M582 Search Results

ding-dong

Abstract: door bell M581 DING DONG BELL M582 TO92-4L M581P 5ABZ
Contextual Info: TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 SOUND EFFECT 電源控制 單音門鈴 IC DING-DONG DOOR BELL M581/M582 FEATURES 功能敘述

ic m581a

Abstract: M581A BUZZER DRIVER DING DONG BELL door buzzer door bell M582A TO92-3L TO92-4L door bell ic
Contextual Info: TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 SOUND EFFECT DING-DONG DOOR BELL M581A/M582A 单音门铃 IC FEATURES 功能叙述 M581A M582A

se 145

Abstract: km41256 dram
Contextual Info: KM M48256/KM M48257 KM M58256/KM M58257 MEMORY MODULES 2 5 6 K x 8 Bit DRAM Memory Modules SIP/SIMM FEATURES GENERAL DESCRIPTION • 262,144 x 8-bit Organization • Performance range: • • • • • • • tRAC tcAc ÍRC KMM48256/7-12 120ns 60ns 230ns

H-Bridge

Contextual Info: 10-FY064PA050SG10-M582F08 600V/50A flowPACK 1H Features flow 1 ● Low inductive 12mm flow1 package ● H-Bridge topology ● High-speed IGBT + ultrafast FWD ● Temperature sensor Target Applications Schematic ● Solar inverter ● Power Supply ● Inverter based welding

odq1

Contextual Info: SAMSUNG SEMICONDUCTOR INC E3E D 7Tfcj 4145 0 0 0 Ô 2 D ? KM M48256/KM M58256 7 MEMORY MODULES 256K x8 Bit DRAM SIP and SIMM Memory Modules T-46,'23-ft FEATURES GENERAL DESCRIPTION • 262,144 x 8-bit Organization • Performance range: The Samsung KMM48256 and M58256 are

Contextual Info: 10-FY064PA050SG10-M582F08 H-Bridge Application flowPACK 1H 600V/50A General conditions H Bridge SPWM VGEon = 15 V VGEoff = -15 V Rgon = 8 Ω Rgoff = 8 Ω IGBT Figure 1 FWD Figure 2 Typical average static loss as a function of output current Ploss = f Iout

Contextual Info: TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 SOUND EFFECT DING-DONG DOOR BELL M581A/M582A 單音門鈴 IC FEATURES 功能敘述 • MODE：VDD Control.

Contextual Info: TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 SOUND EFFECT DING-DONG DOOR BELL M581A/M582A 单音门铃 IC FEATURES 功能叙述 M581A M582A

Contextual Info: TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 SOUND EFFECT DING-DONG DOOR BELL M582A 單音門鈴 IC FEATURES 功能敘述 ‧ Ding-Dong 2 times.

KM41256

Abstract: 30 pin SIP dram memory 256KX8 SIMM
Contextual Info: KMM48256/KMM48257 KM M58256/KM M58257 MEMORY MODULES 2 5 6 K x 8 Bit DRAM Memory Modules SIP/SIMM GENERAL DESCRIPTION FEATURES • 262,144 x 8-bit Organization • Performance range: • • • • • • • tRAC tcAc Í rc K M M48256/7-12 120ns 60ns 230ns

Contextual Info: TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 SOUND EFFECT 电源控制 单音门铃 IC DING-DONG DOOR BELL M581/M582 FEATURES 功能叙述

Contextual Info: TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 SOUND EFFECT DING-DONG DOOR BELL M581A/M582A 单音门铃 IC FEATURES 功能叙述 M581A M582A

sn76131

Abstract: tlo72cp TOSHIBA 2N3055 M53207P 2N3055 TOSHIBA KIA7313AP kia7640ap LA5530 M5L8155P TBB1458B
Contextual Info: ACTIVE ELECTRONICS COMPONENTS CROSS REFERENCE GUIDE 2SC429GTM 2SC458 2SC458LG 2SC503 2SC504 2SC510 2SC512 2SC519 2SC520A 2SC594 2SC699A 2SC780 2SC809-1 2SC945 2SC3012 2SC3074 2SC3114 2SC3115 2SC3116 2SC3117 2SC3134 2SC3135 2SC3138 2SC3143 2SC3144 2SC3145 2SC3157

