Part Number
    Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    LAND PATTERN FOR TSOP 2 Search Results

    LAND PATTERN FOR TSOP 2 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MD80C187-12/B
    Rochester Electronics LLC 80C187 - Math Coprocessor for 80C186 PDF Buy
    MD80C187-10/B
    Rochester Electronics LLC 80C187 - Math Coprocessor for 80C186 PDF Buy
    MD8284A/B
    Rochester Electronics LLC 8284A - Clock Generator and Driver for 8066, 8088 Processors PDF Buy
    AM79C961AVI
    Rochester Electronics LLC Full Duplex 10/100 MBPS ETHERNET Controller for PCI Local Bus, PCNET- ISA II jumperless PDF Buy
    AM79C961AVC\\W
    Rochester Electronics LLC Full Duplex 10/100 MBPS ETHERNET Controller for PCI Local Bus, PCNET- ISA II jumperless PDF Buy

    LAND PATTERN FOR TSOP 2 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    land pattern for TSOP 2 54 pin

    Abstract: land pattern for TSOP 56 pin TSOP 54 land pattern 40013A land pattern for TSOP
    Contextual Info: n H igh p e rfo rm a n c e 1 M X 8 /5 1 2 K X 1 6 2.2V CMOS Flash EEPROM AS29LL8ÜÖ II 1 M X 8 / 5 1 2 K X 1 6 CMOS Flash EPROM Advance information Features •O rganization: 1M x 8/512K x 16 • Sector architecture - • Low power consumption - 8 mA typical read current


    OCR Scan
    AS29LL8Ü 8/512K 48-pin land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin TSOP 54 land pattern 40013A land pattern for TSOP PDF

    land pattern for TSOP

    Abstract: 7402 ED-7402 DATA SHEET 7402 7402 data sheet ed 012GL 2008 land pattern for TSOP 2
    Contextual Info: TSOP 1 LAND PATTERN DIMENSIONS CONDITIONAL TERMINAL : LENGTH OF SOLDERED PART (L) HD D I2 β1 MID HD+2 β 2 β2 L b b2 Dimension Parameter e 0.50 β1 β2 γ 0.20 0.20 0.25 b2 e L1 MID I2 GDMIN. =HDMIN. −2LMAX. MID=GDMIN. −2 β 1 I2 (HDMAX. +2 β 2−MID)/2


    Original
    ED-7402-3 land pattern for TSOP 7402 ED-7402 DATA SHEET 7402 7402 data sheet ed 012GL 2008 land pattern for TSOP 2 PDF

    land pattern for TSOP

    Abstract: 7402 DATA SHEET 7402 land pattern for TSOP 2
    Contextual Info: TSOP 1 LAND PATTERN DIMENSIONS CONDITIONAL TERMINAL : LENGTH OF SOLDERED PART (Lp) I2 β1 MID HD+2 β 2 Lp β2 b b2 Dimension Parameter e 0.50 β1 β2 γ 0.20 0.20 0.25 e b2 L1 MID A3=0.25 HD D I2 GDMIN. =HDMIN. −2Lp MAX. MID=GDMIN. −2 β 1 I2 (HDMAX. +2 β 2 −MID)/2


    Original
    ED-7402-3 land pattern for TSOP 7402 DATA SHEET 7402 land pattern for TSOP 2 PDF

    land pattern for TSOP

    Abstract: land pattern for TSOP 2
    Contextual Info: TSOP 2 LAND PATTERN DIMENSIONS CONDITIONAL TERMINAL : LENGTH OF SOLDERED PART (L) HE E I2 β1 MIE HE+2 β 2 L β2 b b2 Dimension Parameter e 1.27 0.80 β1 β2 γ 0.20 0.20 0.30 to 0.57 0.20 0.20 0.30 b2 e L1 MIE I2 GEMIN. =HEMIN. −2LMAX. MIE=GEMIN. −2β 1


    Original
    ED-7402-4A land pattern for TSOP land pattern for TSOP 2 PDF

    land pattern for TSOP

    Abstract: land pattern for TSOP 2
    Contextual Info: TSOP 2 LAND PATTERN DIMENSIONS CONDITIONAL TERMINAL : LENGTH OF SOLDERED PART (Lp) I2 β1 MIE HE+2 β 2 Lp β2 b b2 Dimension Parameter e 1.27 0.80 β1 β2 γ 0.20 0.20 0.30 to 0.57 0.20 0.20 0.30 e b2 L1 MIE A3=0.25 HE E I2 GEMIN. =HEMIN. −2Lp MAX. MIE=GEMIN. −2 β 1


    Original
    ED-7402-4A land pattern for TSOP land pattern for TSOP 2 PDF

    Contextual Info: H ig h P e rfo rm a n c e lMx4 CMOS DRAM A S4C 14400 h II , 1 1M x 4 CMOS DRAM fast page m ode Prelim inary inform ation Features • 1 0 2 4 r e f r e s h c y c le s , 1 6 m s r e f r e s h in te r v a l • O r g a n iz a t io n : 1 , 0 4 8 ,5 7 6 w o r d s x 4 b its


    OCR Scan
    o00oo PDF

    Contextual Info: d t ) LOW POWER 3.3V CMOS FAST SRAM 256K 32K x 8-BIT) IDT71V256SA In tegrated D evice T echnology, Inc. FEATURES DESCRIPTION • Ideal for high-performance processor secondary cache • Commercial (0° to 70°C) and Industrial (-40° to 85°C) temperature options


    OCR Scan
    IDT71V256SA 10/12/15/20ns 28-pin IDT71V256SA 144-bit 727-C11« 492-M74 10-U4-2070 PDF

    Contextual Info: H igh perform ance 128KX8 5 V CMOS Flash EEPROM H A S29F010 II 1 2 8 K X 8 CMOS Flash EEPROM Features • O r g a n iz a t io n : 12 8 K x 8 b its • JEDEC s ta n d a r d w r i t e c y c le c o m m a n d s - p ro te c ts da ta fro m accidental changes • S e c to r E rase a r c h ite c tu r e


    OCR Scan
    128KX8 S29F010 PDF

    Contextual Info: jd t Integrated Device Technology, Inc. 3.3V CMOS FAST SRAM WITH 2.5V COMPATIBLE INPUTS 256K 32K x 8-BIT) IDT71V256SB FEATURES DESCRIPTION • Ideal for high-perform ance processor secondary cache • Fast access tim es: — 12/15/20ns • Inputs are 2.5V and LVTTL com patible: V ih = 1,8V


    OCR Scan
    IDT71V256SB T71V256SB 144-bit IDT71V256SB IDT71V256SA. 727-C11« 492-M 4A25771 PDF

    Contextual Info: jdt 3.3V CMOS STATIC RAM 4 MEG 256K x 16-BIT) PRELIMINARY I n t e g r a t e d D e v i c e T e c h n o lo g y , In c . FEATURES: • 256K x 16 advanced high-speed CMOS Static RAM • JEDEC Center P ow er/G N D pinout for reduced noise. • Equal access and cycle times


    OCR Scan
    16-BIT) 10/12/15ns 44-pin, IDT71V416 194304-bit PDF

    DD27D

    Abstract: land pattern for TSOP 2 50 MB257 TM 1828
    Contextual Info: 3.3V CMOS STATIC RAM 32Kx 16-BIT PRELIMINARY IDT71V008 Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • 32K x 16 advanced high-speed CMOS Static RAM • Equal access and cycle times — 10/12/15/20ns • One Chip Select plus one Output Enable pin


    OCR Scan
    16-BIT IDT71V008 10/12/15/20ns 44-pin IDT71V008 288-bit 910-338-207Q DD27D land pattern for TSOP 2 50 MB257 TM 1828 PDF

    woy transistor

    Contextual Info: LOW POWER 2V CMOS SRAM 1 MEG 128KX 8-BIT ADVANCE INFORMATION IDT71T024L Integrated D e v ic e T e ch n o lo g y, Inc. FEATURES: DESCRIPTION: • • • • • • • The IDT71T024L is a 1,048,576-bit very low-pow er Static RAM organized as 1 2 8 K x 8 . It is fabricated using ID T’s highreliability CMOS technology. This state-of-the-art technology,


    OCR Scan
    128KX IDT71T024L 150ns, 200ns 32-pin IDT71T024L 576-bit 10-338-207Q woy transistor PDF

    Contextual Info: LOW POWER 3V CMOS SRAM 1 MEG 128Kx 8-BIT ADVANCE INFORMATION IDT71V024L Integrated D e v ic e T e ch n o lo g y, Inc. FEATURES: DESCRIPTION: • • • • • • • The ID T71V024L is a 1,048,576-bit very low-pow er Static RAM organized as 1 2 8 K x 8 . It is fabricated using ID T’s highreliability CMOS technology. This state-of-the-art technology,


    OCR Scan
    128Kx IDT71V024L T71V024L 576-bit 10-338-207Q PDF

    ln 3624

    Abstract: ansi y14.5m-1982 decimal .xxxx 71V416S15
    Contextual Info: PRELIMINARY IDT71V416 3.3V CMOS STATIC RAM 4 MEG 256Kx 16-BIT I n t e g r a t e d D e v iz e T e c h n o lo g y , l i e . FEATURES: • 256K x 16 advanced high-speed CMOS Static RAM • JEDEC Center Power /GND pinout for reduced noise. • Equal access and cycle times


    OCR Scan
    256Kx 16-BIT) IDT71V416 8/10/12/15ns 44-pin, IDT71V416 194304-bit high-reliabil005 MS-027, ln 3624 ansi y14.5m-1982 decimal .xxxx 71V416S15 PDF

    BGA reflow guide

    Abstract: Senju Sn3.0Ag0.5Cu land pattern for TSOP 2 86 PIN 52-pin TSOP ED-7404A senju solder paste vapor phase printer component wiring diagram for float switch with pressure tank TSOP 66 Package thermal resistance land pattern for TSOP 2 54 pin
    Contextual Info: Renesas Surface Mount Package Rev.2.00 2003.12.1 Renesas Surface Mount Package User's Manual REJ11K0001-0200Z Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is


