NITTO TAPE Search Results

nitto SWT 10

Abstract: nitto SWT-20 W07 sot 23 w04 transistor sot 23 UE-111AJ W04 sot 23 transistor w07 transistor marking w08 marking W07 transistor marking w04
Contextual Info: PRODUCT CODING SYSTEM QSP0005_WEB.028 1 2.4.2007 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document. ESD EWS ID MAS MBB T&R 2 Electrostatic Sensitive Device

Adwill D-175

Abstract: UE-111AJ lintec adwill UV tape D-175 UV tape D-175 adwill Lintec UV tape Lintec nitto UE111AJ nitto UV tape D175 lintec
Contextual Info: AN106920 Handling and processing of sawn wafers on UV dicing tape Rev. 2.0 — 13 January 2009 Application note Document information Info Content Keywords Sawn wafers, UV dicing tape, handling and processing Abstract This application note gives hints and recommendations regarding correct

UE-111AJ

Abstract: nitto SWT-20 transistor marking PB nitto UE111AJ ke marking transistor 2091J Nitto marking code transistor HK mas1025 UE111
Contextual Info: 1 PRODUCT CODING SYSTEM 9.12.2004 QSP0005_WEB.026 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document: ESD EWS ID MBB T&R 2 Electrostatic Sensitive Device

FTA160709

Abstract: RF160709 perkin Nitto 5701 perkin 160709 RF16070 Nitto nitto tape
Contextual Info: DATA SHEET MECHANICAL DATA L C .(G) Tvpe/Lenath of item used 1 Type of Reflector (A) RF160709 2 Type of Tape (B) Aluminium Tape N0833S 3 Type of Shield (C) RS160709 4 Trigger w ire [D = (d 1 /d 2 ,d 3 )] White AW G26(35/11,2)mm 5 Type of Flashtube (E) BGDC 0 007/5701

Nitto 5015

Abstract: nitto denko adhesive DAC2450CT1 nitto denko 5015 N5015 nitto tape
Contextual Info: ANTENNA ELEMENT FOR 2.4 GHz DESCRIPTION The DAC Series is a miniature dielectric antenna element for 2.4 GHz wireless LAN systems. This antenna has vertical polarization characteristics. TOKO's proprietary ceramic dielectric material provides excellent stability

SMD LED 5680

Abstract: LC-1500 MAX PLUS II free X362 3M reflective tape nitto tape, 500
Contextual Info: American Opto Plus LED BL-S3547LW-F ™ 34.7mm x 46.70mm ™ V.A.: 30.74mm x x36.24mm ™ FPC Type White Side-Look LCD Backlight PACKAGE DIMENSIONS Notes: 1. All dimensions are in millimeters monitoring Rev. 1.0 July 2006 2. Not Specified tolerance is ± 0.2mm 3.

cirocomm gps receiver

Abstract: cirocomm Cirocomm GPS
Contextual Info: AP.12B.07.0046A Specification Part No. AP.12B.07.0046A Product Name 12mm Two Stage Active GPS Patch Antenna Feature Ultra Miniature GPS active patch High performance Ultra low power consumption RoHS compliant SPE-11-8-126/B | page 1 of 13 1. Introduction This miniaturised GPS Active Antenna

CCL-HL832NX-A

Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
Contextual Info: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize

TSS463

Abstract: Nitto MP8000 MARKING Z86 1000 BASE Isolation Modules 5000V EOS ESD S 61.1 hmt design data book MOLDING MATERIAL MP8000 HT Q100 temic gateway EIA-556-A
Contextual Info: Qualpack TSS463 / TSS461C TSS463 VAN Van Controller Serial Interface TSS461C VAN Van Controller TSS463/TSS461C VAN Controllers 1999 January TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY Rev. 2 – January 1999 1 Qualpack TS80C31X2/C32X2 1. Contents 1. Contents. 2

POWER TRANSFORMER E154515

Abstract: scheme e131175 sampo E159656 foxconn e253117 e131175 XEPEX E140166 sony bando power transformer power transformer e190246 tamradio transformer e199273
Contextual Info: 10129 LIST OF COMPANY IDENTIFICATIONS The List of Company Identifications contains the trade names, trademarks, or other designations authorized for use in lieu of these Company names. ‘‘ ’’ — 2CS SRL ’’ — ACT CO LTD ‘‘ ‘‘ ’’ — 3E HK LTD

texas instruments packing label

Abstract: SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64
Contextual Info: TEXAS INSTRUMENTS Notification for the Qualification of the S-Pad Leadframe Conversion for Certain TQFP Packages October 17, 1995 Abstract Texas Instruments Advanced System Logic ASL is converting conventionally designed leadframes to the newly designed Small Pad (S-Pad) leadframe. This breakthrough in device packaging will make

