P24GM Search Results

transistor d 331

Abstract: G 331 LB-001 0079H P24GM-50-450A-2
Contextual Info: Mounting Pad Packing Name Magazine LB-001 24 pin SOP 450 mil 24 13 1 5°±5° detail of lead end 12 A H J E K F G I D L B C N M M P24GM-50-450A-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: 24 PIN PLASTIC SOP 450 mil 24 13 1 5°±5° detail of lead end 12 A H J E K F G I D L B C N M M P24GM-50-450A-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES

IC-8310

Abstract: M0025 m1101 skf 4 F 06 MC CMOS xor MC+3203
Contextual Info: お客様各位 カタログ等資料中の旧社名の扱いについて 2010 年 4 月 1 日を以って NEC エレクトロニクス株式会社及び株式会社ルネサステクノロジ が合併し両社の全ての事業が当社に承継されております。従いまして、本資料中には旧社

uPD7500* instruction set

Abstract: IC-7518 wiring diagram electric rice cooker 7500B ic 7500B piezoelectric humidifier P110-P112 uPD7500 instruction set a schematic diagram rice cooker piezoelectric humidifier CIRCUITS
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

LA 7687 a

Abstract: HCFT IC-8407 2sk0 TFK 027 LA 7687 IC CIRCUIT 64X4 D17120 ITT 7HO PD17120
Contextual Info: V— S N E C 5/ • — K M o s ife a m i s& M O S Integrated C ircu it ^ ^ /¿PD17120 i, • U t - y H ! » , v lJ P CPU t L T ì H f f l U ^ X ^ ^ T * * 1 7 K 7 1 2 0 • -f > ÿ 7 x - * L T l' t T Ì Ì U , « T 7^ z i - A U ~ ^ £ ^ U T Ì t o T ZblZ,

PC659

Abstract: IPC659G
Contextual Info: N E C ELECTRONICS INC SEC / ELECTRON DEVICE 30E D • b427S2S G03047b T ■ DATA SHEE-T Preliminary BIPOLAR ANALOG INTEGRATED CIRCUIT / / _ _ _ _ _ Ä / / P C 6 5 9 8 BIT A/D C O N V E R T E R FOR V ID EO P R O C E S S IN G

PD6900C

Abstract: PD6900G
Contextual Info: DATA SH EET NEC MOS INTEGRATED C IR C U IT ELECTRON DEVICE //PD6900 8 b it D / A C o n v e r t e r fo r V id e o S ig n a l P r o c e s s in g CM O S LSI The ¿iPD6900 is an 8 bit D/A converter for use in video applications. The high-speed CMOS processing tech-

UPD6452CS-002

Abstract: upd6452 GT102
Contextual Info: b 4 2 7 5 2 5 D D M T 7 7 0 Û4b « N E C E MOS INTEGRATED CIR CU IT /¿PD6452 12 LIN E X 2 4 C O L U M N O N - S C R E E N C H A R A C T E R D IS P L A Y C M O S LSI FOR S-V CR DESCRIPTION The ¿ PD6452 is on-screen character display CMOS LSI which is combined with microcomputers and used for S-VCR to

Contextual Info: DATA SHEET - SEC BIPOLAR ANALOG INTEGRATED C IR C U IT ElfCTRON DEVICE ¿¿PC659 8 BIT A /D CONVERTER FOR VIDE O PR OC ESSING W I T H REFERENCE GENERATOR A N D C L A M P C IR C U IT The ¿JPC659 is a 8 bit A/D converter for video signal processing. The high speed and high quality Bipolar processing technology

upd17p104

Abstract: ANDO AF-9703 17P104 pPD17104 ANDO AF-9703 DETAILS PD17104
Contextual Info: D A TA SHEET MOS INTEGRATED CIRCUIT ¿ i P D 1 7 P 1 4 4 BIT SINGLE-CHIP MICROCONTROLLER The/iPD17P104 is aone-time PROM vers ionofthe^PD I 7104, in which the internal masked ROM of the ^PD17104 is replaced with a one-time PROM that can be written to just'once.

IC-8419

Abstract: 7ROM PD17120 10AS1 7ky la
Contextual Info: M o s s im i s& M OS Integrateci Circuit PD17P132 'l'M ìH m 4 p. P D 1 7 P 1 3 2 i, fc f y h V > < 7 ^ ^ 7 7 ° ’ yr < ^ 7 P = l > h P - 7 / / P D l 7 1 3 2 ( 7 f t E ^ 7 R O M £ - . £ £ 't f ;0 ê :iA < frn Jffë & 'r7 > • 5? < A P R O M I C E f c U t é & T

17p104

Abstract: blf 178 ROHC 17p107 IR LFN tt 250 n 16 kof HMAF 8345B TL 413 ami jbi 120
Contextual Info: MOSÎ M O S In te g ra te d C ircu it JU /¿PD17104 fi, R O M I K / 'K h 512 x 16 , R A M 1 6 x 4 t:'y K I/O PD17104 h 16^Tfl|J5St$ ? -f - v - r ^ n z i> h p — 5 T T o ^ •/ i ' J CPU LT^/zaò, / z J C £ <75T # : ^ Uv * ? A t if c 1 7 K 7 - ^ r ^ f t

D17108

Abstract: IC-2863B
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD17108L 4 BIT SINGLE-CHIP MICROCONTROLLER The µPD17108L, tiny microcontroller, consists of 1K-byte 512 x 16 ROM, 16 × 4 bit RAM, and 16 input/output ports. The µPD17108L can operate at a low voltage of 1.5 V. It can be used for wide variety of products controlled

BL p0d

Abstract: IC806 l51ii block diagram for EIO SLOT for Data Storage D17108 ekp 71 upd17108
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD17108 4 BIT SINGLE-CHIP MICROCONTROLLER The µPD17108, tiny microcontroller, consists of 1K-byte 512 x 16 bits ROM, 16 × 4 bit RAM, and 16 input/ output ports. The 17K architecture of the CPU uses general registers so that data memory can be manipulated directly

nec d4721

Abstract: d4722gs d4721 PD4721 nec d4722gs PD4711B UPD4713CX d4711 PD71051 UPD4711
Contextual Info: User’s Manual How to Use IC for RS-232 Line Driver/Receivers µPD4711B µPD4712C/4712D µPD4713A µPD4714A µPD4715A µPD4721 µPD4722 µPD4723 µPD4724 µPD4726 Document No. S13354EJ3V0UM00 3rd edition Date Published June 2003 NS CP(K) 1998 Printed in Japan

21x21

Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Contextual Info: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。

nec d4721

Abstract: D4721 d4722gs d4711 PD4721GX-GJG HIN238 d4711bg uPD4721 equivalent UPD4713CX D4714A
Contextual Info: User’s Manual How to Use IC for RS-232 Line Driver/Receivers µPD4711B µPD4712C/4712D µPD4713A µPD4714A µPD4715A µPD4721 µPD4722 µPD4723 µPD4724 µPD4726 Document No. S13354EJ2V0UM00 2nd edition Date Published July 1999 N CP(K) Printed in Japan

lg crt monitor circuit diagram

Abstract: micro servo 9g samsung lcd tv power supply diagrams MP 1008 es uPa2003 8049 microcontroller APPLICATION LG lcd tv tuner pioneer car dvd service manual lg washing machine circuit diagram 8ch pnp DARLINGTON TRANSISTOR ARRAY
Contextual Info: SEMICONDUCTORS SELECTION GUIDE Microcomputer 1 IC Memory 2 Semi-Custom IC 3 Particular Purpose 4 General Purpose Linear IC 5 Transistor/Diode/Thyristor 6 GaAs Device/ Silicon Microwave Semiconductor 7 Optical Device 8 Packages 9 Index 10 October 1998 The export of these products from Japan is regulated by the Japanese government. The export of some or all of

C10943X

Abstract: mounting pad IS225 P20GM-65-300B-2 S42G
Contextual Info: a Mounting pad of SOP SOPs are named after the nominal center-to-center distance ( e1 ) between mounting pad arrays. Therefore, for example, the name “225 mils SOP” means that the center-to-center distance between the mounting pad arrays of this SOP is 225 mils (5.7 mm), as shown in Figure 1-6.

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

Contextual Info: 24 PIN PLASTIC SOP 300 mil 24 13 detail of lead end P 1 12 A F H G I C E N D M S B S J L K M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

S14GM-50-225B

Contextual Info: : Available, : Under development Plastic SOP Nominal Dimensions mil Lead Pitch (mm) Pin Counts 8 14 16 20 24 28 32 40 44 225 300 375 1.27 450 525 600 Plastic SSOP Nominal Dimensions (mil) Lead Pitch (mm) 225 0.65 Pin Counts 8 0.50 300 0.65 0.8 0.65 375 0.8

sharp lsi pc 2002

Abstract: AXS628319C P28GM-50-450A1-2 FRAME32
Contextual Info: AXS6 SOP SOCKETS AXS6 µSOCKET SERIES IC SOCKETS FOR SMALL OUTLINE PACKAGE 3. Space saving The socket occupies an area only 1.25 times the size of the IC. High density mounting is possible even if the socket is used. 4. Automated mounting compatible The socket has an open flat construction