IC37 Search Results

IC373

Contextual Info: IC373 Series Clamshell CSP (Fan-out Terminals, 0.50mm Pitch) Part Number (Details) Specifications 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 100m Ω max. at 10mA/20mV (initial)

1403G4

Abstract: g4 pc 50 u IC37 IC37N IC37N 2204 1404 yamaichi 1403G 4206-G
Contextual Info: IC37 Series Dual Inline Package DIP Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: 1,000M Ω min. at 500V DC 700V AC for 1 minute

IC37N 2204

Abstract: IC37NRB-2806-g4 IC37N IC37NRB-1403-G4 IC37NRB-1404-G4 IC37NRB-1603-G4 IC37NRB-1803-G4 IC37NRB-2003-G4 IC37NRB-2004-G4 IC37NRB-2203-G4
Contextual Info: IC37 Series Dual Inline Package DIP Part Number (Details) Specifications Insulation Resistance: 1,000M Ω min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 20m Ω max. at 10mA /20mV max. Current Rating: 1A max. Operating Temperature Range: –40°C to +170°C (PPS)

SBL30L30CT

Abstract: 35v smps
Contextual Info: E L E C T R O N I C The improved Low VF Schottkys Monday, 6 August 2007 Sirectifier Global Corp. SGC recently announced that the improved low Forward Voltage Drop (VF) Schottkys of 30V, 45 and 60V families. The improved alloy barrier Schottkys obtained the lowest VF characteristic to reduce the conduction loss of the SMPS application.

SOT-227 Package

Abstract: Barksdale newark Sirectifier ITO-220
Contextual Info: E L E C T R O N I C Our Package January 2007 /Rev. 2 SOD-523 SOT-23 SOT-323 SOT-363 SOT-563 SOT-23-6 SMA SMB SMC DO-41 DO-201AD TO-126 TO-92 D-PAK D2-PAK TO-220 ITO-220 Fig. 9 Fig. 10 Fig. 12 Fig. 17 Fig. 14 Fig. 15 TO-247/ TO-3P Fig. 16 SOT-227 Sirectifier Global Corp., Delaware, U.S.A.

digital voltmeter

Abstract: digital display voltmeter
Contextual Info: D.V.M.S S IN G L E C H IP 372 D IG IT D.V.M. I.C. ZN450E/ZN450CJ The ZN450 is a complete digital voltmeter fabricated on a monolithic chip and requires only ten external, passive com ponents for operation. A novel charge-balancing conversion technique ensures good

Contextual Info: R32C/156 Group Datasheet Datasheet R32C/156 Group RENESAS MCU 1. REJ03B0233-0110 Rev.1.10 Nov 09, 2010 Overview 1.1 Features The M16C Family offers a robust platform of 32-/16-bit CISC microcomputers MCUs featuring high ROM code efficiency, extensive EMI/EMS noise immunity, ultra-low power consumption, high-speed processing

15Z1

Abstract: motor jun tuo 2T825 LM 3177 switching reg stepping motor EM 58b d70433gd d70433 uPD70433 PD70433 TFK 601
Contextual Info: DATA SHEET N E MOS INTEGRATED CIRCUIT C ¿ ¿ P D 7 4 3 3 V55PI 16-BIT MICROPROCESSOR DESCRIPTION The ¿iPD70433 V55P0 is a m icroprocessor in which a 16-bit CPU, RAM, serial interface, parallel interface, A/D converter, tim ers; DMA controller, interrupt controller, etc., are integrated

Contextual Info: R32C/157 Group Datasheet Datasheet R32C/157 Group RENESAS MCU 1. REJ03B0234-0110 Rev.1.10 Nov 09, 2010 Overview 1.1 Features The M16C Family offers a robust platform of 32-/16-bit CISC microcomputers MCUs featuring high ROM code efficiency, extensive EMI/EMS noise immunity, ultra-low power consumption, high-speed processing

