IC37NR Search Results

IC51-128

Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

HT 1200-4

Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional

HT 1200-4

Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

1403G4

Abstract: g4 pc 50 u IC37 IC37N IC37N 2204 1404 yamaichi 1403G 4206-G
Contextual Info: IC37 Series Dual Inline Package DIP Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: 1,000M Ω min. at 500V DC 700V AC for 1 minute

IC37N 2204

Abstract: IC37NRB-2806-g4 IC37N IC37NRB-1403-G4 IC37NRB-1404-G4 IC37NRB-1603-G4 IC37NRB-1803-G4 IC37NRB-2003-G4 IC37NRB-2004-G4 IC37NRB-2203-G4
Contextual Info: IC37 Series Dual Inline Package DIP Part Number (Details) Specifications Insulation Resistance: 1,000M Ω min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 20m Ω max. at 10mA /20mV max. Current Rating: 1A max. Operating Temperature Range: –40°C to +170°C (PPS)

Contextual Info: 1C 37NRB SERIES DlP 2.54mm pitch •O u tlin e Dimensions FEATURES • Dual wipe contact ensures high reliability. • Low cost due to selective gold plating. • Applicable for both 1C and side braze packages. Ideal for automated burn-in. IC SOCKETS •

IC51-2084-1052-36

Abstract: FPQ 208 0.5 10 18AB IC51-0484-806-7 IC107-3204-G IC162 FPQ-240-0 FPQ-64 IC235-0442 IC37NRB-1403-G4
Contextual Info: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 8 章 参考資料 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 8 章部分とな ります。

PT740 AB

Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

socket Yamaichi ic51 qfp

Abstract: DP-24N IC-86 Kogyo welcon DIP SOCKET AUGAT DIP SOCKETS IC386 Enplas fpq FP-54 IC51-1004-395
Contextual Info: Sockets for Evaluating Surface and Through-Hole Mount Packages 1. SOCKET LIST Table 1 lists the sockets available on the market for evaluating the characteristics o f surface and through-hole package devices. For details, please inquire directly to the socket manufacturer.

IC354

Abstract: IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4
Contextual Info: 8. 参考資料 8. 参考資料 8-1. 測定用ソケット 8-1-1. 測定用ソケットメーカー - 2 8-1-2. 測定用ソケット一覧表 - 3 8-2. パッケージ関連標準規格 - 8

ic 4006

Abstract: Yamaichi HITACHI, FP-64 IC37NR-2806-G4
Contextual Info: SOCKETS FOR EVALUATING SURFACE AND THROUGH-HOLE MOUNT PACKAGES 1. SOCKET LIST T able 1 lists th e .sockets av a ila b le o n th e m a rk e t to r e v a lu a tin g th e c h a ra c te ristic s o f s u rfa c e a n d th ro u g h -h o le p a c k ag e d e v ic e s . F o r d e ta ils ,

PT740 AB

Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
Contextual Info: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

IC Package Names and Code Designations

Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Contextual Info: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages

SMD IC 2025 bl

Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
Contextual Info: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機

Yamaichi ic354

Abstract: IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 8. RELATED INFORMATION This document is Chapter 8 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 8. RELATED INFORMATION 8. RELATED INFORMATION

PT740 AB

Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher