O20 PACKAGE Search Results

51-85062-C

Abstract: package
Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Lead 5.3 mm Shrunk Small Outline Package O20 51-85077-*C 1 Package Diagram 24-Lead (5.3 mm) Shrunk Small Outline Package O24 51-85078-* 2 Package Diagram 28-Lead (5.3 mm) Shrunk Small Outline Package O28

34-pin

Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Packag O20 1 Package Diagram 28-Lead Shrunk Small Outline Package O28 34-Pin Shrunk Small Outline Package O34 2 Package Diagram 48-Lead Shrunk Small Outline Package O48 56-Lead Shrunk Small Outline Package O56

O28 Package

Abstract: small outline
Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Package O20 51-85077-B 1 Package Diagram 28-Lead 210-Mil Shrunk Small Outline Package O28 51-85079-B 28-Lead (150-Mil) Shrunk Small Outline Package O29 51-85072-B 2 Package Diagram

79C0832RP

Contextual Info: SPACE ELECTRONICS INC. 8 MEGABIT EEPROM MCM GND I/O15 ADDRESS CE1 73 ADDR07 GND ADDR06 5V ADDR05 ADDR04 ADDR03 79C0832RP ADDR02 ADDR01 ADDR00 GND GND 5V GND GND GND GND GND 5V GND GND I/O16 SPACE PRODUCTS I/O14 1 I/O18 I/O13 I/O19 I/O12 I/O20 I/O11 I/O21 I/O10

Contextual Info: SPACE ELECTRONICS INC. 8 MEGABIT EEPROM MCM GND I/O15 ADDR07 GND ADDR06 5V ADDR05 ADDR04 ADDR03 ADDR02 ADDR01 79LV0832RP ADDR00 GND 5V GND GND GND GND 5V GND GND GND GND I/O16 SPACE PRODUCTS 73 CE1 I/O17 I/O14 1 I/O18 I/O13 I/O19 I/O12 I/O20 I/O11 I/O21 I/O10

PD6323

Abstract: UPD6323BC uPD6323C NEC FIP 13 Si 1SS53 UPD6323 bc 339 NEC FIP PD7500 diagram SCK 035
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD6323 LATCH and DRIVER for FIP COMOS LSI DESCRIPTION The µPD6323 is a latch and driver CMOS IC for FIP Fluorescent Indicator Panel . For multiplex wiring, the µPD6323 is supplied with the serial interface circuit, 21 bit shift register, 21 bit data latch and 21 outputs. The serial

pd6340

Abstract: uPD6340 UPD6340GC IC-2197 upd80c42 di450 pd634 uPD6340G P52GC-100 fip20
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD6340 20 BIT VACUUM FLUORESCENT DISPLAY DRIVER The µPD6340 is 20-bits vacuum Fluorescent display driver constructed with BiCMOS in a single monolithic structure. This device consists of a 20-bit bidirectional shift register of 20-bit serial/4 x 5-bit parallel data input, 20 latches

UPD6323BC

Abstract: PD6323 NEC FIP uPD6323 87AD Temperature to voltage converter ic with mil grade PD6323BC PD6323C VO20 2sc9
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD6323 LATCH and DRIVER for FIP COMOS LSI DESCRIPTION The µPD6323 is a latch and driver CMOS IC for FIP Fluorescent Indicator Panel . For multiplex wiring, the µPD6323 is supplied with the serial interface circuit, 21 bit shift register, 21 bit data latch and 21 outputs. The serial

2N7002ELT

Abstract: 2N7002ELT1
Contextual Info: WILLAS FM120-M+ 2N7002ELT1 THRU FM1200-M+ Small Signal MOSFET 310 mAmps, 60 Volts 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V SOD-123+ PACKAGE Pb Free Product Package outline Features • Batch process design, excellent power dissipation offers

Contextual Info: WILLAS FM120-M+ THRU 2N7002DW1T1 FM1200-M+ Small Signal MOSFET 115 mAmps,60 Volts 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V SOD-123+ PACKAGE Pb Free Product Package outline Features • Batch process design, excellent power dissipation offers

RF sensor

Abstract: PD6323BC
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

O28 Package

Abstract: WF2M32-XXX5 WF2M32U-XG2UX 68 lead CQFJ
Contextual Info: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES Access Time of 90, 120, 150ns Organized as 2Mx32 Packaging: Commercial, Industrial, and Military Temperature Ranges • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .

