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    CSP80 Datasheets (1)

    Richco
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    CSP8-01
    		Richco Accessories, Hardware, Fasteners, Accessories, COLLAR SPACER PIN .436" Original PDF 1
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    CSP80 Price and Stock

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    Essentra Components CSP8-01

    Spacer Snap-Lock 8.3mm-ID 11mm-OD 5.5mm-LG Nylon 6/6
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Verical () CSP8-01 5,000 1,000
    • 1 -
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    • 100 -
    • 1000 $0.22
    • 10000 $0.22
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    CSP8-01 400 195
    • 1 -
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    • 100 -
    • 1000 $0.36
    • 10000 $0.36
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    Mouser Electronics CSP8-01 9,457
    • 1 $0.28
    • 10 $0.21
    • 100 $0.18
    • 1000 $0.16
    • 10000 $0.16
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    RS CSP8-01 Bulk 4 Weeks 1,000
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    • 1000 $0.17
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    Onlinecomponents.com CSP8-01 5,000
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    • 1000 $0.16
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    Bisco Industries CSP8-01 400
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    Interstate Connecting Components CSP8-01 959
    • 1 $0.16
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    • 100 $0.16
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    • 10000 $0.13
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    DB Roberts CSP8-01
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    Master Electronics CSP8-01
    • 1 -
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    • 1000 $0.15
    • 10000 $0.14
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    LEM Holdings SSA CAB 500-C/SP8-000

    Board Mount Current Sensors
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    Mouser Electronics CAB 500-C/SP8-000
    • 1 -
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    • 100 $60.07
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    LEM Holdings SSA CAB 500-C/SP8-002

    Board Mount Current Sensors
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    Mouser Electronics CAB 500-C/SP8-002
    • 1 -
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    • 100 $60.89
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    LEM Holdings SSA CAB 500-C/SP8-001

    Board Mount Current Sensors
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    Mouser Electronics CAB 500-C/SP8-001
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    • 100 $60.89
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    LEM Holdings SSA CAB 500-C/SP8-003

    Board Mount Current Sensors
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics CAB 500-C/SP8-003
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    • 100 $60.89
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    Find more CSP80 price and stock on Findchips.com

    CSP80 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    CSI-3-135

    Abstract: INCOMING RAW MATERIAL INSPECTION procedure csp-1-122 4202 bd MAS-2-100 CSP-8-013 INCOMING RAW MATERIAL INSPECTION report
    Contextual Info: NATIONAL SEMICONDUCTOR CORPORATION QUALITY POLICY MANUAL SC CP-0008 REVISION BE PAGE 1 OF 12 THIS DOCUMENT IS UNCONTROLLED UNLESS IT IS PART OF A DCB/TOC OR IS VIEWED ONLINE


    Original     		cp-00089707201641cgaysccsi-3-135incoming raw material inspection procedure+5csp-1-1224202 bdmas-2-100csp-8-013incoming raw material inspection report PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		taiyo psr 4000manual pace psr 800hc-100-x2ablebond 8360+6taiyo psr 4000 soldermaskjedec kostat fbgapsr4000-aus5taiyo psr 2000csp192fbga thick tray PDF

    CSP-4

    Abstract: CSR6-224-01 RMS 01 CSR8 CSR6-295-01 CSP6-01 csp8-01 csr8-394-01
    Contextual Info: PART NO. CSP4-01 CSP6-01 CSP8-01 "B" DIA. ±.010 [±0.25] .295 [7.5] .394 [10.0] .436 [11.0] "C" DIA. "D" REF. "E" REF. -.29 [7.3] .33 [8.3] -.12 [3.0] .14 [3.6] .10 [2.5] .20 [5.0] .22 [5.5] "B" "C" MOUNTING HOLE DIA. ±.003 [±0.08] RECOMMENDED SCREW SIZE


    Original     		csp4-01csp6-01csp8-01csr4-224-01+10csr4-295-01csr4-394-01csr4-591-01csr4-787-01csr6-224-01csr6-295-01csp-4rms 01csr8csr8-394-01 PDF

    KL SN 102 94v0

    Abstract: ASTM d4066 ms3367 RBS 6601 Installation guide for RBS 6000 SHK 55-65 Scanbe ejector kit rbs 6501 cr40 steel 11633-1 SCANBE KL SN 102 94v
    Contextual Info: RI-55006 cat cover for pdf 8/5/02 9:48 AM Page 2 2002 NEW PRODUCTS DISTRIBUTOR LOCATIONS WORLDWIDE RICHCO USA Please call Customer Service 773 539-4060, Samples (800) 621-1892, or visit www.richcoinc.com for your nearest distributor location. EUROPE Alldistri Handelsges. m.b.H.


    Original     		ri-550063000-rupea-brasovsr-3230ofs90+12wit-30arppr-10kl sn 102 94v0astm d4066 ms3367rbs 6601installation guide for rbs 6000shk 55-65scanbe ejector kitrbs 6501cr40 steel11633-1 scanbekl sn 102 94v PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		taiyo psr 4000manual pace psr 800ccl-hl-832fbga substrate design guidelines+6jedec kostat fbgaccl-hl832ablebondesec 3018 operationkostat bga 6mm x 6mmnitto hc100 PDF

    bd 4612

    Abstract: CSI-3-135
    Contextual Info: NATIONAL SEMICONDUCTOR CORPORATION QUALITY POLICY MANUAL SC CP-0008 REVISION BF PAGE 1 OF 12 THIS DOCUMENT IS UNCONTROLLED UNLESS IT IS PART OF A DCB/TOC OR IS VIEWED ONLINE


    Original     		cp-00089707201641cgayscthroug16bd 4612+1csi-3-135 PDF