| SOT570-1 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 180 balls |
Original |
PDF
|
248.67KB |
1 |
| SOT570-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT570-1 |
Original |
PDF
|
11.57KB |
1 |
| SOT570-2 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT570-2 |
Original |
PDF
|
11.56KB |
1 |
| SOT570-2 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 180 balls |
Original |
PDF
|
245.52KB |
1 |
| SOT570-3 |
|
NXP Semiconductors
|
thin fine-pitch ball grid array package; 180 balls |
Original |
PDF
|
236.6KB |
1 |
| SOT570-3 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT570-3 |
Original |
PDF
|
10.9KB |
1 |
| SOT572-1 |
|
NXP Semiconductors
|
Plastic low profile quad flat package; 100 leads; body 12 x 12 x 1.4 mm |
Original |
PDF
|
245.92KB |
1 |
| SOT573-1 |
|
NXP Semiconductors
|
Plastic quad flat package; 144 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm |
Original |
PDF
|
245.3KB |
1 |
| SOT573-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT573-1 |
Original |
PDF
|
11.49KB |
1 |
| SOT574-1 |
|
NXP Semiconductors
|
Plastic thin quad flat package; 128 leads; body 14 x 14 x 1 mm |
Original |
PDF
|
244.81KB |
1 |
| SOT576-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced quad flat package;160 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height; heatsink |
Original |
PDF
|
239.14KB |
1 |
| SOT577-2 |
|
NXP Semiconductors
|
Plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm) |
Original |
PDF
|
235.2KB |
1 |
| SOT578-1 |
|
NXP Semiconductors
|
Plastic Triple-bent-SIL power package; 13 leads (lead length 7.7 mm) |
Original |
PDF
|
235.45KB |
1 |
| SOT579-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT579-1 |
Original |
PDF
|
11.54KB |
1 |
