IC235 Search Results

IC 4407

Abstract: IC235 TSOP 54 socket IC235-0442-207 4407 pin details 4407 TSOP 50 socket IC235-0542-218-2 IC235-0242-202 IC235-0082-236
Contextual Info: IC235 Series Open Top Thin and Small Outline Package (TSOP -Type II / SOP) Part Number (Details) Specifications 1,000M Ω min. at 500V DC 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. –40°C to +150°C 10,000 insertions min. 30g min. per pin at minimum

Contextual Info: TSOP Type II, Open Top IC235 Series Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 Minute 30m½ max. at 10mA/20mV (Initial) -40ûC ~ +150ûC Socket Series No. of Leads No. of Sides with Contacts Inline Memory Modules Insulation Resistance: Withstanding Voltage:

Contextual Info: TSOP Open Top, Type-II IC235 Series FEATURES • Open top low actuaction force socket. CHARACTERISTICS 1.OOOMO minimum 700 VAC RMS for one minute C o n ta ct R esista n ce 30mi2 maximum at 10mA O p er a tin g T em p era tu re -40°C - +I50°C C o n ta ct F orce

Contextual Info: OPEN TOP TYPE TEST & BURN-IN 1C SOCKETS T.S.O.P. Thin Small Outline Package Type-II IC235 Series • SPECIFICATION (S) • Open top low actuation force socket ■ CHARACTERISTICS l.OOOMO minimum Insulation Resistance 700VAC RMS for one minute Withstanding Voltage

Contextual Info: TSOP Open Top, Type-II IC235 Series FEATURES • Open top low actuation force socket. CHARACTERISTICS Insulation Resistance ~~r~ 1.000MQ minimum Withstanding Voltage 700 VAC RMS for one minute Contact Resistance 30mQ maximum at 10mA Operating Temperature -40°C ~ +150°C

IC235

Abstract: TY 1016 IC235-0442-207 1176
Contextual Info: TSOPP Tyy p e II, Opp e n Too p IC235 Series Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 Minute 30m½ max. at 10mA/20mV (Initial) -40ûC ~ +150ûC Socket Series No. of Leads No. of Sides with Contacts Inline Memory Modules Insulation Resistance:

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

HA17805P

Abstract: hitachi j100 HA17812P J5001 TLG223 r346 rectifier ha17805 nihon cement sg 403 varistor transistor c373
Contextual Info: HA16141/42, HA16341/42 PFC and PWM Controller, Redundant Secondary Switching Power Supply Controller Application Note ADE-504-005 Z Rev.0 Apr. 2002 Hitachi Notice When using this document, keep the following in mind: 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,

IC51-128

Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

Contextual Info: Receptacles Design Rules Part Number Ordering Procedure Acceptable Socket 51- 1004818- * 1 * 0 Terminal Length Socket Series Code Minimum Pin Length: Maximum Pin Length: Material Socket Contact Type Insulator: Inner Contact: Insulator Plate Thickness Outer Sleeve:

Contextual Info: Design Rules Acceptable Socket pefmJnaTCinpr^ ^Minimum Pin Lengtm Maximum Pin Length: Insulator:"^ Inner Contact: 2.4mm 3.8mm If above 3.8mm, groove is required on the insulator "Polyethenmide (PEI) Beryllium Copper (BeCu) 172 heat treated Gold plating (30p") over Nickel plating (50p”)

Contextual Info: 1C 235 SERIES tsop •Applicable 1C Dimensions FEATURES • Open top type sockets for TSOP packages. • Unique, compact design ensures high-density mounting of burn-in inboards. • Unique contact design ensures outstanding contact reliability especially in monitored burn-in operations.

HT 1200-4

Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional

IC51-0162-150

Abstract: IC51-0082-763 IC51-0242-1341 IC51-0562-1514 IC53-0642-911 IC51-0202-779 IC51-0322-667 IC51-0382-2036 IC51-0482-2018 IC51-0562-2144
Contextual Info: Series Overview *SOP Small Outline Packages, Gullwing Leads SMT Devices *SOP variations e.g. TSSOP. Series IC51 (Clamshell) SOP, TSOP Type I & II 0.4 to 1.27mm Pitch Part Number (Details) Specifications Insulation Resistance: 1,000MΩ min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute

PD78310

Abstract: crystal washing machine service manual IC-2354 78310 IEU-1248 UPD78312 manual UPD78312 assembler Speed Control Of DC Motor Using Fuzzy Logic assembler 78310 pd78312
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

WA200

Abstract: WA51-0644-1586-NOSKT IC51 ic51-1764-1505 IC51-1284-1433 IC51-0484-806 IC201-0804-014 KS1518 IC51-2404-1655-3 WA51-0564-680-NOSKT
Contextual Info: WINSLOW ADAPTICs Data Sheet – Test socket Breakout adapters Winslow Adaptics IC Test socket breakout adapters convert Test sockets to a male 0.1” PGA type footprint. From the list below select the socket package you require for your device, check IC dimensions are correct and locate adapter part number.

Contextual Info: TSOP Type II, Open Top IC 235 Series Characteristics Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: 1.OOOMfiminimum at 500 VDC 700 VAC for 1 Minute 30mQ max. at 10mA/20mV (Initial) -40"C ~ +150'C Material Insulator:

IC51-2084-1052-36

Abstract: FPQ 208 0.5 10 18AB IC51-0484-806-7 IC107-3204-G IC162 FPQ-240-0 FPQ-64 IC235-0442 IC37NRB-1403-G4
Contextual Info: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 8 章 参考資料 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 8 章部分とな ります。

PT740 AB

Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

IC354

Abstract: IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4
Contextual Info: 8. 参考資料 8. 参考資料 8-1. 測定用ソケット 8-1-1. 測定用ソケットメーカー - 2 8-1-2. 測定用ソケット一覧表 - 3 8-2. パッケージ関連標準規格 - 8

PD78310

Abstract: 78322 UPD78312 manual UPD78312 assembler crystal washing machine service manual IC-2354 IEU-1248 pd78312 washing machine service manual FC80H
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD78320,78322 16/8-BIT SINGLE-CHIP MICROCONTROLLER DESCRIPTION The µPD78322 is a 16-/8-bit single-chip microcontroller that incorporates a high-performance 16-bit CPU. The µPD78322 is one of 78K/III series. A realtime pulse unit for realtime pulse control required in motor control, an A/D converter, a ROM, and a RAM have been

QFN11T048-008

Abstract: NP445-064-002 QFN11T032-003 NP445-048-001 ic191-0482-004 pin details IC51-0202-912 IC51-0282-165 WA200 IC51-0302-914 IC51-1844-1148
Contextual Info: WINSLOW ADAPTICs Data Sheet – Test socket Breakout adapters Winslow Adaptics IC Test socket breakout adapters convert Test sockets to a male 0.1” PGA type footprint. From the list below select the socket package you require for your device, check IC dimensions are correct and locate adapter part number.

PT740 AB

Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
Contextual Info: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher