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    HY 2004 Search Results

    HY 2004 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CO-058RABNCX2-004
    		Amphenol Cables on Demand Amphenol CO-058RABNCX2-004 BNC Right Angle Male to BNC Right Angle Male (RG58) 50 Ohm Coaxial Cable Assembly 4ft PDF
    CO-316RASMAX2-004
    		Amphenol Cables on Demand Amphenol CO-316RASMAX2-004 RG316 High Temperature Teflon Coaxial Cable - SMA Right Angle Male to SMA Right Angle Male 4ft PDF
    BQ2004ESN
    		Texas Instruments Switch-mode NiCd/NiMH battery charger w/negative dV, peak voltage detection, dT/dt termination 16-SOIC -20 to 70 Visit Texas Instruments Buy
    TPS62004DGSR
    		Texas Instruments 1.5-V Output, 600-mA, 95% Efficient Step-Down Converter in MSOP-10 10-VSSOP -40 to 85 Visit Texas Instruments Buy
    TSC2004IYZKR
    		Texas Instruments Nano-Power Touch Screen Controller with I2C Serial Interface 24-DSBGA -40 to 85 Visit Texas Instruments Buy

    HY 2004 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    HY2004
    		ILP Electronics 120 WATT POWER AMP Original PDF 59.34KB 2

    HY 2004 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    hy 010

    Abstract: JISC7021 LA201
    Contextual Info: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LIGITEK O FFICE:7F.,NO.208,SEC.3,JHONGYANG Rd.,Tucheng City Taipei Hsien.Taiwan R.O.C TEL: 02 22677686(REP) FAX: (02)22675286, (02)22695616 LED ARRAY LA201W/HY DATA SHEET DOC. NO : QW0905-LA201W/HY REV.


    OCR Scan     		LA201W/HY QW0905-LA201 07-Jul 54TYP LHY2043-1 10min) MIL-STD-202: hy 010 JISC7021 LA201 PDF

    smd code wKX

    Abstract: samsung nc110 samsung nc108 AR5112 TP2322 ELM7S08WS TP2320 smd zG sot 23 TP2323 GND194
    Contextual Info: [ Z zhtz|unGwyvwypl{hy€ Y X {opzGkvj|tlu{Gjvu{hpuzGjvumpklu{phs wyvwypl{hy€Gpumvyth{pvuG{oh{Gpz zhtz|unGlslj{yvupjzGjvNzGwyvwly{€U kvGuv{GkpzjsvzlG{vGvyGk|wspjh{lGmvyGv{olyz ljlw{GhzGh|{ovyplkGi€Gzhtz|unU k k jpjospk j i jw|GGGGGGaG ihuphzVkv{ohu j—GzŒ›GaG tjoTtGvkltR


    Original     		wziG2893-3017F ELM7S08WS 100nF MMBD41 PGB001 smd code wKX samsung nc110 samsung nc108 AR5112 TP2322 ELM7S08WS TP2320 smd zG sot 23 TP2323 GND194 PDF

    JISC7021

    Abstract: HY 1005
    Contextual Info: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L IG IT E K O FFIC E:7F.,N O .208,SEC.3,JH O N G YA N G Rd.,Tucheng City Taipei Hsien,Taiwan R.O.C TEL: 02 22677686(REP) FAX:(02)22675286,(02)22695616 LED ARRAY LA131B/HY DATA SHEET DOC. NO : QW0905-LA131/HY


    OCR Scan     		LA131B/HY QW0905-LA131 Apr-2004 54TYP LH2640-1 LY2640-1 sub103B 10min) JISC7021 HY 1005 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT266-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		SSOP20 OT266-1 OT266-1 PDF

    Contextual Info: December 2006 HYB18L512320BF-7.5 HYE18L512320BF-7.5 DRAMs for Mobile Applications 512-Mbit DDR Mobile-RAM Internet Data Sheet Rev.1.21 Internet Data Sheet HY[B/E]18L512320BF-7.5 512-Mbit Mobile-RAM Revision History: 2006-12-20, Rev. V1.21 All Updated Qimonda template


    Original     		HYB18L512320BF-7 HYE18L512320BF-7 512-Mbit 18L512320BF-7 changed2005-03-01 strength2004-09-13 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP8 package SOT530-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		OT530-1 OT530-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VSO40 package SOT158-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		VSO40 OT158-1 OT158-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP80 package SOT647-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		TSSOP80 OT647-1 OT647-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP16 package SOT403-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		TSSOP16 OT403-1 OT403-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VSO56 package SOT190-2 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		VSO56 OT190-2 OT190-2 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP10 package SOT552-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		TSSOP10 OT552-1 OT552-1 PDF

    Contextual Info: 14.3 u ri 1-• ■-■ h -._ ,— ■_ _ ,-,_ hY rV CO CNl SPECIFICATIONS: 1.RATING: 6VDC. 0.3A. 2.CONTACT RESISTANCE: 70m Q MAX. 3.INSULATION RESISTANCE: 500VDC-100M Q MIN. 4.WITHSTAND VOLTAGE: 500VAC-1 MINUTE 5.OPERATING FORCE: 200±150gf


    OCR Scan     		500VDC-100M 500VAC-1 150gf ffi10 10-100mm 100mm SS-LR4202 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP38 package SOT510-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		TSSOP38 OT510-1 OT510-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VSO56 package SOT190-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		VSO56 OT190-1 OT190-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA183 package SOT825-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		LFBGA183 OT825-1 OT825-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT640-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		TFBGA180 OT640-1 OT640-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT697-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		LFBGA180 OT697-1 OT697-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA596 package SOT635-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		HBGA596 OT635-1 OT635-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP32 package SOT358-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		LQFP32 OT358-1 OT358-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP44 package SOT803-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		QFP44 OT803-1 OT803-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP176 package SOT506-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		LQFP176 OT506-1 OT506-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT761-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		TFBGA72 OT761-1 OT761-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA329 package SOT714-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		HBGA329 OT714-1 OT714-1 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		LFBGA208 OT631-1 OT631-1 PDF