WF2M32-XXX5

Contextual Info: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES „ „ Access Time of 90, 120, 150ns „ Organized as 2Mx32 Packaging: „ • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 . Commercial, Industrial, and Military Temperature Ranges

Contextual Info: WF2M32-XXX5 White Electronic Designs 2Mx32 5V Flash Module PRELIMINARY* FEATURES • Commercial, Industrial, and Extended Temperature Ranges ■ Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .

footprint cqfp 240

Contextual Info: WF2M32-XXX5 White Electronic Designs 2Mx32 5V Flash Module PRELIMINARY* FEATURES „ Commercial, Industrial, and Military „ Access Time of 90, 120, 150ns Temperature Ranges „ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .

Contextual Info: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square

O28 Package

Contextual Info: WS128K32-15XX 128Kx32 SRAM MODULE ADVANCED* FEATURES • Access Times of 15nS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic HIP Package 400 • 68 lead, 40mm Low Profile CQFP, 3.5mm (0.140") (Package 502), Package to be developed

WF2M32-XXX5

Contextual Info: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square

sot 23 70.2

Abstract: L2N7002LT1G marking 702 sot23 702 sot 23 L2N7002LT1G SOT-23
Contextual Info: LESHAN RADIO COMPANY, LTD. Small Signal MOSFET 115 mAmps, 60 Volts L2N7002LT1G N–Channel SOT–23 • 3 We declare that the material of product are Halogen Free and compliance with RoHS requirements. 1 2 • ESD Protected:1000V CASE 318, STYLE 21 SOT– 23 TO–236AB

Contextual Info: LESHAN RADIO COMPANY, LTD. Small Signal MOSFET 115 mAmps, 60 Volts L2N7002LT1G S-L2N7002LT1G N–Channel SOT–23 • 3 We declare that the material of product are Halogen Free and compliance with RoHS requirements. 1 • ESD Protected:1000V • S- Prefix for Automotive and Other Applications Requiring

marking 702

Abstract: 2N7002LT ON
Contextual Info: WILLAS FM120-M+ THRU 2N7002LT1 FM1200-M+ Small Signal MOSFET 115 mAmps, 60 Volts 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V Pb Free Product SOD-123+ PACKAGE Package outline Features • Batch process design, excellent power dissipation offers

MACH211SP

Abstract: mach schematic MACH111SP
Contextual Info: MACH 1 and 2 CPLD Families High-Performance EE CMOS Programmable Logic FEATURES ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ High-performance electrically-erasable CMOS PLD families 32 to 128 macrocells 44 to 100 pins in cost-effective PLCC, PQFP and TQFP packages

MACH131SP-5YC-7YI

Abstract: 14051k MACH Programmer PAL 007 PAL 007 A Pal programming MACH111SP MACH211SP mach210 die Vantis macro gates
Contextual Info: MACH 1 and 2 CPLD Families High-Performance EE CMOS Programmable Logic FEATURES ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ High-performance electrically-erasable CMOS PLD families 32 to 128 macrocells 44 to 100 pins in cost-effective PLCC, PQFP and TQFP packages

Contextual Info: USB97C202 USB 2.0 ATA/ ATAPI Controller Datasheet Product Features 2.5 Volt, Low Power Core Operation Double Buffered Bulk Endpoint 3.3 Volt I/O with 5V input tolerance − Bi-directional 512 Byte Buffer for Bulk Endpoint − 64 Byte RX Control Endpoint Buffer