JEDEC 600MIL DIP Search Results

DIP42-P-600-2

Contextual Info: 42P4Z Plastic 42pin 600mil DIP JEDEC Code – Lead Material Alloy 42 22 1 21 E 42 e1 c EIAJ Package Code DIP42-P-600-2.54 Weight g 6.06 D L A1 A A2 Symbol SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5 0.51

32P4

Abstract: JEDEC 600Mil dip
Contextual Info: 32P4 Plastic 32pin 600mil DIP JEDEC Code – Lead Material Alloy 42 17 1 16 E 32 e1 c EIAJ Package Code DIP32-P-600-2.54 Weight g 4.08 D L A1 A A2 Symbol SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.1 0.51

24pin

Abstract: 24P4
Contextual Info: 24P4 Plastic 24pin 600mil DIP Lead Material Alloy 42/Cu Alloy 24 13 1 12 c Weight g 3.3 JEDEC Code – Symbol A1 L A A2 D SEATING PLANE e b1 e1 E EIAJ Package Code DIP24-P-600-2.54 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5

30P4

Abstract: DIP30-P-600-2
Contextual Info: 30P4 Plastic 30pin 600mil DIP EIAJ Package Code DIP30-P-600-2.54 Weight g 4.1 Lead Material Cu Alloy 16 1 15 E 30 e1 c JEDEC Code – Symbol A A2 D L A1 SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5

28P4

Abstract: JEDEC 600Mil dip "lead material" DIP
Contextual Info: SEATING PLANE EIAJ Package Code DIP28-P-600-2.54 e b1 D b 14 1 Lead Material Alloy 42 15 Weight g 3.8 28 JEDEC Code – A L 28P4 A2 A1 A A1 A2 b b1 c D E e e1 L Symbol Plastic 28pin 600mil DIP c Dimension in Millimeters Min Nom Max – – 5.5 0.51 – –

JEDEC 600Mil dip

Abstract: DIP40 package
Contextual Info: 40P4 Plastic 40pin 600mil DIP JEDEC Code – Weight g 5.4 Lead Material Alloy 42 21 1 20 E 40 e1 c EIAJ Package Code DIP40-P-600-2.54 Symbol L A1 A A2 D SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5 0.51 –

JEDEC 600Mil dip

Abstract: "lead material" DIP 32P4
Contextual Info: EIAJ Package Code DIP32-P-600-2.54 32P4 e b 16 1 D 17 Lead Material Alloy 42 32 JEDEC Code – Weight g 4.08 SEATING PLANE b1 A L E A2 A1 A A1 A2 b b1 c D E e e1 L Symbol Plastic 32pin 600mil DIP c Mar.’98 Dimension in Millimeters Min Nom Max – – 5.1

28P4

Contextual Info: 28P4 Plastic 28pin 600mil DIP Lead Material Alloy 42 28 15 1 14 c Weight g 3.8 e1 JEDEC Code – E EIAJ Package Code DIP28-P-600-2.54 D A A2 Symbol L A1 SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5 0.51 –

SSOP42-P-450-0

Contextual Info: APPENDIX 3.6 Package outline 3.6 Package outline MMP 42P4B EIAJ Package Code SDIP42-P-600-1.78 Plastic 42pin 600mil SDIP Weight g 4.1 Lead Material Alloy 42/Cu Alloy 22 1 21 E 42 e1 c JEDEC Code – Symbol L A1 A A2 D e b1 b2 b SEATING PLANE A A1 A2 b b1

Contextual Info: 52S1B-B Metal seal 52pin 600mil DIP EIAJ Package Code WDIP52-C-600-1.78 Weight g JEDEC Code – 1 26 e1 27 E 52 c D L A1 A A2 Symbol z e b b1 SEATING PLANE A A1 A2 b b1 c D E e e1 L Z Dimension in Millimeters Min Nom Max – – 5.4 – – 1.0 3.9 – –

42-PIN

Contextual Info: 42S1B-A Metal seal 42pin 600mil DIP EIAJ Package Code WDIP42-C-600-1.78 JEDEC Code – Weight g 1 21 e1 22 E 42 c D A1 L A A2 Symbol Z e b b1 SEATING PLANE A A1 A2 b b1 c D E e e1 L Z Dimension in Millimeters Min Nom Max – – 5.0 – – 1.0 3.44 – –

gy-27

Abstract: CY27C010-45PC CY27C010-150ZC CY27C010-120PC
Contextual Info: fax id: 3022 CY27C010 pyp: v « *1 X X - 128K x 8 CMOS EPROM available in windowed packages 32-pin hermetic DIP and LCC which allow the device to be erased with UV light for 100% reprogrammability. Features • Very Fast Read Access Time: (45 - 200 ns) • 5V ± 10% Power Supply

CY27C256A-45WMB

Abstract: w16 06 CY27C256A-45JC CY27C256A-45PC CY27C256A-45QMB CY27C256A-45WC CY27C256A-45ZC CY27C256A-55JC CY27C256A-70WC CY27C256A-90JC
Contextual Info: fax id: 3026 CY27C256A 1-Megabit 32K x 8 CMOS EPROM Features • • • • • • windowed packages (28-pin hermetic DIP and 32-pin LCC) which allow the device to be erased with UV light for 100% reprogrammability. Very fast read access time: (45−200 ns)

CY27C256A-45JC

Abstract: CY27C256A-45PC CY27C256A-45QMB CY27C256A-45WC CY27C256A-45WMB CY27C256A-45ZC CY27C256A-55JC
Contextual Info: fax id: 3026 1CY 27C2 56 A CY27C256A 32K x 8 CMOS EPROM Features • • • • • • windowed packages 28-pin hermetic DIP and 32-pin LCC which allow the device to be erased with UV light for 100% reprogrammability. Very fast read access time: (45−200 ns)

LC 7258

Contextual Info: fax id: 3026 CY27C256A 32Kx8 CMOS EPROM Featu res windowed packages 28-pin hermetic DIP and 32-pin LCC which allow the device to be erased with UV light for 100% reprogrammability. • Very fa s t read a cce ss tim e : (45-200 ns) • 5 V ± 1 0 % p o w e r s u p p ly

FJ032-P-R450

Contextual Info: CMOS 1M 128K x 8 M ask-Program m able ROM FEATURES PIN CONNECTIONS • 131,072 words x 8 bit organization 32-PIN DIP 32-PIN SOP • Access time: 150 ns (MAX.) TOP VIEW N 32 I ] Vcc f ' • Power consumption: Operating: 192.5 mW (MAX.) Standby: 550 \x\N (MAX.)

Contextual Info: LH53259 C M O S 256K 3 2 K x 8 M ROM FEATURES PIN CONNECTIONS • 32,768 words x 8 bit organization 28-PIN DIP 28-PIN SOP • Access time: 150 ns (MAX.) TOP VIEW . • Low-power consumption: Operating: 137.5 mW (MAX.) Standby: 550 p.W (MAX.) NCd 1• 28 □ VCC

TSOP028-P-0813

Abstract: LH53259 LH53259D
Contextual Info: LH53259 CMOS 256K 32K x 8 Mask-Programmable ROM FEATURES • 32,768 words × 8 bit organization • Access time: 150 ns (MAX.) • Low-power consumption: Operating: 137.5 mW (MAX.) Standby: 550 µW (MAX.) PIN CONNECTIONS TOP VIEW 28-PIN DIP 28-PIN SOP NC

32DIP

Abstract: 32-PIN LH530800A a7529 lh5308
Contextual Info: LH530800A CMOS 1M 128K x 8 Mask-Programmable ROM FEATURES • 131,072 words × 8 bit organization • Access time: 150 ns (MAX.) PIN CONNECTIONS 32-PIN DIP 32-PIN SOP TOP VIEW • Power consumption: Operating: 192.5 mW (MAX.) Standby: 550 µW (MAX.) NC

sharp mask rom

Contextual Info: LH530800A FEATURES CMOS 1M 128K x 8 MROM PIN CONNECTIONS • 131,072 words x 8 bit organization • Access time: 150 ns (MAX.) 32-PIN DIP 32-PIN SOP TOP VIEW NCZ 1• s 32 □ Vcc A i aC 2 31 □ NC / • Power consumption: Operating: 192.5 mW (MAX.) Standby: 550 [iW (MAX.)

A14C

Abstract: LH53259 sharp mask rom
Contextual Info: LH53259 CMOS 256K 32K x 8 M ask-Program m able ROM FEATURES PIN CONNECTIONS • 32,768 words x 8 bit organization • Access time: 150 ns (MAX.) 28-PIN DIP 28-PIN SOP TOP VIEW • Low-power consumption: Operating: 137.5 mW (MAX.) Standby: 550 n-W (MAX.)

LH530800A

Abstract: 32DIP 32-PIN LH53
Contextual Info: LH530800A FEATURES • 131,072 words x 8 bit organization • Access time: 150 ns MAX. CMOS 1M (128K × 8) MROM PIN CONNECTIONS 32-PIN DIP 32-PIN SOP TOP VIEW • Power consumption: Operating: 192.5 mW (MAX.) Standby: 550 µW (MAX.) NC 1 32 Vcc A16 2 31

LH53259

Abstract: LH53259D TSOP028-P-0813
Contextual Info: LH53259 FEATURES • 32,768 words x 8 bit organization • Access time: 150 ns MAX. • Low-power consumption: Operating: 137.5 mW (MAX.) Standby: 550 µW (MAX.) CMOS 256K (32K × 8) MROM PIN CONNECTIONS TOP VIEW 28-PIN DIP 28-PIN SOP NC 1 28 VCC A12 2

sharp mask rom

Contextual Info: CM O S 1 M 1 2 8 K x 8 M R O M FEATURES PIN CONNECTIONS • 131,072 words x 8 bit organization • Access time: 150 ns (MAX.) 32-PIN DIP 32-PIN SOP TOP VIEW • Power consumption: Operating: 192.5 mW (MAX.) Standby: 550 (iW (MAX.) NCC 1• \ 32 A-^IZ A15Z