450MIL Search Results

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M02 EIAJ code : ∗SOP032-P-0450-1 32-pin plastic SOP Lead pitch 50mil Nominal dimensions 450mil Standard Conforms with EIAJ:TYPE IV Lead shape Gullwing Sealing method Plastic mold FPT-32P-M02 32-pin plastic SOP

LY621024

Abstract: LY621024SL LY621024LL 128K X 8 BIT LOW POWER CMOS SRAM
Contextual Info:  LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.6 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Rev. 1.6 Description Initial Issue Revised sym. b of 32 pin 450mil SOP package outline dimension in page 8 Added SL C-grade Spec.

LY621024PL-70LL

Abstract: LY621024PL
Contextual Info:  LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.8 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Rev. 1.6 Rev. 1.7 Rev. 1.8 Description Issue Date Initial Issue Jul.25.2004 Revised sym. b of 32 pin 450mil SOP package outline dimension Jan.17.2007

SSOP42-P-450-0

Contextual Info: APPENDIX 3.9 Package outline 3.9 Package outline 42P2R-A Plastic 42pin 450mil SSOP EIAJ Package Code SSOP42-P-450-0.80 Weight g 0.63 JEDEC Code – Lead Material Alloy 42/Cu Alloy e b2 22 Caution ! E HE e1 I2 42 F Symbol TBD 21 1 A D Recommended Mount Pad

Contextual Info: A S p AUSTIN SEMICONDUCTOR, INC. ^ m e g H s DRAM PRELIMINARY 1 D R A M M E G x 1 6 D R A M 3.3V, EDO PAGE MODE, OPTIONAL EXTENDED REFRESH AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • M IL-STD 883 44/50-Pin SOJ/LCC/Gull Wing 450mil • SM D Planned

Contextual Info: LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.3 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Description Issue Date Initial Issue Jul.25.2004 Revised sym. b of 32 pin 450mil SOP package outline dimension Jan.17.2007 in page 8 Added SL C-grade Spec.

SOP28 package

Abstract: SOP28
Contextual Info: SANYO Semiconductor Small Outline Package 28Pin Plastic SOP28 450mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

H 9311

Abstract: SSOP42-P-450-0
Contextual Info: Recommended 42P2R-A EIAJ Package Code SSOP42-P-450-0.80 JEDEC Code – Plastic 42pin 450mil SSOP Weight g 0.63 e b2 22 E Recommended Mount Pad F Symbol 1 21 A D G A2 e y A1 b L L1 HE e1 I2 42 Lead Material Alloy 42/Cu Alloy A A1 A2 b c D E e HE L L1 z Z1

SOP28D

Abstract: 450mil
Contextual Info: SANYO Semiconductor Small Outline Package 28Pin Plastic SOP28D 450mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

SOP36

Abstract: SOP36-P-450-1 18AF
Contextual Info: 36P2W-A EIAJ Package Code SOP36-P-450-1.27 Plastic 36pin 450mil SOP Weight g 0.76 JEDEC Code – Lead Material Alloy 42 b2 I2 e Recommended Mount Pad E Symbol 1 18 A F D A2 e b A1 L1 y L HE e1 19 36 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters

Contextual Info: MX23L8000 8M -BIT M ASK ROM 8 BIT OUTPUT FEATURES ORDER INFORMATION • Bit organization - 1 M x 8 (byte mode) • Fast access time - Random access: 150ns (max.) • Current - Operating: 20mA - Standby: 5uA • Supply voltage -2.7V~3.6V • Package - 32 pin SOP (450mil)

Contextual Info: Package Information SOP Outline Dimensions 32-pin SOP 450mil Outline Dimensions 3 2 1 7 A B 1 1 6 C C ' G H D E = F • MS-099 Symbol Dimensions in mil Min. Nom. Max. A 530 ¾ 580 B 437 ¾ 445 C 14 ¾ 20 C¢ 799 ¾ 815 D 100 ¾ 120 E ¾ 50 ¾ F 4 ¾ 14 G

sop28

Abstract: SOP28 package
Contextual Info: 28P2W-A Plastic 28pin 450mil SOP EIAJ Package Code SOP28-P-450-1.27 JEDEC Code – Weight g 0.58 Lead Material Alloy 42 e E Recommended Mount Pad Symbol 1 14 F A A2 A1 D e L L1 HE e1 I2 15 28 b2 b c y Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters

LY621024

Contextual Info: LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.2 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Description Issue Date Initial Issue Jul.25.2004 Revised sym. b of 32 pin 450mil SOP package outline dimension Jan.17.2007 in page 8 Added SL C-grade Spec.

