P352 Search Results

uPD78352

Abstract: D78352 D78352AG uPD78350 UPD78P352 PD78352A PD78352AG PD78352
Contextual Info: b Lt E7SES 00433b? 1Ö4 « N E C E f j PD78352 Family GuPD78350/352A/P352 16-/8-Bit, K-Series Microcontrollers W ith Real-Time O utput Ports NEC E le ctro n ics Inc. September 1993 Description The juPD78350, /JPD78352A, and /L/P352 are m em ­ bers o f th e K-Series o f m icro co n tro lle rs. These 16-/8b it m ic ro c o n tro lle rs — w ith a m in im u m in s tru c tio n tim e

D78352

Abstract: uPD78352 78352 UPD78P352 uPD78350 D7835
Contextual Info: N E C ELECTRONICS INC b7E » NEC Electronics Inc. • b4 2 7S 2 S 003^21,5 T7b « N E C E JUPD78352 Family HIPD78350/352A/P352 16-/8-Bit, K-Series Microcontrollers With Real-Time Output Ports September 1993 Description The juPD78350, pPD78352A, and ¿/P352 are mem­

Contextual Info: TIBPAL22V10-20M HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS SRPSQ12A - D3523, JUNE 1 9 9 0 -R E V IS E D MARCH 1992 JT P A C K A G E Second-Generation PLD Architecture TO P V IE W High-Performance Operation: fmax (External Feedback). . . 33.3 MHz

SMW20P10

Abstract: sm 6136 b NS8060 4560D
Contextual Info: Temic SMW20P10 Siliconix P-Channel Enhancement-Mode Transistor Product Summary V BR DSS (V) rDS(on) ( ß ) I d (A) -1 0 0 0.20 -2 0 TO-247AD G D S l o p View P-C hannel M O S F E T Absolute Maximum Ratings (Tc = 25 °C Unless Otherwise Noted) Sym bol L im it

HP3570A

Abstract: harddisk motor driver HP4192A Si9961
Contextual Info: T em ic SÎ9961 Siliconix 12-V Voice Coil Motor Driver Features • 1 .8 -A H -B rid g e O u tp u t • C lass B L in e a r O p e ra tio n • E x tern ally P ro g ram m ab le G a in and B andw idth • • • • U n d erv o ltag e H e a d R e tra c t P ro g ram m ab le R e tra c t C u rren t

P281 B01

Abstract: G187
Contextual Info: LogiCORE IP Processing System 7 v4.02a DS871 October 16, 2012 Product Specification Introduction LogiCORE IP Facts Table The Processing System 7 IP is the software interface around the Zynq Processing System. The Zynq -7000 family consists of an system-on-chip (SoC) style

40178

Abstract: S44ART U-163 U39ART u317 U-167 U243 P352 u31art 1000kcmil
Contextual Info: 3M Scotchlok™ Copper/ Aluminum Compression Lugs, 40000 Series Data Sheet May 2011 Description 3M™ Scotchlok™ Copper/Aluminum Compression Lugs 40000 Series are made of high conductivity aluminum and are designed to cover a wide range of conductor sizes from 6 AWG through 1000 kcmil MCM . The lugs consist of a series of onehole lugs ranging from 6 AWG through 1000 kcmil (MCM) and two-hole lugs, for

p344

Abstract: p348 E299DD/P346 E299DD E299DD/P340 silicon carbide p218
Contextual Info: Non-linear resistors book 3 part 1 voltage dependent cont. T ype N o. Code No. 2 3 2 2 . C (approx.) V value Reference current mA Reference voltage V Diameter mm Thickness or length Disc types (silicon carbide) E299DD/P116 562 01161 14 0.25 to 0.4 100

A2L6

Abstract: A3L12 a2l1 A3L10 CCD595 Contact image sensor fairchild P115 FAIRCHILD A3R16 P210 fairchild A1R8
Contextual Info: PRELIMINARY DATA SHEET CCD595 9216 x 9216 Pixel Image Area Full Frame CCD Image Sensor FEATURES • 9216 x 9216 Full Frame CCD Array • 8.75 µm x 8.75 µm Pixels • 80.64mm x 80.64mm Image Area • 100% Fill Factor • Non Multi-Pinned Phase MPP Operation

of BGA Staggered pins

Abstract: of BGA Staggered Pins package C10943X
Contextual Info: Mounting pad of plastic BGA The drawings of cavity up-type mounting pads are shown in Figure 1-13, followed by Table 1-7 which provides detailed information on these pads. Those for cavity-down type pads are provided in Figure 1-14 and Table 1-8. Figure 1-13. Mounting Pad Dimensions of Plastic BGA Cavity-Up

Contextual Info: 352 PIN TAPE BGA 35x35 A U B A B W A1 A2 V D X C Y Index mark J S A H B G F L M P M M E S A B *1 *2 detail of A part detail of B part (Z) K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition.