DRM005

Abstract: FLASHPROG ESSEPIE 433 mhz UHF RECEIVER, pcb layout and Schematic Di "Remote Keyless Entry" protocol MC33491 Remote Keyless Entry 16 pin single chip 24GHz UHF transistor CRC232 MC908RF2 HC08
Contextual Info: Remote Keyless Entry RKE Reference Design Using the MC68HC908RF2 Designer Reference Manual M68HC08 Microcontrollers DRM005/D 5/2002 WWW.MOTOROLA.COM/SEMICONDUCTORS Remote Keyless Entry (RKE) Reference Design Using the MC68HC908RF2 By: Andrea Martini ESSEPIE S.r.l. — Studio di progettazione

DVR RXD1

Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

Contextual Info: R32C/157 Group Datasheet R32C/157 Group RENESAS MCU 1. REJ03B0234-0102 Rev.1.02 Nov 30, 2009 Overview 1.1 Features The M16C Family offers a robust platform of 32-/16-bit CISC microcomputers MCUs featuring high ROM code efficiency, extensive EMI/EMS noise immunity, ultra-low power consumption, high-speed processing

Contextual Info: R32C/151 Group Datasheet R32C/151 Group RENESAS MCU 1. REJ03B0230-0102 Rev.1.02 Nov 30, 2009 Overview 1.1 Features The M16C Family offers a robust platform of 32-/16-bit CISC microcomputers MCUs featuring high ROM code efficiency, extensive EMI/EMS noise immunity, ultra-low power consumption, high-speed processing

Contextual Info: User's Manual 32 R32C/153 Group User’s Manual: Hardware R32C/153 Group User’s Manual: Hardware RENESAS MCU M16C Family / R32C/100 Series All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by

ISO11898-1

Abstract: PLQP0144KA-A
Contextual Info: R32C/151 Group Datasheet Datasheet R32C/151 Group RENESAS MCU 1. REJ03B0230-0110 Rev.1.10 Sep 06, 2010 Overview 1.1 Features The M16C Family offers a robust platform of 32-/16-bit CISC microcomputers MCUs featuring high ROM code efficiency, extensive EMI/EMS noise immunity, ultra-low power consumption, high-speed processing

ISO11898-1

Abstract: PLQP0144KA-A ic27d rts44
Contextual Info: R32C/157 Group Datasheet Datasheet R32C/157 Group RENESAS MCU 1. REJ03B0234-0110 Rev.1.10 Nov 09, 2010 Overview 1.1 Features The M16C Family offers a robust platform of 32-/16-bit CISC microcomputers MCUs featuring high ROM code efficiency, extensive EMI/EMS noise immunity, ultra-low power consumption, high-speed processing

resistor mr6

Abstract: SD78K0 IE-78000-R NEC MR31 resistor MR25 resistor mr4 EV-9200GF-100 PD780208 ISS123 auto-10
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

74S1057

Abstract: 74S1055 ACT374 IE-78000-R bnc to probe clips pal22v10 EV-9200GC-80 MR15 PD178004 auto-10
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

IR P103s

Abstract: 4005A
Contextual Info: User's Manual 32 R32C/153 Group User's Manual: Hardware R32C/153 Group User’s Manual: Hardware RENESAS MCU M16C Family / R32C/100 Series All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by Renesas Electronics

R5F64524KFD

Abstract: R5F64524
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

IC51-128

Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

toshiba satellite a10 motherboard

Abstract: free circuit diagram of motherboard toshiba satellite Toshiba b9 grease 64Gb Nand flash toshiba toshiba 64gb nand flash toshiba sa 1941 IL43 TX4939 mips risc architecture gerry kane toshiba S253
Contextual Info: 64-Bit TX System RISC TX49 Family TX4939 Rev. 3.3 Semiconductor Company The information contained herein is subject to change without notice. 021023_D TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and

Contextual Info: 1C 37F SERIES I . •O u tlin e D im ensions FEATURES • Dual w ipe contact ensures high reliability. • Low cost due to selective gold plating. • G rooves on end lead insert m olding prevent bending during 1C insertion and removal. SPECIFICATIONS PERFORMANCE