    Original
    REJ11K0001-0200Z BGA reflow guide Senju Sn3.0Ag0.5Cu land pattern for TSOP 2 86 PIN 52-pin TSOP ED-7404A senju solder paste vapor phase printer component wiring diagram for float switch with pressure tank TSOP 66 Package thermal resistance land pattern for TSOP 2 54 pin PDF

    Contextual Info: LOW POWER 2V CMOS SRAM 1 MEG 128KX 8-BIT ADVANCE INFORMATION IDT71T024 I n te g r a te d D e v iz e T e c h n o lo g y , l i e . FEATURES: DESCRIPTION: • 128K x 8 Organization • Wide Operating Voltage Range: 1.8V to 2.7V • Commercial (0° to 70°C) and Industrial (0° to 70°C)


    OCR Scan
    128KX IDT71T024 150ns, 200ns 10jxA 32-pin, 46-BALL IDT71T024 576-bit 10-338-207Q PDF

    Contextual Info: H igh Perform ance lMx4 CMOS DRAM |B AS4C14405 A ! M x 4 CMOS EDO DRAM Preliminary information Features • O r g a n iz a t io n : 1 , 0 4 8 , 5 7 6 w o r d s x 4 b its • 1 0 2 4 r e f r e s h c y c le s , 1 6 m s r e f r e s h in t e r v a l • H ig h sp e ed


    OCR Scan
    AS4C14405 PDF

    ed9a

    Abstract: woy transistor
    Contextual Info: LOW POWER 2V CMOS SRAM 1 MEG 128KX 8-BIT ADVANCE INFORMATION IDT71T024 I n te g r a te d D e v iz e T e c h n o lo g y , l i e . FEATURES: DESCRIPTION: • 128K x 8 Organization • Wide Operating Voltage Range: 1.8V to 2.7V • Commercial (0° to 70°C) and Industrial (0° to 70°C)


    OCR Scan
    128KX IDT71T024 150ns, 200ns 10jxA 32-pin, 46-BALL IDT71T024 576-bit 10-338-207Q ed9a woy transistor PDF

    Indium Tac Flux 020

    Abstract: CU-106A CU-106A shelf life of BGAS DALE SOMC k type thermocouple utl USR(pet) gold embrittlement
    Contextual Info: APPENDIX A Surface Tension and the Self-Centering of BGAs ITS PHYSICS ARE REVIEWED T O G E TH E R W I T H SOLDER TYPE, TEM PERATURE A N D THE PRESENCE OF C O N T A M I N A T E S A N D H O W THEY IN F LU E N C E By Steve G r e a t h o u s e THE S E L F - A L I G N I N G M O V E M E N T OF DEVICES D U R I N G


    OCR Scan
    PDF

    Intel reflow soldering profile BGA

    Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
    Contextual Info: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.


    Original
    conductivi49-58. Intel reflow soldering profile BGA all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment PDF

    Contextual Info: J d t 3.3V CMOS STATIC RAM 4 MEG 512K X 8-BIT) ADVANCE r o V424S IDT71V424L I n t e g r a t e d D e i/ ic e T e c h n o l o g y , I n c . FEATURES: DESCRIPTION: • 512K x 8 advanced high-speed CMOS Static RAM • JEDEC Center Power / GND pinout for reduced noise


    OCR Scan
    V424S IDT71V424L 10/12/15ns 36-pin, 44-pin, IDT71V424 304-bit PDF

    Contextual Info: LOW POWER 3V CMOS SRAM 1 MEG 128Kx 8-BIT ADVANCE INFORMATION IDT71L024 Integrated Devise Technology, ]hc. FEATURES: DESCRIPTION: • 128K x 8 Organization • Wide Operating Voltage Range: 2.7V to 3.6V • Commercial (0° to 70°C) and Industrial (-40° to 85°C)


    OCR Scan
    128Kx IDT71L024 100ns 32-pin, 46-BALL T71L024 576-bit 910-338-207Q PDF

    Contextual Info: jdt Integrated Device Technology, Inc. 3.3V C M O S STATIC RAM 1 MEG 128K x 8) CENTER POWER & GROUND PINOUT PRELIMINARY IDT71V124SA FEATURES: DESCRIPTION: • 128K x 8 advanced high-speed C M O S static RAM • JED EC revolutionary pinout (center power/GND) for


    OCR Scan
    IDT71V124SA 10/12/15/20ns 32-pin 400-mil 32pin IDT71V124 576-bit PDF

    TIP 3771

    Abstract: 3771 E1 3771 8 pin ic
    Contextual Info: LOW PO W ER 3V C M O S S R A M 1 M EG 64Kx 16-BIT ADVANCE INFORMATION IDT71L016 In te g ra te d D e v iz e T e c h n o lo g y , l i e . FEATURES: • 64K x 16 Organization • Wide Operating Voltage Range: 2.7V to 3.6V • Commercial (0° to 70°C) and Industrial (-40° to 85°C)


    OCR Scan
    16-BIT) IDT71L016 100ns 10jxA 44-pin 46-BALL IDT71L016 576-bit TIP 3771 3771 E1 3771 8 pin ic PDF