C6198

Abstract: a17 c178 100v 12p quanta TMS 3617 CX20468-31 mtp42 cpu c644 100v 27p capacitor 100u 63V a70 4013 100 12p Quanta KT2
Contextual Info: 5 4 3 2 PCB Rev: A 1 Sch ver : 20040402_07 KT2 BLOCK DIAGRAM D PCB STACK UP LAYER 1 : TOP D PENTIUM-M / Montara-GM / ICH4-M LAYER 2 : GND LAYER 3 : IN1 CPU PENTIUM-M CPU THERMAL SENSOR LAYER 4 : IN2 GMT-781 478 Pins micro FC-PGA PAGE: 3 LAYER 5 : VCC 14.318MHz

wireless TV headphone mini project

Abstract: quanta hp pavilion g6 LED1013 PIC PROJECT CCS C TOUCHPAD PC97551 MC1231 p31b diode quanta computer C3452
Contextual Info: 1 2 3 4 5 6 8 CT1 BLOCK DIAGRAM PCB STACK UP LAYER 1 : TOP PENTIUM-M / Montara-GM / ICH4-M LAYER 2 : GND A 7 LAYER 3 : IN1 CPU PENTIUM-M CPU THERMAL SENSOR LAYER 4 : IN2 GMT-781 478 Pins micro FC-PGA PAGE: 3 LAYER 5 : VCC 14.318MHz A SYSTEM POWER(1.2V/1.05V/1.25V)

1Bt 87

Abstract: P3420 p32100 P3412 polytron p35 P53-15L P38-12S 1BT 88 P3475 POLYTRON P33-48ST
Contextual Info: P POLYTRON DEVICES, Inc. LINEAR ENCAPSULATED POWER MODULES REGULATED 5Vdc-250Vdc P.C. CARD OR CHASSIS MOUNTING Specifications FEATURES • UL, CE & CSA Approved All Models • Regulation Line & Load 0.2% to 0.02% • P.C. Card/Chassis Mounting 115 Vac, 50 to 400 Hz @ 25°C

aw7 TRANSISTOR

Abstract: P449 I-CUBE iq P-033 Bus repeater p426 P-238 P122-P120 p331 TRANSISTOR P339
Contextual Info: MSX Family Data Sheet Features • SRAM-based, in-system programmable • Configurable I/O Ports – Individually programmable as input, output, bi-directional, or Bus Repeater mode – Control Signals per I/O port: 2 input enables, 2 output enables, 2 Global Clock inputs and Next Neighbor

CY37512P208-100UMB

Abstract: CY37512P208-100UM CY37032VP44-100AI CY37256P160-83UM CY37064P44-154YMB CY37256P160-125UMB CERAMIC leaded CHIP CARRIER CLCC 68
Contextual Info: Family PRELIMINARY Ultra37000 CPLD Family 5V, 3.3V, ISR™ High-Performance CPLDs Features General Description • In-System Reprogrammable ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes don’t cause pinout changes — Design changes don’t cause timing changes

burndy Y35 DIE SET

Abstract: YPC26R8U burndy Y750 YC26C26 burndy Y35 YPC28U26 YC26C2 burndy yc28c28 YP26AU2 burndy die set Y35
Contextual Info: BURNDY Overhead PRODUCT LINE TABLE OF CONTENTS TAP CONNECTORS Mechanical Bolted . . . . . . . . . . . . H-3 - H-17 Compression . . . . . . . . . . . . . . . . H-18 - H-37 Transformer and Equipment. . . . . H-38 - H-40 COMPRESSION SPLICES Service Entrance . . . . . . . . . . . . . H-42 - H-45

21x21

Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Contextual Info: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。

asea directional relay

Abstract: RRPE 40 Reverse Power Relay overcurrent relay inverse normal curves RRPE40 transformers 321 464 rrpe41 RK512 rK-12 ASEA RK 51-200 E
Contextual Info: ASEA C a ta lo g u e R K 5 1 -2 E Ed ruoti 1 Sepiennbsr 1871 Fite R Pari 2 Directional relay type RRPE 4 • O p e ra te s a c c u r a te ly d o w n tc 0 ,6 °/« o f • th e ra te d v o lta g e A • is in s e n s itiv e to v a r ia tio n s in te m p e ra ­

p31b

Abstract: FUSE 451 P03cm TGS 813 TGS 823 P0080SAL P0080SBL P0080SAMCL P1200SDL p48a
Contextual Info: 9 Mechanical Data 9 Mechanical Data The following section describes the mechanical specifications of products in this Telecom Design Guide. Telecom Design Guide • 2006 Littelfuse, Inc. 9-1 www.littelfuse.com /GEJCPKECN &CVC Gas Plasma Arresters—Package Dimensions / Specifications . . . . . . . . . . . . . . . . . . . . . . . . 9-3

ic 313

Abstract: S3043 S3044
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD98414 2.4 Gbps ATM SONET FRAMER The µPD98414 NEASCOT-P70 is one of ATM LSIs and provides the functions of the TC sublayer of the SONET/SDH-base physical layer of the ATM protocol specified by the ATM Forum. Its main functions include a transmission function for mapping an ATM cell passed from a high-end ATM layer

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

TCA160

Abstract: BY164 Mullard C296 TAA310A TAA435 TAA700 TBA550 TBA480 PCC88 TAA300
Contextual Info: MULLARD DATA BOOK 1973-74 ER R A TA A U G U S T 1973 j\ 1 d - ^ Mullard Limited Renewal Sales Department Mullard House Torrington Place London WC1E 7HD N / , S E M IC O M D U C Type No. Page No. AC187 13 Correction Delete minus signs to read: *IC = 300m A;

P352A

Abstract: 352A MP351 MP350 LG P350 transistor+SMD+352a
Contextual Info: MP350/351/352A ML PNP Dual Monolithic Silicon Nitrox Transistors Micro Power System s FEATURES • High Gain: hpE > 200 @ 10|j.A - 1mA • Tight V be Matching: I VBE1 - VBE2 I = .2mV typ. • High 1y- 275 MHz typ. @ 1 mA GENERAL DESCRIPTION critica l differen tial input s ta g e s.