SSOP42-P-450-0

Abstract: 42p2r-a
Contextual Info: 42P2R-A Plastic 42pin 450mil SSOP EIAJ Package Code SSOP42-P-450-0.80 JEDEC Code – Weight g 0.63 Lead Material Alloy 42/Cu Alloy e 22 E F Recommended Mount Pad Symbol 1 21 A D y b A1 L e A2 L1 HE e1 I2 42 b2 c Detail F A A1 A2 b c D E e HE L L1 y b2 e1

SSOP36

Abstract: SSOP36-P-450-0 36p2r-a 36P2R
Contextual Info: 36P2R-A Plastic 36pin 450mil SSOP EIAJ Package Code SSOP36-P-450-0.80 JEDEC Code – Weight g 0.53 Lead Material Alloy 42 e 19 E F Recommended Mount Pad Symbol 1 18 A A2 D y b L e A1 L1 HE e1 I2 36 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters

SSOP44

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 44Pin Plastic SSOP44 450mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: MX23L8000 8M -BIT M ASK ROM 8 BIT OUTPUT FEATURES ORDER INFORMATION • Bit organization - 1 M x 8 (byte mode) • Fast access time - Random access: 150ns (max.) • Current - Operating: 20mA - Standby: 5uA • Supply voltage -2.7V~3.6V • Package - 32 pin SOP (450mil)

SOP24

Abstract: 24P2W
Contextual Info: 24P2W-D Plastic 24pin 450mil SOP EIAJ Package Code SOP24-P-450-1.27 Weight g 0.5 JEDEC Code – Lead Material Cu Alloy 13 E Recommended Mount Pad Symbol 1 12 F A A2 A1 D L L1 HE e1 24 b2 I2 e e b y c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters

SSOP40-P-450-0

Abstract: SSOP40 DSA00373 40P2R-A 40p2r
Contextual Info: 40P2R-A Plastic 40pin 450mil SSOP EIAJ Package Code SSOP40-P-450-0.80 JEDEC Code – Weight g 0.62 Lead Material Alloy 42 e 21 E F Recommended Mount Pad Symbol 1 20 A A2 D y b L e A1 L1 HE e1 I2 40 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters

SOP32

Abstract: 32P2W-A 32P2W
Contextual Info: 32P2W-A Plastic 32pin 450mil SOP EIAJ Package Code SOP32-P-450-1.27 Weight g 0.67 JEDEC Code – Lead Material Alloy 42 e1 17 E Recommended Mount Pad Symbol 1 16 A F D A2 b L e A1 L1 HE 32 b2 I2 e y c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters

Contextual Info: 6.8 UNIT : mm 14.9 MP450-01A, LB-024 Iength : 515±2.0 thickness : 0.7 +0.3 −0.2 tolerance : ±0.4 material : plastic with antistatic finish Applied Package 28-pin QFJ (PLCC) ( 450mil) Quantity (pcs) MAX. 40

28P2W-C

Abstract: sop28 SOP28 package
Contextual Info: 28P2W-C Plastic 28pin 450mil SOP EIAJ Package Code SOP28-P-450-1.27 JEDEC Code – Weight g 0.58 Lead Material Alloy 42 e 15 E Recommended Mount Pad 1 14 Symbol F A A1 A2 D b e L L1 HE e1 I2 28 b2 y c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters

24P2W-A

Abstract: SOP24 24P2W
Contextual Info: 24P2W-A Plastic 24pin 450mil SOP EIAJ Package Code SOP24-P-450-1.27 JEDEC Code – Weight g 0.5 Lead Material Alloy 42 b2 I2 e Recommended Mount Pad E Symbol 1 12 F A A2 A1 D L L1 HE e1 13 24 e b y c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters