltage information from the diode, pressure sensor,

HEF4514BD

Abstract: HEF4514B HEF4514BP HEF4514BT hef4514be
Contextual Info: HEF4514B MSI 1-0F-16 DECODER/DEMULTIPLEXER WITH INPUT LATCHES The HEF4514B is a 1-of-16 decoder/demultiplexer, having fo u r binary weighted address inputs Ao to A 3 , a latch enable input (EL), and an active LOW enable in pu t (E"). The 16 outputs (Og to O-j5 ) are

max9035

Contextual Info: HEF4514B 1-0F-16 DECODER/DEMULTIPLEXER WITH INPUT LATCHES The H EF4514B is a 1-of-16 decoder/demultiplexer, having four binary weighted address inputs Aq to A 3 , a latch enable input (E L ), and an active LOW enable input (E). The 16 outputs (Oq to O 15) are

d2b bus

Contextual Info: HEF4508B MSI DUAL 4-BIT LATCH The HEF4508B is a dual 4-bit latch, which consists of two identical independent 4-bit latches with separate strobe ST , master reset (MR), output-enable input (EO) and 3-state outputs (0). With the ST input in the HIGH state, the data on the D inputs appear at the corresponding outputs

marking SMD Y12

Abstract: hef4067 Y11 smd code
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4067B MSI 16-channel analogue multiplexer/demultiplexer

Contextual Info: PTN3460 eDP to LVDS bridge IC Rev. 4 — 12 March 2014 Product data sheet 1. General description PTN3460 is an embedded DisplayPort to LVDS bridge device that enables connectivity between an (embedded) DisplayPort (eDP) source and LVDS display panel. It processes

HEF4059B

Abstract: HE4000B HEF4059BD HEF4059BP HEF4059BT SO24 decade counter circuit diagram HEF4059B LSI
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4059B LSI Programmable divide-by-n counter

HEF4515B

Abstract: HEF4515BP 075E05 HE4000B HEF4515BD HEF4515BT SO24 HE400
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4515B MSI 1-of-16 decoder/demultiplexer with

sab 3013

Abstract: IC tda 1571 TDA1506 sab3013 SAA5051 SAB3034 SAF 3019 Tda1533 SAA 1059 valvo halbleiter
Contextual Info: Elektronik. Wir bauen die Elemente. V A m Integrierte Schaltungen für die Unterhaltungselektronik Produktprogram m t IT 1. A pril 1983 Elektronik. Wir bauen die Elemente Unser Arbeitsgebiet - besonders die Mikroelektronik - entwickelt sich im m er rascher zum Motor für eine

cl 1100

Abstract: demultiplexer truth table HE4000B HEF4514B HEF4514BD HEF4514BP HEF4514BT
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4514B MSI 1-of-16 decoder/demultiplexer with

y12Z

Abstract: HEF4067BP HEF4067B HEF4067BD HEF4067BT
Contextual Info: HEF4067B MSI 16-CHANNEL ANALOGUE MULTIPLEXER/DEMULTIPLEXER The HEF4067B is a 16-channel analogue multiplexer/demultiplexer with four address inputs Ag to A 3 , an active LOW enable input (E), sixteen independent inputs/outputs (Yg to Y 1 5 ) and a common

LCD 09151

Abstract: HVQFN24 PCA9504A philips pcf i2c SO24 SOT355-1 PCA8550 PCA9518 PCA9541 PCA954X
Contextual Info: Introduction Exceptional choice in … I2C-bus devices I 2 C-bus devices Philips was the inventor of the Inter-IC or I2C-bus nearly 20 years ago, and this communication protocol is now firmly established as the worldwide de-facto solution for embedded applications.