Denko

Abstract: NITTO DENKO H9004 1.5DS 5Cs transistor separator nitto denko GT13S-1S-HU H9004 1.5CS
Contextual Info: MITSUMI Film Antenna for Digital Terrestrial Broadcasting Receiver DCA-C01 Telecommunication component OUTLINE This film antenna receives the terrestrial digital broadcast signal. Antenna unit can be mounted on the glass window of the car with ease, and has a built-in

nitto UV tape

Abstract: C175 c3136 E250D RA226
Contextual Info: PART NUMBER REV. L C M - H 12 8 6 4 C G W F / C P1 UNC O N TRO LLED D O C U M EN T REV. FRONT VIEW NUMBER AND REVISION COMMENTS DATE A E.C.N. # 1 0 8 6 6 . B E.C.N. # 1 0 9 7 5 . 5 ,2 0 .0 2 4.B .03 C E.C.N. # 1 1 0 2 0 . 7 ,3 0 .0 3 □ E.C.N, # 1 1 0 4 9 ,

SMP1302-099

Contextual Info: DATA SHEET PIN Diode Chips Supplied on Film Frame Features Designed for high-performance switch and attenuator applications ● Preferred device for module applications ● PIN diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green

TAIYO PSR 4000

Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

nitto tape

Contextual Info: PIN Diode Chips Supplied on Film Frame SMP1320-099, SMP1322-099, SMP1340-099, SMP1353-099 Features • Designed for High Performance Switch Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame

Amkor Wafer level mold compound

Abstract: l2aa CCL-HL-832 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Ablestik 2300 4-Layer tepbga-2 CO-029
Contextual Info: LAMINATE data sheet PBGA Innovative designs and expanding package offerings provide a platform from prototype-to-production. Features • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm standard ball pitch available other ball pitches available upon request, (e.g. 0.8mm

l2aa

Abstract: tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound
Contextual Info: LAMINATE data sheet PBGA Features: • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm ball pitch available other ball pitches available upon request • 13 mm to 40 mm body sizes • Thin Au wire (0.5mil or Cu wire compatible • Large mold cap for quality enhancement

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

pin diode SMP

Abstract: SMP1302-099
Contextual Info: PIN Diode Chips Supplied on Film Frame Features • Designed for High Performance Switch and Attenuator Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame ■ Low Cost Description The SMP series of PIN diodes are designed for high

MP 130B

Abstract: sumitomo epoxy LPV324M MP 130B 02 cf 5097 nitto UV tape A193K NSC marking code PB eme-7351ls eme marking sot23
Contextual Info: LPV321/358/324 Qualification Package 9µA Op Amp Family With 150kHz GBW NEW LPV FAMILY Part # Function Package LPV321 LPV358 LPV324 Single Dual Quad SC70-5, SOT23-5 SOIC, MSOP SOIC, TSSOP LPV Series LMV Series National’s Low-Power LPV300 Familiy IN SC70 Packaging

MO-150

Abstract: C194 MP8000AN G600 MO-137 amkor
Contextual Info: LEADFRAME data sheet SSOP Features: Shrink Small Outline SSOP Packages: How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them. The body size was compressed and the lead pitch tightened to obtain a smaller

Carrollton Semiconductor

Contextual Info: 0 .O P IE K Emitter and Photosensor Chips Optek Technology, Inc. is widely recognized as one of the industry's leading suppliers of high quality gallium arsenide GaAs and gallium aluminum arsenide (GaAIAs) infrared emitter chips and silicon photosensor chips. In hybrid or other applications, where space forbids use

Contextual Info: OPTEK Emitter and Photosensor Chips Optek Technology, Inc. Is widely recognized as one of the industry's leading suppliers of high quality gallium arsenide GaAs and gallium aluminum arsenide (GaAIAs) infrared emit­ ter chips ana silicon photosensor chips. In hybrid or other applications, where space forbids