TFBGA180 Search Results

TFBGA180

Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm D SOT570-2 A B ball A1 index area A A2 E A1 detail X C e1 e ∅v M C A B b 1/2 e P N M L K J H G F E D C B A ball A1

MO-195

Abstract: TFBGA180 TFBGA-180
Contextual Info: PDF: 2001 Jun 25 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 10 x 10 x 0.8 mm A B D SOT640-1 ball A1 index area A E A2 A1 C e1 1/2 e e detail X y y1 C ∅v M C A B b ∅w M C V U e T R P

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT640-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 1/2 e e ball A1 index area P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B

Contextual Info: Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls SOT570-3 A B D ball A1 index area E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b M M C C A B C y y1 C P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11

TFBGA180

Abstract: TFBGA-180 e 1220 sot570
Contextual Info: PDF: 2000 Nov 02 Philips Semiconductors Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm D SOT570-2 A B ball A1 index area A E A2 A1 detail X C e1 v M B y y1 C ∅w M b e v M A P N M L K J H G F E D C B A

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT570-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT570-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

MO-216

Abstract: SOT-57 TFBGA180 TFBGA-180
Contextual Info: PDF: 2003 Jul 17 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 1/2 e e ball A1 index area P N M L K J H G F

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT570-3 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm D SOT570-2 A B ball A1 index area A E A2 A1 detail X C e1 e y1 C ∅v M C A B ∅wM C b 1/2 e y P N e M L K J H e2 G F 1/2 e E D C B ball A1 index area A 1

MO-195

Abstract: TFBGA180
Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 10 x 10 x 0.8 mm A B D SOT640-1 ball A1 index area A E A2 A1 detail X C e1 e y y1 C ∅v M C A B b 1/2 e ∅w M C V U e T R P

Contextual Info: Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 10 x 10 x 0.8 mm A B D SOT640-1 ball A1 index area A E A2 A1 C e1 e V T P M K H F D B ball A1 index area detail X y y1 C ∅v M C A B b 1/2 e ∅w M C U e R N L e2 J

TFBGA180

Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 1/2 e e P N M L K J H G F E D C B A shape optional 4x

11-90

Abstract: TFBGA180 sot570
Contextual Info: PDF: 2000 Mar 08 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A P N M e L

intel date code marking NAND Flash

Abstract: ARMv5TE instruction set MLC nand 2012 153 ball eMMC memory flash controller usb state machine for ahb to apb bridge iNAND eMMC 4 41 emmc spi bridge emmc bga 162 LPC3130FET180
Contextual Info: LPC3130/3131 Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller Rev. 2 — 29 May 2012 Product data sheet 1. General description The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB 2.0 On-The-Go OTG , up to 192 KB SRAM, NAND flash controller, flexible external bus

TFBGA180

Abstract: 12MHz oscillator LPC2364 LPC2368 LPC2458 LPC2468 TFBGA100 TFBGA208 Future Designs
Contextual Info: SAB-TFBGAxxx SAB-TFBGAxxx Socket Adapter Boards for USB-ICP-LPC2K The SAB-TFBGAxxx Socket Adapter Boards extend the capability of our popular USB In-Circuit Programmer for NXP Semiconductors LPC2xx devices to allow the user to program and test these devices outside of their

LPC2000

Abstract: LPC2458 LPC2458FET180 TFBGA180 m81I
Contextual Info: LPC2458 Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface Rev. 02 — 25 November 2008 Product data sheet 1. General description NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bit

LPC9221

Abstract: embedded c code to interface lpc2148 with sensor P89V51RD2 microcontroller LPC2148 i2c with sensor LPC925 p89v51rd2 LPC700 LPC2148 p89v51rd2 development board lpc1754
Contextual Info: April 2009 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from

6800-compatible

Abstract: LPC2888 LPC2880 TFBGA180
Contextual Info: AN10549 Design rules and schematics for LPC288x Rev. 02 — 1 June 2007 Application note Document information Info Content Keywords LPC2888, LPC2880, design rules, application schematic Abstract This application note provides design rules and application schematics for

LPC2148 i2c eeprom c code

Abstract: lcd c program using lpc2378 LPC2468 embedded c code to interface lpc2148 with sensor LPC932A1 LPC922 LPC932A lpc921 lpc935 ac motor control LPC2378 instruction cache
Contextual Info: August 2008 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from

LPC24XX

Abstract: timer video tms 9937 LPC2478FBD208 mst 702 lf LPC2468 pcb LPC2478 ARM7TDMI motor driver ic 7324 LPC247x LPC2478 pcb LPC2468FBD208
Contextual Info: UM10237 LPC24XX User manual Rev. 04 — 26 August 2009 User manual Document information Info Content Keywords LPC2400, LPC2458, LPC2420, LPC2460, LPC2468, LPC2470, LPC2478, ARM, ARM7, 32-bit, Single-chip, External memory interface, USB 2.0, Device, Host, OTG, Ethernet, CAN, I2S, I2C, SPI, UART, PWM, IRC,

LCD Module intel 8080

Abstract: movinand nand flash SPI LPC3131 PC 3131 VIA ARM926EJ-S ARM926EJ-S emmc spi bridge ARM926EJ DATA SHEET OF ARM9
Contextual Info: D D R R R R A A A A A FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D R R A FT FT FT A A R R D D D Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller R R R D D D F FT FT A A Preliminary data sheet A Rev. 1.01 — 21 May 2009

LCD interface WITH ARM

Abstract: ARM microcontrollers data sheet ARM7TDMI-S external bus interface unit ALL DATA SHEET ARM v7 arm microprocessor data sheet ARM7 interfacing notes to LCD ARM7 microcontroller pin configuration block diagram of LCD interfacing with ARM7 LPC2880
Contextual Info: LPC2880; LPC2888 16/32-bit ARM microcontrollers; 8 kB cache, up to 1 MB flash, Hi-Speed USB 2.0 device, and SDRAM memory interface Rev. 03.01 — 30 January 2008 Product data sheet 1. General description The LPC2880/2888 is an ARM7-based microcontroller for portable applications requiring