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    LFBGA180 Search Results

    LFBGA180 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    MO-205

    Abstract: LFBGA180
    Contextual Info: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C V U


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    lfbga180ot697-1mo-205 PDF

    LFBGA180

    Abstract: 11-90 MO-151 sot622
    Contextual Info: PDF: 2000 Jun 26 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 v M B b e ∅w M y y1 C v M A P N M e L K


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    lfbga180ot622-1mo-15111-90+1sot622 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT697-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    lfbga180ot697-1 PDF

    Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 0.9 mm A B D SOT785-1 ball A1 index area A E A2 A1 detail X C e1 y1 C ∅v M C A B b 1/2 e e y ∅w M C T R P e N M L K J e2 H G 1/2 e F E D C B A ball A1


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    lfbga180ot785-1mo-205 PDF

    MO-205

    Abstract: LFBGA180
    Contextual Info: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C P N


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    lfbga180ot622-1out180mo-205 PDF

    Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; 12 x 12 x 1 mm A B D SOT933-1 ball A1 index area E A2 A A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C P N M e L K J H e2 G 1/2 e F E D C B A ball A1 index area


    Original
    lfbga180ot933-1mo-205 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT622-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original
    lfbga180ot622-1 PDF

    Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 1 mm B D SOT785-2 A ball A1 index area A2 A E A1 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C T R P e N M L K J H G F E D C B A ball A1 index area


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    lfbga180ot785-2mo-205 PDF

    Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C V U e T R P N M L e2 K J H 1/2 e G F E D C


    Original
    lfbga180ot697-1mo-205 PDF

    Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e b y y1 C ∅v M C A B ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1


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    lfbga180ot622-1ot6221mo-205 PDF

    MO-205

    Abstract: sot785
    Contextual Info: PDF: 2002 Oct 02 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 0.9 mm A B D SOT785-1 ball A1 index area A E A2 A1 detail X C e1 e 1/2 ∅v M b e ∅w M y1 C C A B C y T R


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    lfbga180ot785-1mo-205sot785 PDF

    MO-151

    Abstract: sot697
    Contextual Info: PDF: 2001 May 04 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 B D A ball A1 index area E A A2 A1 detail X C e1 v M B b e ∅w M y y1 C v M A V U T R e P


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    lfbga180ot697-1mo-151sot697 PDF

    ym 6631

    Abstract: carrier ahu USB ethernet bridge usb to parallel IEEE1284 centronics diagram M1284H uart baud rate spear CP15 IEEE1284 MAC110 SPEAR-07-NC03
    Contextual Info: SPEAR-07-NC03 Ethernet Communication Controller with USB-Host Features • Based on ARM720T 8K Caches and MMU included ■ Support a 10/100 Mbits/s Ethernet connection (IEEE802.3) ■ Full-Speed USB Host Controller, supports 12Mbit/s Full Speed Devices ■


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    spear-07-nc03arm720tieee80212mbit/s+14115kbaudlfbga18012x12x1ieee128412x12mm25mhzym 6631carrier ahuusb ethernet bridgeusb to parallel ieee1284 centronics diagramm1284huart baud rate spearcp15mac110 PDF

    BF 178 TO-39 CASE connection

    Abstract: bit3111 RWR-79 BAX22
    Contextual Info: SPEAR-07-NC03 Ethernet Communication Controller with USB-Host Features • Based on ARM720T 8K Caches and MMU included ■ Support a 10/100 Mbits/s Ethernet connection (IEEE802.3) ■ Full-Speed USB Host Controller, supports 12Mbit/s Full Speed Devices ■


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    spear-07-nc03arm720tieee80212mbit/s+9115kbaudieee128425mhz48mhzlfbga180bf 178 to-39 case connectionbit3111rwr-79bax22 PDF

    LDR 7MM

    Abstract: blf 178 carrier ahu ARM720T CP15 IEEE1284 M1284H MAC110 SPEAR-07-NC03 SF 129 C
    Contextual Info: SPEAR-07-NC03 Ethernet Communication Controller with USB-Host Features • Based on ARM720T 8K Caches and MMU included ■ Support a 10/100 Mbits/s Ethernet connection (IEEE802.3) ■ Full-Speed USB Host Controller, supports 12Mbit/s Full Speed Devices ■


    Original
    spear-07-nc03arm720tieee80212mbit/s+13115kbaudlfbga18012x12x1ieee128412x12mm25mhzldr 7mmblf 178carrier ahucp15m1284hmac110sf 129 c PDF