MCKENZIE Search Results

McKenzie

Abstract: McKenzie socket division pga ASTM-B487-79 McKenzie technology pga McKenzie socket division
Contextual Info: High Profile DSP Sockets E L E C T R O N I C S DSC McKenzie Socket Division Elevated DIP Sockets How to Order .DIP, - 3 2 0, - ,3 0 0 B, # of Contacts Product Code D Hi-Temp Material Call Out (Option Contact Style Closed Frame (Option)* Row-to-Row Spacing

AN1900

Contextual Info: Application Note 1900 Author: Philip McKenzie USB to PMBus Adapter USB to PMBus Adapter Quick Start Guide The Intersil USB to PMBus Adapter often referred to as a “dongle” is used to connect a demonstration board with a PMBus interface to a PC. The USB to PMBus adapter is

ASTM-B487-79

Abstract: McKenzie socket division pga b3910 McKenzie socket division valox 420 salt McKenzie 7344-A McKenzie technology sip 157B C130
Contextual Info: Ultra Low Profile DIP Sockets E L E C T R O N I C S MX McKenzie Socket Division Features • Profiles to .083" (2,11 above PCB • Available in our PPC disposable carrier system • Hi-Rel multifinger contacts are non-solder wicking ULTRA LOW PROFILE OPTIONS

Contextual Info: .070" Progression Shrink DIP e l e c t r o n i c s OBK McKenzie Socket Division Insulator Options -c - - T I fO D G tl -LI A B loooooooooooooooooooooooooooooooc J L .070 0 .7 8 TYP OPEN FRAME Features • High Density .070" 1,78 ) progression

Contextual Info: e l e c t r o n i c Wire Jumpers s BMC McKenzie Socket Division Insulated and Bare Wire Jumpers • Available bare or with your choice of two insulation materials • PVC Insulator suitable for jumpering socket terminals • Teflon insulation for direct soldering to PCB or other Hi-Temp applications

Contextual Info: DIP Sockets ELECTRONICS flOK McKenzie Socket Division McKenzie Delivers Choices!! • Largest selection of Contact Options • Open or Closed frame • Disposable Plastic Pin Carrier Option • True Hi-Temp Options - IR and Vapor Phase compatible • End-to-End and Side-to-Side stackable

Contextual Info: Low Profile SIP Sockets E L E C T R O N I C S fflOK McKenzie Socket Division Features LOWEST PROFILE OPTIONS ULTRA LOW PROFILE OPTIONS • Profiles as low as .016" 0 ,4 1 ab ove P C B • X and Y stackable • Single and Dual R ow available Specify Contact/Shell

McKenzie socket division

Contextual Info: ZIP Sockets E L E C T R O N I C S MK McKenzie Socket Division Features LOW PROFILE • For high density m em ory using vertical •lOO (4,19 J TYP. zig -zag in-line patterns _L n r X .125 T (3,17) -.020 (0,51) TYP. Specify Contact/Shell 001B • Available in 16, 18, 2 0 , 2 4 , and 2 8 positions

LTC4009-2

Abstract: LTC4009-1 ltc3608 LTC4009 LTC4008 10A PWM Charger 2N7002 LTC4006 LTC4007 LTC4011
Contextual Info: L DESIGN FEATURES Feature-Packed Charger Handles All Battery Chemistries and Produces 3A/50W for Fast Charging from a 4mm x 4mm QFN by James A. McKenzie Introduction The LTC4009, LTC4009-1 and LTC4009-2 are a family of high power battery charger ICs that achieve a small

QQ-B-750

Abstract: alloy 25 BeCu McKenzie technology sip gold 400B 401B 402B 403B 410B 411B ASTM-B487-79
Contextual Info: fflCX McKenzie Socket Division Insulator Options 3 LEVEL WIRE WRAP 2 LEVEL WIRE WRAP 1 r .116 2.95 u .360 (9,14) .0 2 5 (0,63) SQ OPEN FRAME T .116 (2,951 .193 (4,90) .193 (4,90) .500 (12,70) .0 2 5 (0,63) SQ Standard Insertion Force Standard Insertion Force

011B

Abstract: MIL-P-13949 MIL-STD-109 Brass per QQ-B-626, Alloy 360 McKenzie IEC-68-2-14 410B zytel fr50 HT2004 dip molding machine
Contextual Info: fflCX McKenzie Socket Division • Integral Decoupling Capacitor reduces noise • SMT construction eliminates capacitor intermittence during thermal cycling GROUND PLANE • Three standard capacitance values: .01, .10, .33 jf — Specify in part number • For other capacitance values, please consult factory

Contextual Info: Pressfit Sockets ELECTRONI CS MOK McKenzie Socket Division Features • Pressfit eliminates soldering • Ideal for backplane applications • Retention force exceeds 12 pounds in .039" 0,99 plated Thru-Hole (PTH) • Sizes for .062" (1,57) and .125" (3,18) PCB thickness

