PCB layout guidelines for NXP MCUs in BGA packages
Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,
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an10778lpc175xlpc176xlpc177x+14lpc178xlpc181xlpc182xlpc183xlpc185xlpc431xpcb layout guidelines for nxp mcus in bga packageslbga256lpc2468 reflow solder profileland pattern for tsop 2 54 pinnxp lpclfbga256lpc433xtsop 54 land pattern
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LPC2468 reflow solder profile
Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,
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an10778lpc2220lpc2292lpc2364+15lpc2368lpc2458lpc2468lpc2470lpc2478lpc2880lpc2468 reflow solder profile0.65mm pitch bga1mm pitch bgamo-275tfbga208lfbga32lpc2468 pcbsot1018-1nxp cross
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