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FD087H02A5 Datasheets Context Search
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FD087H02A5B
Abstract: MIL-HDBK-263 MUR820 S1025 0519J
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0519jfd087h02a5b12-mar-07mil-hdbk-263+2 | |
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Contextual Info: Bulletin I0519J 04/03 FD087H02A5. Fred Die in Wafer Form a 0.35 ± 0.01 14 ± 0.4 c NOTES: d b C A 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): 40 (1.57) Wafer flat alligned with side b of the die 3. DIMENSIONS AND TOLERANCES: |
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i0519jfd087h02a5s1025mur820+2 | |
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Contextual Info: I - 0519J revB FD087H02A5B FRED Die in Wafer Form z z 200V VF = 0.975V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics Parameter VFM VRRM IRM trr Description Maximum Forward Voltage |
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0519jfd087h02a5b |