Contextual Info: DIP Headers E L E C T R O N I C S OMK McKenzie Socket Division Insulator Options Specify Plating Specify Plating 922H 10p" Gold 935H 10p” Gold PTH = .027 ± .003 PTH = .027 ± .003 OPEN FRAME .021 0,53 r TYP .030 — (0.76) l TYP f .600 I (15,24) .315 1

Contextual Info: .025" Post Extended Headers e l e c t r o n i c s BMC McKenzie Socket Division Features PHS-H1 Single row Extended header • Ideal board-to-board interconnection • Tin or Gold Plating • E xtended headers a re also available in 2 m m progression • Available up to 4 0 positions in single

CTX02-17314

Abstract: LTC4011 dct20efd potential divider thermistor CTX02 IPC222 DCT20EFD-UXXS003 CTX02-17144 LT3750 MURS160
Contextual Info: DESIGN FEATURES L High Efficiency Nickel Charger Operating to 34V is Easily Configured to Deliver a Safe Fast Charge by James A. McKenzie Introduction Accurate, Rock-Solid Fast Charge Termination The LTC4011 implements a complete fast charge control algorithm, best

Contextual Info: Ultra Low Profile DIP Sockets ELECTRONICS MX McKenzie Socket D ivision Features • Profiles to .083" (2,11 above PCB • Available in our PPC disposable carrier system • Hi-Rel multifinger contacts are non-solder wicking U LTR A LOW PRO FILE OPTIONS

Contextual Info: SIP Headers ELECTRONICS fflOK McKenzie Socket Division SST — Male to Male Header Options .0 1 8 0.46 .166 (*.22) i .018 — (0.46) Specify 884S PTH = Plating/Material 10p" Gold/Brass .024 ± .003 Specify 886S PTH = Plating/Material 10p" Gold/Brass .024 ± .003

McKenzie socket division

Contextual Info: Specialty DIP Sockets ELECTRONICS MK McKenzie Socket Division DIP Clamps • Positive 1C retention in high shock or vibration environm ents • Designed to fit M cKenzie Technology's standard open or closed fram e DIP sockets DIP INSULATOR CENTERS THICKNESS

McKenzie socket division

Contextual Info: fflSX McKenzie Socket Division Insulator Options 3 LEVEL W IRE W RAP 2 LEVEL W IRE W RAP OPEN FRAME Standard Insertion Force Standard Insertion Force Specify Contact/Shell 400B 30p" Gold/200 j" Tin Specify Contact/Shell 41 OB 30p" Gold/200|j" Tin 30p" Gold/10p" Gold

PLCC-52P-T

Abstract: bj 945 PLCC-68P-T-2 PLCC44PTSMT PLCC-44-P-T PLCC-84P-T-2 plcc-32p PLCC-84P-T PLCC-20P-T-SMT mckenzie plcc
Contextual Info: Surface Mount PLCC Sockets e l e c t r o n i c s McKenzie Socket Division — A - » r 0 ,067,T Y P 1 <1.70> B a s 9 J_SffliiP . r ~ D m ä T U ’> l— c— r .060 T Y P i i^ S , Optional Alignment Peg - 1‘~^iM>TYP PCB Pad Layout - e r iM P f lN F N T S -

862S

Abstract: FR 530 POLYESTER UL MIL-P-13949 924H ASTM-B567 McKenzie technology sip pga socket 867s 867s gold socket McKenzie socket division
Contextual Info: fnKC McKenzie Socket Division — r .460 r .585 I 14,86 •250 (6,35) 1 ,210(11’,68) Plating/Material Specify Plating/Material Specify Plating/Material 870S 10p" Gold/Brass 861S 10|j" Gold/Brass 867S 10p" Gold/Phosphor Bronze PTH = .027 ± .003 857S 200|j" Tin/Brass

mckenzie

Abstract: valox 420 salt MIL-P-13949 DC600P-118-FR50 McKenzie socket division pga zytel fr50 mil-m-24519 molding plastics McKenzie technology sip zytel fr 72 ASTM-B487-79
Contextual Info: Specialty DIP Sockets E L E C T R O N I C S I80K McKenzie Socket Division DIP Clamps • Positive 1C retention in high shock or vibration environments • Designed to fit McKenzie Technology's standard open or closed frame B DIP sockets DIP INSULATOR CENTERS

Contextual Info: Intel P6 Socket EL ECTRONI CS tHK McKenzie Socket Division • The socket body is injection molded PPS and features tabs to which a heat sink can be attached via a heat sink clip. •IDO TYP • The dimensions and placement of the heatsink : tabs match those detailed in Intel’s P6 socket

McKenzie socket division

Contextual Info: DIP Sockets ELECTRONICS BMC McKenzie Socket Division McKenzie Delivers Choices!! • Largest selection of Contact Options B • Open or Closed frame • Disposable Plastic Pin Carrier Option • True Hi-Temp Options - IR and Vapor Phase compatible • End-to-End and Side-to-Side stackable