HY 2004 Search Results

hy 010

Abstract: JISC7021 LA201
Contextual Info: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LIGITEK O FFICE:7F.,NO.208,SEC.3,JHONGYANG Rd.,Tucheng City Taipei Hsien.Taiwan R.O.C TEL: 02 22677686(REP) FAX: (02)22675286, (02)22695616 LED ARRAY LA201W/HY DATA SHEET DOC. NO : QW0905-LA201W/HY REV.

smd code wKX

Abstract: samsung nc110 samsung nc108 AR5112 TP2322 ELM7S08WS TP2320 smd zG sot 23 TP2323 GND194
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JISC7021

Abstract: HY 1005
Contextual Info: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L IG IT E K O FFIC E:7F.,N O .208,SEC.3,JH O N G YA N G Rd.,Tucheng City Taipei Hsien,Taiwan R.O.C TEL: 02 22677686(REP) FAX:(02)22675286,(02)22695616 LED ARRAY LA131B/HY DATA SHEET DOC. NO : QW0905-LA131/HY

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT266-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: December 2006 HYB18L512320BF-7.5 HYE18L512320BF-7.5 DRAMs for Mobile Applications 512-Mbit DDR Mobile-RAM Internet Data Sheet Rev.1.21 Internet Data Sheet HY[B/E]18L512320BF-7.5 512-Mbit Mobile-RAM Revision History: 2006-12-20, Rev. V1.21 All Updated Qimonda template

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP8 package SOT530-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VSO40 package SOT158-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP80 package SOT647-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP16 package SOT403-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VSO56 package SOT190-2 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP10 package SOT552-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: 14.3 u ri 1-• ■-■ h -._ ,— ■_ _ ,-,_ hY rV CO CNl SPECIFICATIONS: 1.RATING: 6VDC. 0.3A. 2.CONTACT RESISTANCE: 70m Q MAX. 3.INSULATION RESISTANCE: 500VDC-100M Q MIN. 4.WITHSTAND VOLTAGE: 500VAC-1 MINUTE 5.OPERATING FORCE: 200±150gf

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP38 package SOT510-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VSO56 package SOT190-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA183 package SOT825-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT640-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT697-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA596 package SOT635-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP32 package SOT358-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP44 package SOT803-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP176 package SOT506-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT761-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA329 package SOT714-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste