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Contextual Info: Bulletin I0511J rev. C 03/07 SC175.5. Series SCHOTTKY DIE 175 x 175 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 2. CONTROLLING DIMENSION: (MILS)
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SC090
Abstract: SC090H045A 61-cmq 121cnq SC125H045A SC125H100 sc125h100a sc175h045 SC125 SC090H045
Contextual Info: International IO R \ Rectifier Schottky Rectifiers Schottky Die Pari Number Die A mm in. Size B mm (in.) Anode Metal Tj Max °C Vr (V) Equivalent Device/Series SC090H035A SC090H045A 2.29 (0.090) 2.29 (0.090) 2.03 (0.080) 2.03 (0.080) Aluminum Aluminum 175
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Contextual Info: INTERNATIONAL RECTIFIER 2bE D • 4fi554S2 O O I Q I C H 2 ■ Schottky Rectifiers International Schottky Die @¡*1Rectifier Part Number Die A mm in. Size B mm (In.) Anode Metal Tj Max °C SC090H035A SC090H045A 2.29 (0.090) 2.29 (0.090) 2.03 (0.080) 2.03 (0.080)
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SC043H100
Abstract: SC090H150 SC043H100S SC175h045s SC175S060A SC125H100A SC090H150A SC175H045 SC200H100S SC066S060
Contextual Info: AN-987 Utilizing SCHOTTKY Rectifier Die In Assembly by Bret Daniels Introduction Probing This application note describes the Schott ky rectifiers available from International Rectifier in die and wafer form. These epitaxial diode die feature a proprietary, high
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sc090h150a
Abstract: sc066s060a SC066S060 SC175H045SWB SC125H100 6cw 81 sc043s040 6CW 11 sc125h100a sc175h045
Contextual Info: •r .': ï N î • International Iö R Rectifier Wafer Part Number Die Part Number 5 Schotfky Diodes Die A1 Length/Side in. mm r -t Bond Pad '6' Anode Length/Side Metaliiation Tray (in.) mm (top side) Process Ouontììy Equivalent Finished Products SC043S040SWB
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15ct010ctq32ctqsc043s040swb+16sc043s060swbi00swsc043ri00swsc066s040awbsc066s040swbsc066s060awbsc090h150asc066s060asc066s060sc175h045swbsc125h1006cw 81sc043s0406cw 11sc125h100asc175h045
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IRF1644
Abstract: 12CTQ030-12CT0045 10JQ030-10JQ100 IRL0024 31D003-31D010 IRKT210-16 IRF1401 6cw 78 IRF140-143 IRFT003
Contextual Info: International i « r R e c tifie r PART NO./SERIES 100HF20-100HF160. 100JB05L-100JB12L. 10CTF10-10CTF40. 10CTQ140.150. 10D05-10010.
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SC175
Abstract: SC-175
Contextual Info: Bulletin I0511J rev. B 10/03 SC175.5. Series SCHOTTKY DIE 175 x 175 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 (14 ± 0.4) c C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 2. CONTROLLING DIMENSION: (MILS)
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sc175h045
Abstract: IR 444 H
Contextual Info: Bulletin I0511J rev. C 03/07 SC175.5. Series SCHOTTKY DIE 175 x 175 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 c (14 ± 0.4) C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 2. CONTROLLING DIMENSION: (MILS)
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i0511jsc175s1025sc175r015x5x+8sc175s020x5xsc175s030x5xsc175s045x5xsc175s060x5xsc175h045x5xsc175h100x5xsc175h045ir 444 h
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SC175H045S
Abstract: 61CMQ 050 83CNQ060 61-cmq 60sq060 sc125h100a 10CTQ160 SC175H045 SC090H045 SC150H045A
Contextual Info: Schottky Die INTERN/VTIONAL- R E C T IF IE R |Z O R IN TERNATI ONAL RECTIFIER a t iE D T '03-05 4055455 QD1Q277 1 • SCHOTTKY BARRIER RECTIFIER DIE INTRODUCTION packaged in plastic trays. None of the Schottky die supplied by International Rectifier is classed as a Static Sensitive
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SC175
Abstract: sc175h045 SC175H150
Contextual Info: Bulletin I0511J rev. C 03/07 SC175.5. Series SCHOTTKY DIE 175 x 175 mils 40 157 Wafer flat alligned with side b of the die a 0.35 ± 0.01 c (14 ± 0.4) C d b D A NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 2. CONTROLLING DIMENSION: (MILS)
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i0511jsc175s1025sc175r015x5x+8sc175s020x5xsc175s030x5xsc175s045x5xsc175s060x5xsc175h045x5xsc175h100x5xsc175h045sc175h150
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Contextual Info: Bulletin I0511J rev.A 05/01 SC175.5. Series SCHOTTKY DIE 175 x 175 mils a 0.35 ± 0.01 14 ± 0.4 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). C 3. DIMENSIONS AND TOLERANCES: d b NOTES: D A a = 4.445 + 0, - 0.01
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SC043H100
Abstract: SC090H150A sc090h150 SC125H100AWB sc066s060a SC090H045AWB sc043s040 SC043H100S SC066S060SW
Contextual Info: HU b ìb b i I n t e r n a t i o n a l R e c t if ie r 1 0) Wafer Part Number (3) Die Part Number («) Die'A' Length/Side (in.)mm Schottky Diodes (4) Bond Pad’8’ Length/Side (in.)mm Anode Metallization (topside) Process Tray Quantity Equivalent Finished Product
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