I051 Search Results

Contextual Info: Bulletin I0514J rev. A 01/03 FD075H06A5. Fred Die in Wafer Form a 0.35 ± 0.01 c 14 ± 0.4 NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION (MILS): b d C A 40 (1.57) 3. DIMENSIONS AND TOLERANCES: a = 1.905 ± 0.01 (75 ± 0.4)

SC050.5. Series

Abstract: AO40 SC0501
Contextual Info: Bulletin I0510J rev. A 05/01 SC050.5. Series SCHOTTKY DIE 50 x 50 mils a 0.35 ± 0.01 c 14 ± 0.4 NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). C b d D A Ø 40 (157) 3. DIMENSIONS AND TOLERANCES: a = 1.27 + 0, - 0.01

Contextual Info: Bulletin I0511J rev. C 03/07 SC175.5. Series SCHOTTKY DIE 175 x 175 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 2. CONTROLLING DIMENSION: (MILS)

Contextual Info: Extract from the online catalog FLKMS-AMP 50/B Order No.: 2287672 Interface module Commercial data GTIN EAN 4017918056483 Note Made-to-order sales group I051 Pack 1 pcs. Customs tariff

Contextual Info: Bulletin I0519J 04/03 FD087H02A5. Fred Die in Wafer Form a 0.35 ± 0.01 14 ± 0.4 c NOTES: d b C A 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): 40 (1.57) Wafer flat alligned with side b of the die 3. DIMENSIONS AND TOLERANCES:

Contextual Info: Bulletin I0518J 04/03 FD122H02A5. Fred Die in Wafer Form a 0.35 ± 0.01 c 14 ± 0.4 NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION (MILS): d b C A 40 (1.57) 3. DIMENSIONS AND TOLERANCES: a = 3.099 + 0, - 0.01 (122 + 0, - 0.4)

Contextual Info: Bulletin I0515J rev. A 01/03 FD120L03A5. Fred Die in Wafer Form a 0.35 ± 0.01 c 14 ± 0.4 NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION (MILS): b d C A 40 (1.57) 3. DIMENSIONS AND TOLERANCES: a = 3.048 ± 0.01 (120 ± 0.4)

SC175

Abstract: SC-175
Contextual Info: Bulletin I0511J rev. B 10/03 SC175.5. Series SCHOTTKY DIE 175 x 175 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 2. CONTROLLING DIMENSION: (MILS)

sc175h045

Abstract: IR 444 H
Contextual Info: Bulletin I0511J rev. C 03/07 SC175.5. Series SCHOTTKY DIE 175 x 175 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 c (14 ± 0.4) C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 2. CONTROLLING DIMENSION: (MILS)

SC175

Abstract: sc175h045 SC175H150
Contextual Info: Bulletin I0511J rev. C 03/07 SC175.5. Series SCHOTTKY DIE 175 x 175 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 c (14 ± 0.4) C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 2. CONTROLLING DIMENSION: (MILS)

IRF 830 equivalent

Abstract: S1025 SC050.5. Series SC050*r
Contextual Info: Bulletin I0510J 05/00 SC050.5. Series SCHOTTKY DIE 50 x 50 mils a 0.35 ± 0.01 b 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS INCHES . 2. CONTROLLING DIMENSION: (INCH). C d D NOTES: (0.014 ± 0.0004) c A Ø 40 (1.57) Wafer flat alligned with side b of the die

S1025

Abstract: D0307
Contextual Info: Bulletin I0510J rev. D 03/07 SC050.5. Series SCHOTTKY DIE 50 x 50 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c C d b D A NOTES: Ø 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS)

Contextual Info: Bulletin I0513J 02/03 FD059U06A5. Fred Die in Wafer Form a 0.35 ± 0.01 14 ± 0.4 c NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION (MILS): b d C A 40 (1.57) 3. DIMENSIONS AND TOLERANCES: a = 1.499 ± 0.01 (59.01 ± 0.4)

Contextual Info: Bulletin I0516J 04/03 FD160H02A5. Fred Die in Wafer Form a 0.35 ± 0.01 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS INCHES . 2. CONTROLLING DIMENSION (INCH): d C b NOTES: (14 ± 0.4) c A 40 (1.57) Wafer flat alligned with side b of the die 3. DIMENSIONS AND TOLERANCES:

Contextual Info: Bulletin I0510J rev. D 03/07 SC050.5. Series SCHOTTKY DIE 50 x 50 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 c (14 ± 0.4) C d b D A NOTES: Ø 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS)

IO100

Abstract: MSM6648
Contextual Info: O K I Semiconductor MSM6648 1QO-DOT CO M M O N DRIVER GENERAL DESCRIPTION T he MSM6648 is an LCD d o t m atrix com m on d riv er of a CM OS IC w hich consists o f tw o 50-bit bi-directional shift registers, each b it level shifter, a n d a 4-level driv er.

j20 Schematic

Abstract: PL20 UCJ20 Trompeter pl75
Contextual Info: DASH NG IM MDDEL # ENG 1 CONN END 2 CDNN "L" DIM +/-.030 -1 IM20F75AC70M UCJ20 PL75 2 .356 -2 IM20M75AC70F UPL.20 CJ70 2 .479 -3 IM20F75AA70M UCJ20 PL75 2 .366 -4 IM20M75AA70F UPL20 rU-U\nn /LJ 2,479 -5 IM20F50AA20M CJ20 UPL20 2, 162 -5 IM20M50AA20F PL20

BJ225

Abstract: 14058 pic tnc
Contextual Info: TABLE IMPD MATERIAL /3\ SH CDNN TYPE OHMS 1 PL220 1-0442-005 2 CJ220 1-0443-005 PL240 3 1-0446-005 4 CJ240 1-0445-005 50 5 BJ225 1-0472-005 6 BJ229 1-0473-005 BJ246 7 1-0046-005 8 BJ249 1-0047-005 g UPL220 1-0468-005 75 10 UPL240 1-0041-005 50 il PL223

A1587

Abstract: 2SA1587 MARKING J1A 2SC4117
Contextual Info: TO SH IBA 2SA1587 TOSHIBA TRANSISTOR SILICON PNP EPITAXIAL TYPE PCT PROCESS 2 S A 1 587 AUDIO FREQUENCY GENERAL PURPOSE AMPLIFIER APPLICATIONS. • • Unit in mm 2.1 ± 0.1 High Voltage : V^ e q = —120V ±0.1 “•1.25 -H Excellent hjpg Linearity

E1101

Abstract: W1000 IE-703002-MC V853 E0808
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

Contextual Info: 1 • Encapsulated dry reed relays. • Total environmental protection. • A wide range of contact forms, coil resistances, coil voltages OUTLINE DIMENSIONS 1 .1 2 5 2 8 .6 W (T A B L E 1 ) .0 2 0 M IN (0 .5 1 ) .3 7 5 (9 .5 3 ) .2 0 0 (5 .0 8 ) 1 .0 0 0

Contextual Info: 1 • • • • Miniature reed relays with mercury wetted contacts. No contact bounce. 50 Watts contact rating. Open frame, encapsulated and axial lead packages are availble. OUTLINE DIMENSIONS OPEN FRAME ENCAPSULATED 1.125 28.6 .020 MIN (0.51) 1.125 (28.6)

bf 333 transistor

Abstract: L906 L883 I029 0701S
Contextual Info: www.aifotec.com 2.5 Gb/s DFB Laser for DWDM: 2-10 mW ITU C-band and L-band Application > High Speed 2.5 Gb/s, long haul optical DWDM networks > SONET/SDH OC-48/STM16 links, Metro-WDM-Networks Features > Industry standard 14 pin butterfly package > InGaAsP/InP DFB Laser Diode

V850E/IA1

Abstract: SVC 561 14 MCR33 E1101 e1414 W1000 IE-703002-MC V853 5101 RAM
Contextual Info: お客様各位 カタログ等資料中の旧社名の扱いについて 2010 年 4 月 1 日を以って NEC エレクトロニクス株式会社及び株式会社ルネサステクノロジ が合併し両社の全ての事業が当社に承継されております。従いまして、本資料中には旧社