LFBGA56 Search Results

sot516

Contextual Info: PDF: 1999 Jun 07 Philips Semiconductors Package outline LFBGA56: plastic low profile fine-pitch ball grid array package; 56 balls; body 6 x 6 x 1.05 mm SOT516-1 D ball A1 index area A2 A E A1 detail X A b ∅w M y v A ZD e ZE K J H G e F E D C B A 1 2 3 4

SOT516

Abstract: LFBGA56
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline LFBGA56: plastic low profile fine-pitch ball grid array package; 56 balls; body 6 x 6 x 1.05 mm D SOT516-1 A B ball A1 index area A2 A E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E

565FHE

Contextual Info: RENESAS Code PLBG0565KA-A w S B JEITA Package Code P-LFBGA565-15x15-0.50 D Previous Code 565FHE w S A MASS[Typ.] 0.6g φb A A1 φx M S AB ZD e e A ×4 y S v Index mark Laser mark S B ZE E AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A Reference

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

SST39WF160x

Abstract: AM29F SST25VF016B tsop i 12mmx20mm 48-WFBGA SST38VF640x TSOP 28 SPI memory Package flash FLASH CROSS sst39vf040 WFBGA-48 48TSOP
Contextual Info: Silicon Storage Technology, Inc. NOR Flash Cross Reference Guide 1.8V, 3V, 5V www.SST.com Comparison Guide Spansion Company Density Spansion SST SST AM29F SST39SF S29AL S29GL SST39VF SST38VF S29AS SST39WF 1 ~ 32 Mb 2 ~ 16 Mb 1 ~ 4 Mb 4 ~ 32 Mb 16 Mb ~ 1Gb

Contextual Info: Philips Sem iconductors Product specification 64 macrocell CPLD with enhanced clocking FEATURES Table 1. PZ3064A/PZ3064D Features • Industry’s first TotalCMOS PLD - both CM OS design and process technologies PZ3064A/PZ3064D Usable gates • Fast Zero Power FZP™ design technique provides ultra-low

PZ3064AS10BP

Abstract: PZ3064DS10 PZ3064DS10BC
Contextual Info: INTEGRATED CIRCUITS PZ3064A/PZ3064D 64 macrocell CPLD with enhanced clocking Product specification Supersedes data of 1999 May 07 IC27 Data Handbook Philips Semiconductors 1999 Jun 16 Philips Semiconductors Product specification 64 macrocell CPLD with enhanced clocking

handbook philips ic26 packaging

Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors

PQFP100

Abstract: PQFP160 XILINX LQFP128 PZ5064CS10 PACKAGE LQFP128 PZ3064AS10 TQFP100 tQFP100 package TQFP44 package PLCC44 package
Contextual Info: Exh C - Att: 1 December 1999 LIST OF PHILIPS CPLD COOLRUNNER PARTS SOLD AND TRANSFERRED TO XILINX INC. 12NC 935239090557 935239090551 935262246551 935262246518 935262221557 935262221551 935260106112 935260109112 935260112112 935260107112 935260110112 935260113112

plcc32 pinout

Abstract: BIOS 32 Pin PLCC TSOP 28 SPI memory Package flash 89C58 64Kx8 CMOS RAM sst BIOS 8 Pin PLCC tsop32 static ram 64kx8 SST49LF040A MCU 64KX16
Contextual Info: Application Specific Memory Products Serial Flash—45 Series ComboMemory Family—31, 32 & 34 Series The Serial Flash family of products is a low-power application specific memory that implements Read and Program/Erase operations through the Serial Peripheral Interface SPI bus compatible serial protocol.