LFBGA180 Search Results
LFBGA180 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
MO-205
Abstract: LFBGA180
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Original |
lfbga180ot697-1mo-205 | |
LFBGA180
Abstract: 11-90 MO-151 sot622
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Original |
lfbga180ot622-1mo-15111-90+1 | |
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Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT697-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
lfbga180ot697-1 | |
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Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 0.9 mm A B D SOT785-1 ball A1 index area A E A2 A1 detail X C e1 y1 C ∅v M C A B b 1/2 e e y ∅w M C T R P e N M L K J e2 H G 1/2 e F E D C B A ball A1 |
Original |
lfbga180ot785-1mo-205 | |
MO-205
Abstract: LFBGA180
|
Original |
lfbga180ot622-1out180mo-205 | |
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Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; 12 x 12 x 1 mm A B D SOT933-1 ball A1 index area E A2 A A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C P N M e L K J H e2 G 1/2 e F E D C B A ball A1 index area |
Original |
lfbga180ot933-1mo-205 | |
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Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT622-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
lfbga180ot622-1 | |
|
Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 1 mm B D SOT785-2 A ball A1 index area A2 A E A1 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C T R P e N M L K J H G F E D C B A ball A1 index area |
Original |
lfbga180ot785-2mo-205 | |
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Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C V U e T R P N M L e2 K J H 1/2 e G F E D C |
Original |
lfbga180ot697-1mo-205 | |
|
Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e b y y1 C ∅v M C A B ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1 |
Original |
lfbga180ot622-1ot6221mo-205 | |
MO-205
Abstract: sot785
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Original |
lfbga180ot785-1mo-205sot785 | |
MO-151
Abstract: sot697
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Original |
lfbga180ot697-1mo-151sot697 | |
ym 6631
Abstract: carrier ahu USB ethernet bridge usb to parallel IEEE1284 centronics diagram M1284H uart baud rate spear CP15 IEEE1284 MAC110 SPEAR-07-NC03
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Original |
spear-07-nc03arm720tieee80212mbit/s+14 | |
BF 178 TO-39 CASE connection
Abstract: bit3111 RWR-79 BAX22
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Original |
spear-07-nc03arm720tieee80212mbit/s+9 | |
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LDR 7MM
Abstract: blf 178 carrier ahu ARM720T CP15 IEEE1284 M1284H MAC110 SPEAR-07-NC03 SF 129 C
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Original |
spear-07-nc03arm720tieee80212mbit/s+13 | |