| SOT942-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced ultra thin quad flat package; no leads; 88 terminals; body 6 x 6 x 0.55 mm |
Original |
PDF
|
234.69KB |
1 |
| SOT943-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced ultra thin quad flat package; no leads; 68 terminals; body 8 x 8 x 0.55 mm |
Original |
PDF
|
235.61KB |
1 |
| SOT944-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced ultra thin quad flat package; no leads; 68 terminals; body 8 x 8 x 0.55 mm |
Original |
PDF
|
239.81KB |
1 |
| SOT945-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 5 x 5 x 0.8 mm |
Original |
PDF
|
225.6KB |
1 |
| SOT946-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 296 balls; body 10 x 10 x 1 mm |
Original |
PDF
|
293.52KB |
1 |
| SOT947-1 |
|
NXP Semiconductors
|
Plastic, ball grid array package; 564 balls; body 40 x 40 x 1.75 mm |
Original |
PDF
|
292.85KB |
1 |
| SOT948-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced ball grid array package; 1092 balls; body 40 x 40 x 1.75 mm; heatsink |
Original |
PDF
|
356.65KB |
1 |
| SOT949-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 7 x 7 x 0.85 mm |
Original |
PDF
|
231.55KB |
1 |
| SOT949-2 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 7 x 7 x 0.85 mm |
Original |
PDF
|
349.07KB |
1 |
| SOT949-2_518 |
|
NXP Semiconductors
|
HVQFN56; Reel dry pack, SMD, 13"Q1/T1 standard orientationOrderable part number ending, 518 or YOrdering code (12NC) ending 518 |
Original |
PDF
|
216.92KB |
4 |