2200nF

Abstract: M5562 f-1123 22 nF, 63 M5333K kerko F568 F5123
Contextual Info: Bedrahtete Kondensatoren, EIA-Standard X7R Eigenschaften ● ● ● ● Hohe Volumenkapazität Nichtlineare Kapazitätsänderung Hoher Isolationswiderstand Impulsfest Anwendungen ● ● ● ● Abblockung Kopplung Entkopplung Entstörung Anschlüsse Maße mm

transistor m1104

Abstract: transistor k2333 k3332 G5684 K2040 k3561 k3562 k2333 M5223 k2182
Contextual Info: Contents List of Ordering Codes 5 8 Multilayer Chip Capacitors 11 Multilayer Leaded Capacitors 57 General Technical Information Mounting Instructions for Chip Capacitors 75 88 Measuring and Test Conditions Quality Assurance 99 103 Taping and Packing 111 Symbols and Terms

FZK101

Abstract: FZK105 upd101 SNF10 SN76131 TAA700 FZH111 FZJ101 MFC8010 MFC8001
Contextual Info: HANDBOOK OF INTESBATEI CIRCUITS in EQUIVALENTS AND SUBSTITUTES A lthough every care is taken with the preparation of this book, the publishers will not be responsible for any errors that might occur. I.S.B.N. 0 900162 35 X 1974 by Bernard B. Babani First Published 1974

m1104

Abstract: NF 028 nf 820 M5562 M5105 B37987-M1104-M54 NF82 M1683 M5683 NF820
Contextual Info: Multilayer Leaded Capacitors, EIA Standard X7R/B Characteristic Features ● ● ● ● High volumetric efficiency Non-linear capacitance change High insulation resistance High pulse strength Applications ● ● ● ● Blocking Coupling Decoupling Interference suppression

B37987-F1104-K51

Abstract: M5183 M5562 siemens leaded ceramic capacitors ,Siemens ceramic Capacitors Siemens ceramic Capacitors siemens capacitors m5103 M1124 x7r capacitors siemens
Contextual Info: Leaded Capacitors, EIA Standard X7R Features ● ● ● ● High volumetric efficiency Non-linear capacitance change High insulation resistance High pulse strength Applications ● ● ● ● Blocking Coupling Decoupling Interference suppression Terminals

CLEVO

Abstract: 9lpr600 ITE8512E ITE-8512E m74S SMG 101 ITE8512 Sis 968 M740S M740SU
Contextual Info: Preface Notebook Computer M740SU/M760SU Service Manual Preface I Preface Notice The company reserves the right to revise this publication or to change its contents without notice. Information contained herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are

D501

Abstract: B37741 k1060 smd tabellen Siemens Matsua Components Bestellnummern-Verzeichnis K0682 d5050 nf schaltungen NDKM B37872
Contextual Info: Inhaltsverzeichnis Bestellnummernverzeichnis Seite 5 8 Lieferübersicht Elektrische Kurzdaten 11 26 Standard-Chip-Kondensatoren Slim-Line Kondensatoren 27 55 Bedrahtete Kondensatoren, EIA-Standard Bedrahtete Kondensatoren, CECC-Standard 59 68 Allgemeine technische Angaben

D5392

Contextual Info: Leaded Capacitors, EIA Standard X7R Features • • • • High volumetric efficiency Non-linear capacitance change High insulation resistance High pulse strength Applications • • • • Blocking Coupling Decoupling Interference suppression Terminals

KMM58256-12

Contextual Info: MEMORY MODULES KMM48256/M58256 256K X 8 Bit DRAM SIP and SIMM Memory Modules FEATURES GENERAL DESCRIPTION • 262,144 X 8-bit Organization • Performance range: The S am sung KM M 48256 and M58256 are 256K x 8 dyn am ic RAM high d e nsity m em ory m odules.

108-18782

Abstract: MS-8288 DIN 72551 MS8288 MS828
Contextual Info: T H I S DRAWING IS U N P U B L I S H E D . VERTRAUL I CHE UNVEROEPPENTLI CHTE ZEICHNUNG C O P Y R I G H T 20 00 k L L L a SLD FOR r U D L I C A T I ON FP F I FMFP w pnnFFFFM TI IfH IIM fi-ALL RIGHTS RESERVED. ALLE RECHTE VORBEHALTEN. M A T E D W I TH;

44C256BJ

Abstract: O-256K KMM58256BN
Contextual Info: M58256BN DRAM MODULES 256KX8 DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • Performance range: The Samsung KM M 58256BN is a 2 6 2 ,1 4 4 bit X 8 Dynamic RAM high density memory module. The Sam­ sung KM M 58256BN consist of two 1M bit DRAMs KM 44C256BJ - 2 5 6 K X 4 in 20-pin SOJ packages